Mobile has emerged as the biggest platform in the history of mankind. Today, the Qualcomm Snapdragon platform is much more than a phone, according to Dr. Sandeep Sibal, country manager and VP – Business Development, Qualcomm India & South Asia.
For instance, there are 40 million mobile Internet users in India. There is a strong demand for data from tier 2 and 3 cities. There are said to be 28 million Facebook users, of which, 30 percent are mobile. About 20 photos uploaded every second, and mobile users are 2x times more active.
Qualcomm boasts of an unparallelled system integration, as having the best-in-class assets is now a key advantage. The benefits of integration include lower system costs, less engineering and faster time to market — over 745 devices launched in fiscal 2010, smaller footprint — about 10-20 percent smaller, and power efficiency — up to 35 percent better.
As for the roadmap breadth and execution, already, over a 100+ commercial devices have been announced that use Snapdragon. There are said to be 200+ more in design, and 30 companies with tablet designs are deemed underway. Snapdragon currently powers eight tablet models.
Snapdragon processors — what’s coming!
Snapdragon QSD 8×50 is the world’s first mobile processor at 1GHz. It features the Scorpion Core, Adreno 200 GPU, 3G connectivity and 720p HD video capture and playback. Snapdragon MSM 8×55 is said to be the world’s first mobile single core at 1.4GHz. It features a single Scorpion CPU 1.4GHz, Adreno 205 GPU, 1024×768/720p/Dolby 5.1, stereoscopic 3D capture and playback, app proc only available, and supports a comprehensive range of 3G.
The Snapdragon asynchronous dual and quad core family consists of the Snapdragon MSM 8×60. It features dual Scorpion CPU of 1.5GHz each, asynchronous cores, Adreno 220 GPU, HD 1080p capture and playback, Dolby 5.1, stereoscopic 3D capture and playback, and a comprehensive range of 3G. Read more…
This is a summary by Malcolm Penn, CEO, Future Horizons. For those who wish to know more, please get in touch with me.
November’s WSTS results were distorted by a billion dollar downgrade (restatement) to the year-to-date numbers. These things do happen from time to time, but one of this size quite rare.
The overall impact was to reduce the year to date market by around half a percent; not so bad per se but, due to its leverage, it reduced the overall year-on-year market growth by a couple of percentage points!
As a result we have downgraded our 2010 forecast to (a still very reasonable) 30 percent. This falls into the category of ‘tweaking the final number’ though … it is not a change to our underlying forecast sentiment or outlook.
Re-statements aside, what then for the outlook for 2011?
Looking at our four horsemen of the semiconductor apocalypse:
1. Economy – grew ~4.8 percent in 2010 (IMF) and is forecast to grow 4.2 percent in 2011.
2. Capacity – effectively sold out; with Cap Ex spending now flat and the book-to-bill below parity.
3. ASPs – have been increasing now since Q2-2009 … six quarters in a row.
4. IC units – are in a ‘steady as you go’ mode with NO excess inventory and NO excess capacity to build any.
In short, whereas this time last year the problem was getting any orders, the problem today is getting semiconductor product. The chip market fundamentals really do not get any better than this, yet industry pessimism it at its highest since the Lehman Brothers collapse.
What concerns us is the industry perception that moving from a 30 percent growth year to single digits in 2011 heralds yet another classic chip market boom turned to bust. It does not.
The same is true everywhere you now look in the food chain … few people or firms will commit anything to any one beyond the immediate deal; business is now turn’s driven, not for strategic long-term vision or gain.
The current Mexican standoff in the 450mm wafer transition debacle is another industry supply chain mismanagement example, with the chip industry saying ‘yes please’ and the equipment suppliers saying ‘no thanks’. Yet where is the SIA and SEMI in this debate? Siding with their members rather than orchestrating a solution.
Likewise, who in the infrastructure is counting and measuring real industry demand? The WSTS in its (lack of) wisdom stopped publishing orders, and the associated book-to bill, data several years ago, despite the latter being one of the key original measurement tools when the system was created under the directionof data visionary Jack Beadle (then with Motorola).
Needless to say it was dropped for all the wrong reasons … to try to keep the financial community offindustry’s backs. As a result, the industry now has no structured order visibility!
Entering 2011 we thus see the industry fundamentals in especially good shape, a fact that can clearly be seen if you redraw the graphs to take out the ‘data crash’ caused by the Lehman Brothers collapse.
* Continuing Cap Ex famine, despite 2010’s 140 percent Cap Ex spending growth.
