Wow! Yesterday, Synopsys signed a definitive agreement to acquire Magma Design Automation Inc. This news is interesting, and not surprising. This acquisition seemed to be on the cards, but at least, not so soon. Nevertheless!
So, that leaves Synopsys, Cadence and Mentor Graphics as the big three EDA vendors, now that Magma has been acquired.
Just a couple of months back, I was in discussion with Rajeev Madhavan, chairman and CEO, Magma, regarding Silicon One technology solutions on the sidelines of MUSIC India. Magma had outlined five technologies: Talus, Tekton, Titan, FineSim and Excalibur and expected to have the opportunity to be a dominant yield management company.
Where has all of this gone, one wonders! It can safely be assumed that the Silicon One series can very well go on, now under the guidance of Synopsys. However, it will only add up to boosting the revenues of Synopsys in the long run.
Some time ago, one thought that the EDA industry was having four big players. Now, there are three. In between, there was news such as Cadence trying to acquire Mentor Graphics, which did not happen. Even Magma seemed to be doing fine, at least, till 2006-07.
Thereafter, it has been a slightly different story, with not only the CEO leaving Magma India, and some changes in the Indian management team, as well as certain MUSIC India events with less attendances, and so on. One can accept these as the part and parcel for any industry/organization.
On Magma’s website, there is a statement from Madhavan, which says: “Magma and Synopsys have always shared a common goal of enabling chip designers to improve performance, area and power while reducing turnaround time and costs on complex ICs,” said Rajeev Madhavan, CEO of Magma. “By joining forces now we can ensure that chip designers have access to the advanced technology they need for silicon success at 28, 20 nanometer and below.”
All the best to both Synopsys and Magma!
Presenting the excerpts from the welcome address by Debasish Paul Choudhury, president, SEMI India, at the ongoing Solarcon India 2011, being held in Hyderabad.
This year’s show features a larger exhibition, a three-day dual track conference, and will feature three concurrent technical programs. The theme for this year’s exposition, representing the widening solar value chain in India, is “Showcasing the Solar Eco‐System: From Polysilicon to Power Plants.”
The exhibition with over 115 exhibitors from eight countries, compared to 81 exhibitors in SOLARCON India 2010, covers the entire solar value chain, will provide you an opportunity to see a wide range of new products and services offered by Indian and international companies, under one roof.
This year’s show, as many of you are aware, is certified by the US Department of Commerce (US DOC), and features an exclusive US Pavilion with 14 leading US companies participating in the exhibition. I am also delighted to welcome a 35-member Clean Tech Delegation led by the USA’s Under Secretary of Commerce for International Trade, Francisco J. Sanchez to the show.
I am delighted to have in our midst two other distinguished guests – Dr. Bharat Bhargava, director – Photovoltaics, Ministry of New & Renewable Energy, Government of India, who is widely credited to be the architect of the India’s National Solar Mission. In the same vein, I am happy to welcome Jim Brown, president, Utility Systems Business Group, First Solar Inc., the world’s largest thin film module manufacturer, with us this morning.
Featuring more than 70 speakers drawn from the industry, academia and government, the conference is themed “Charting India’s Roadmap to Solar Leadership — Translating Potential into Reality.” The conference attracts high-profile participation of solar energy leaders from all segments of the industry supply chain, academia and governments from India and around the world.
The three-day conference also includes an LED Lighting summit, co-organized with Frost & Sullivan, which will focus on SSL (solid state lighting) technology with speakers from among LED manufacturers, LED suppliers, researchers and others.
The climate in which we are holding the show this year has not been without its challenges – on two fronts: the events in Hyderabad on the one hand (which have now, we are grateful to all parties involved, returned to complete normalcy) and the considerable stress that the solar industry is under due the slowdown in the European economies, regulatory changes in the major solar markets and manufacturing over capacity resulting in a fall in PV system prices over the last two to three quarters.
This show and the support it has received are proof that the long term prospects for the solar industry remain most bright in India.
Early this month, STMicroelectronics and Freescale Semiconductor introduced a new dual-core microcontroller (MCU) family aimed at functional safety applications for car electronics.
These 32-bit devices help engineers address the challenge of applying sophisticated safety concepts to comply with current and future safety standards. The dual-core MCU family also includes features that help engineers focus on application design and simplify the challenges of safety concept development and certification.
Based on the industry-leading 32-bit Power Architecture technology, the dual-core MCU family, part-numbered SPC56EL at ST and MPC564xL at Freescale, is ideal for a wide range of automotive safety applications including electric power steering for improved vehicle efficiency, active suspension for improved dynamics and ride performance, anti-lock braking systems and radar for adaptive cruise control.
The Freescale/STMicroelectronics joint development program (JDP) is headquartered in Munich, Germany, and jointly managed by ST and Freescale.
The JDP is accelerating innovation and development of products for the automotive market. The JDP is developing 32-bit Power Architecture MCUs manufactured on 90nm technology for an array of automotive applications: a) powertrain, b) body, c) chassis and safety, and d) instrument cluster.
STMicroelectronics’ SK Yue, said: “We are developing 32-bit MCUs based on 90nm Power Architecture technology. One unique feature — it allows customer to use dual core or single core operation. The objective of this MCU is to help customers simplify design and to also reduce the overall system cost.
On the JDP, he added: “We will have more products coming out over a period of time. This JDP is targeted toward automotive products.”
Commenting on the automotive market today, he said that from June onward, the industry has been witnessing a gradual sign of recovery coming in the automotive market.
Automotive market challenges
There has been an increasing integration and system complexity. These include:
* Increasing electrification of the vehicle (replacing traditional mechanical systems).
* Mounting costs pressure leading to integration of more functionality in a single ECU.
* Subsequent increase in use of high-performance sensor systems has driven increased MCU performance needs.
There are also increasing safety expectations. Automotive system manufacturers need to guarantee the IEC61508 (SIL3) and ISO26262 (ASILD) system-safety capability. Also, a move from passive to active safety is increasing the number of safety functions distributed in many ECUs.
Finally, there is a continued demand for quality — in form of zero defects, by which, a 10x quality improvement is expected.
MCU family addresses market challenges
The MCU family offers exceptional integration and performance. These include: high-end 32-bit dual-issue Power Architecture cores, combined with comprehensive peripheral set in 90nm non-volatile-memory technology. It also provides a cost effective solution by reducing board size, chip count and logistics/support costs.
It also solves functional safety. The Functional Safety architecture has been specifically designed to support IEC61508 (SIL3) and ISO26262 (ASILD) safety standards. The architecture provides redundancy checking of all computational elements to help endure the operation of safety related tasks. The unique, dual mode of operation allows customers to choose how best to address their safety requirements without compromising on performance.
The MCU also offers best-in-class quality. It is design for quality, aiming for zero defects. The test and manufacture have been aligned to lifetime warranty needs.
The MCU family addresses the challenges of applying sophisticated safety concepts to meet future safety standards. Yue added, “There are two safety standards — we are following those guidelines.” These are the IEC61508 (SIL3) and ISO26262 (ASILD) system-safety capabilities.
The automotive industry is also targeting for zero defects. “Therefore, all suppliers in tier 1 and 