* Falling Cap Ex book to bill (since August 2010) now less than 1 (December).
* Six successive quarters of flat industry capacity, cruising well below excess capacity threshold levels.
* Supply-chain mismanagement; no trust, no confidence, no commitment … no business?
* Shortages everywhere … from substrates (e.g. 200mm wafers), equipment (try buying an immersion stepper or single wafer epi reactor), to lead frames (especially given the desire to move from gold to copper-based packaging).
* Industrial and automotive products now completely sold out … even memories are starting to get tight.
Do not be misled by the single digit growth number … 2011 will be a very strong year for the chip industry. 2012 will be a double-digit boom.
I was watching US president Barack Obama deliver the state of the union address. There was lot of positiveness. First, he urged the Congress to get together and pursue a bipartisan, market-based solution to climate change. He called for the nation to embrace the need for modest reforms in medical healthcare.
The USA’s first priority is making America a magnet for new jobs and manufacturing. After shedding jobs for more than 10 years, the US manufacturers have added about 500,000 jobs over the past three years. Caterpillar is bringing jobs back from Japan. Ford is bringing jobs back from Mexico. And this year, Apple will start making Macs in America again. That should great news for the Americans!
Following the first manufacturing innovation institute in Youngstown, Ohio, Obama announced the launch of three more manufacturing hubs, where businesses will partner with the Department of Defense and Energy to turn regions into global centers of high-tech jobs. He asked the Congress to help create a network of 15 hubs and guarantee that the next revolution in manufacturing is made in America.
America, he said, was poised to control its energy future. The US has doubled the amount of renewable energy generated from sources like wind and solar — with tens of thousands of good American jobs to show for it. He urged the Congress to pursue a bipartisan, market-based solution to climate change.
Four years ago, other countries dominated the clean energy market and the jobs. Last year, wind energy added nearly half of all new power capacity in America. He called to generate even more. Solar energy gets cheaper by the year — there’s a need to drive down costs even further! He urged the US to keep going all in on clean energy, like China. Obama added that those states with the best ideas to create jobs and lower energy bills by constructing more efficient buildings will receive federal support to help make that happen.
The initiatives in manufacturing, energy, infrastructure, housing — will help entrepreneurs and small business owners expand and create new jobs. However, none of it will matter unless the US equips citizens with the skills and training to fill those jobs. That has to start as early as possible, he urged!
Obama has signed a new executive order that will strengthen USA’s cyber defenses by increasing information sharing, and developing standards to protect national security, jobs, and privacy. He called upon the Congress to pass legislation that would give the government a greater capacity to secure USA’s networks and deter attacks.
As Obama said during his speech, “The greatest nation on Earth cannot keep conducting its business by drifting from one manufactured crisis to the next!” Can India, at least, learn?
How will the global semiconductor industry perform in 2013? After a contrasting spell of predictions for 2012, I see no change in 2013! So, what’s the answer to the million-dollar question posed as my headline?
After a disappointing and challenging 2012, global semiconductor executives believe that the worst is nearly behind them, and they are making investments to position their companies for a sustained, broad-based, multi-year recovery in 2013, as per a KPMG global semiconductor survey.
On Feb. 3, the Semiconductor Industry Association (SIA) announced that worldwide semiconductor sales for 2012 reached $291.6 billion, the industry’s third-highest yearly total, ever but a decrease of 2.7 percent from the record total of $299.5 billion set in 2011. Total sales for the year narrowly beat expectations from the World Semiconductor Trade Statistics (WSTS) organization’s industry forecast.
The World Semiconductor Trade Statistics (WSTS) estimated that the global semiconductor market in 2012 will be $290 billion, down 3.2 percent from 2011, followed by a recovery of positive 4.5 percent growth to $303 billion in 2013.
The worldwide semiconductor revenue is projected to total $311 billion in 2013, a 4.5 percent increase from 2012 revenue, according to Gartner Inc. The worldwide semiconductor revenue totaled $298 billion in 2012, a 3 percent decline from 2011 revenue of $307 billion, according to preliminary results by Gartner.
The outlook for the global semiconductor industry in 2013 will likely be 7.9 percent, according to Future Horizons. It means, the industry will likely grow to $315.4 billion in 2013. The Cowan LRA foreasting model put out the following sales and year-on-year sales growth numbers for 2012 and 2013: $292.992 billion (-2.2 percent) and $309.244 billion (+5.5 percent), respectively.
Databeans expects 2013 will see a rebound, with the semiconductor industry growing by 7 percent from 2012 totals to reach $313.04 billion. IDC forecasted that the worldwide semiconductor revenues will grow 4.9 percent and reach $319 billion in 2013.
IHS iSuppli claimed that the semiconductor silicon revenue will close 2012 at $303 billion, down 2.3 percent from $310 billion in 2011. The projected decline comes in contrast to the 1.3 percent gain made last year.
IC Insights forecasted 6 percent IC unit growth for 2013 based on expectations of global GDP to rise to 3.2 percent. According to IC
Insights, in 2017, China is expected to represent 38 percent of the worldwide IC market, up from 23 percent, 10 years earlier in 2007. Does this mean the USA and Europe are loosing their sheen?
The global semiconductor industry may record only 1.5 percent growth In 2013, as per The Infornation Network. There is, however, the possibility for a snap-back in revenues for 2013, irrespective of macroeconomic factors, such as what occurred in 2010.
Over the next three years, industry analysts estimate the global industry will grow approximately 6 percent 2013-2016 CAGR, according to Somshubro Pal Choudhury, managing director, Analog Devices India Pvt. Ltd.
Late 2012, I was speaking with Dr. Wally Rhines, chairman and CEO, Mentor Graphics. He said: “After almost no growth in 2012, most of the analysts are expecting improvement in semiconductor market growth in the coming year. Currently, the analyst forecasts for the semiconductor industry in 2013 range from 4.2 percent on the low side to 16.6 percent on the high side, with most firms coming in between 6 percent and 10 percent. The average of forecasts among the major semiconductor analyst firms is approximately 8.2 percent.”
WSTS also anticipates the world market to grow 5.2 percent to $319 billion in 2014, with healthy mid single digit growth across most of geographical regions and semiconductor product categories, supported by the healthier economy of the world.
Lastly, Forbes said that 2013 will be a turning point for the global semiconductor market.
It always gives me great pleasure chatting with Dr. Walden (Wallly) C. Rhines, chairman and CEO, of Mentor Graphics, and vice chairman of the EDA Consortium, USA. 2013 is just round the corner. What lies ahead for the global semiconductor industry is a question on everyone’s lips! How will the EDA industry do next year? For that matter, what should the Indian semiconductor industry look forward to next year?
Three trends for 2013
First, I asked Dr. Wally Rhines regarding the trends in the global semiconductor industry. He cited:
* Growth in communication ICs.
* Growth in the third dimension.
* Accelerated design activity at the leading edge.
Growth in communication ICs: On the macro level, silicon area shipments continue to grow gradually, as do semiconductor unit shipments. However, there’s a major shift in application segments from computing to communications. Communications used to be only one third the size of computing in terms of semiconductor usage.
Communications are expected to surpass computing in terms of semiconductor consumption by 2014 thanks to the rapid growth of wireless applications, the incorporation of computing into communications devices like smart phones and the addition of communications to computing devices like tablet computers.
Growth in the third dimension: Shrinking feature sizes and growing wafer diameters will continue to contribute to the annual 30 percent decrease in the average cost per transistor and average 72 percent unit growth of transistors, but they will do so at a diminished rate. Fortunately, other avenues are emerging that can help sustain the semiconductor industry’s remarkable rate of growth. One largely untapped opportunity is in the third dimension, i.e. growing vertically instead of shrinking in the XY plane.
DRAM stacks of eight or more die are already possible, although they are still more expensive on a cost per bit basis compared to unstacked devices. Complex packaged systems made up of multiple heterogeneous die, memory stacked on logic and interposers to connect the die are evolving rapidly. Layers in the IC manufacturing process continue to increase as well.
Accelerated design activity at the leading edge: Another interesting trend is the recent surge in capital spending among foundries to add capacity at the leading edge. This wave of spending will result in excess capacity, at least initially, which may force foundries to lower prices to boost demand. In fact, capacity utilization data in the last few months shows a dramatic decline in utilization at 28/32nm and 22nm nodes, suggesting that excess capacity is already happening to an extent.
While differences in 28 and 20nm processes—such as double patterning—create challenges, the existing capital equipment is largely compatible with both processes. Such a high volume of wafers and the large available capacity will lead to increasingly aggressive wafer pricing over time. As a result, cost-effective wafers from foundries will encourage totally new designs that would not have been possible at today’s wafer cost.
Industry outlook 2013
So, how is the outlook for 2013 going to shape up? Dr. Rhines said: ”After almost no growth in 2012, most analysts are expecting improvement in semiconductor market growth in the coming year. Currently, the analyst forecasts for the semiconductor industry in 2013 range from 4.2 percent on the low side to 16.6 percent on the high side, with most firms coming in between 6 percent and 10 percent. The average of forecasts among the major semiconductor analyst firms is approximately 8.2 percent.
“However, most semiconductor companies are less optimistic in their published outlooks. This seems to be influenced by the level of uncertainty that exists because of unknown government actions and market conditions in the US, Europe and China.”
Any more consolidations?
It would be interesting to hear Dr. Rhines’ opinion on any further consolidations within the industry. He said: “It is common misperception that the semiconductor industry is consolidating. A closer look at the data shows that the semiconductor industry has been doing the opposite. It has been DE-consolidating for more than 40 years.
“Take the #1 semiconductor supplier, Intel. Intel’s market share is the same today as it was a decade ago. And, the combined market share of the top five semiconductor suppliers has been slowly declining since the 1960s. Similar trends also apply to the top ten and top 50—both are the same or lower than they were a decade, as well as decades, ago. In fact, the combined market share of the top 50 semiconductor companies has decreased 11 points in the last 12 years.
According to Yole Developpement, France, the number of devices packaged with ‘fan-in WLCSP will exceed 25 billion units in 2012, exceeding more than 2 million 300mm equivalent wafers. Yole recently held a seminar on wafer level chip scale package (WLCSP).
Yole estimates the fan-in WLCSP industry value to be over $1.9 billion in 2012. This includes wafer level services (including test) and die level services, as well as the service margin. This market value is expected to keep on growing at a 2010-2016 CAGR of 12 percent, despite decreasing prices. However it does not grow equally across all device types.
The use of fan-in WLCSP for a given application tends to be more and more standardized: it is now clear, for example, that the penetration rate of fan-in WLCSP for connectivity devices in handsets is close to 100 percent, while some players still proposed QFN or BGA solutions a couple of years ago for this same application.
The maximum die size increased recently, and it is now common place to find 36mm² fan-in WLCSP devices in smartphones and tablets. The world record is 50mm² with 309 balls. Any fan-in WLCSP device larger than 4mm in side needs to be underfilled on the PCB. According to Yole, fan-in WLCSP is a maturing technology and market. It still grows faster than the average semiconductor packaging market mainly thanks to the fast growth rates of smartphones and tablet PCs in which WLCSP considerably helps save space and costs. Read more…
LG has introduced the Optimus Sol E730 smartphone in India. Packed with loads of features the phone runs on the Android OS, v2.3.4 (Gingerbread), and uses a Qualcomm MSM8255 Snapdragon processor. It supports GSM 850/900/1800/1900 MHz, as well as HSDPA 900/2100 MHz. Measuring a sleek 122.5×62.5×9.8mm, it weighs about 110g. The ultra AMOLED capacitive touchscreen supports 256K colors. The panel is 480 x 800 pixels and 3.8 inches (~246 ppi pixel density).
Some other significant features include: Corning Gorilla Glass protection, card slot microSD, up to 32GB, 2GB memory included, with internal memory worth 1 GB storage, 2 GB ROM and 512 MB RAM. For data, it uses GPRS Class 10 (4+1/3+2 slots), 32-48 kbps amd EDGE Class 10, 236.8 kbps. Speed offered by the LG Optimus Sol E730 include HSDPA, 7.2 Mbps; HSUPA, 2.9 Mbps. For WLAN users, there is support for Wi-Fi 802.11 b/g/n, Wi-Fi Direct, Wi-Fi hotspot, DLNA, etc.
The phone comes with a 5MP camera, which however, pales, (as would many other released and to be launched mobile smartphones) when compared to the recently announced Nokia 808 PureView that has 41MP sensor with high-performance Carl Zeiss optics and new pixel oversampling technology.
Some of the camera features in the LG Optimus Sol E730 include geo-tagging and face detection. Again, videos can be made using the 720p@30fps capability, which otherwise dwarfs against the Nokia 808 PureView’s full HD 1080p video recording and playback with 4X lossless zoom and the world’s first use of Nokia Rich Recording.
Well, this phone too does not have a stylus! Actually, all or most of the Android OS based smartphones are coming without the stylus, and one wonders why! The phone uses a standard Li-Ion 1500 mAh battery, with stand-by time of up to 100 hours and talk time up to 4 hours.
As for the applications or apps, they are all standard now on smartphones! Even the LG Optimus Sol E730 is packed with loads! Besides the regular ones — such as Alarm/Clock, Browser, Camera, Contacts, E-mail, Facebook, FM Radio, GMail, Google Search, Maps, Messaging, Music, News and Weather, there are some new ones as well. For instance, SmartShare alllows you to play and share content from any wireless device via this mobile phone. It requires Wi-Fi settings to operate.
The LG Optimus Sol was priced at Rs. 19,000 at the time of release.
CES 2012 is just around the corner! Let us look at some trends.
First, according to Ovum, the ultrabook is shaping up to be a CES 2012 show stopper. It is expected that 20-40 devices will be introduced. There will be more of mobile connecrted devices, which are likely to be more app friendly, have brighter screens and offer intuitive user interfaces. TV manufacturers are expected to demonstrate capabilities of “smart” TVs.
According to Accenture, another big story is likely to be the TV market. The market is challenged by the fact that consumers are planning to buy fewer TVs next year, according to Accenture’s new survey of 10,000 consumers in 10 countries.
Consumers are also watching TV on TV screens less often, and say they are especially disinclined to buy TV sets until prices decline. The battle is on for consumers eyeballs and attention among the multitude of screens such as desktop and laptop PCs, smartphones and tablets. There will be a push to find more innovative ways to make TV content on TV screens more compelling involving cloud and online services.
Accenture also believes ultrabooks will be a big story at CES 2012. This is a promising product category because these are highly powerful yet thin and portable computers. Tablets and smartphone markets are continuing to grow, but the ultrabook market poses a threat to both.
Among the biggies, Samsung Electronics Co. Ltd launched the Samsung AdHub advertising platform for Samsung Smart TV platform. Through the newly-announced AdHub service, brands can deliver 3D, video and interactive advertisements into the living room via Samsung’s market-leading Smart TVs. China’s Haier will display connected televisions as well as key new design features and introduce the expanded line of audio solutions.
Elsewhere, dbx-tv announced Total Cal, an audio measurement and calibration tool that custom-optimizes sound quality from TVs, regardless of speaker size or price point.
VoiceBox Technologies Inc. has entered into a strategic agreement with Toyota Motor Sales (TMS) USA, Inc. to develop innovative in-car voice products and capabilities. Quantenna Communications will showcase 802.11n MIMO technology optimized for service providers and 802.11ac chipset for retail applications. Alereon Inc. is demonstrating high-speed wireless connectivity from Android-based smartphones and tablets to integrated wireless monitors/docks as well as HDTVs.
The Mobile500 Alliance has unveiled a breakthrough end-to-end solution that will enable its member broadcasters to build new revenue streams through Mobile DTV (MDTV). The goal is to make the solution available to Alliance member companies after beta launch and evaluation in Seattle, USA.
Two Bosch Group companies, Bosch Sensortec and Akustica, will be jointly showcasing their consumer MEMS products. While, Qualcomm Innovation Center Inc. (QuIC), a wholly owned subsidiary of Qualcomm, is expected to launch the Snapdragon GameCommand application to the Android market on January 10, 2012, the opening day of the CES.
Texas Instruments Inc. (TI) hosts an OMAP4470 processor-based tablet running on a pre-release version of Windows 8 at the 2012 Consumer Electronics Show, demonstrating how the latest OMAP 4 platform distinctly supports Microsoft’s new computing experience, Windows 8, that reimagines Windows. And, Sensible Vision, the leading supplier of face authentication software, will demonstrate its face recognition app for iOS and Android mobile devices at the CES 2012 Wall of Apps. FastAccess Anywhere securely replaces passwords with a face to quickly and conveniently log in to apps and web sites on mobile devices.
Toshiba America Electronic Components Inc. (TAEC), will be demonstrating the latest additions to its lineup of flash memory offerings – the TransMemory-EX series of USB flash memory products. The new drives are compliant with the new USB 3.0 standards – known as Super Speed USB. Initial storage capacities include a 32GB model and a 64GB model.
Qualcomm MEMS Technologies Inc. and The Shanghai Nutshell Electronic Co. Ltd, a subsidiary of Shanda Networking Co. Ltd, China’s largest interactive digital content provider, announced the first e-reader featuring mirasol display technology, the Bambook Sunflower, to be commercially available in China in the coming weeks.
The latest figures from GfK Digital World, in partnership with Consumer Electronics Association (CEA), reveal global spending on consumer technology devices will surpass $1 trillion in 2012 for the first time, increasing by 5 percent over 2011’s figure of $993 billion.
These are just a few of the multiple trends one can expect at this year’s CES!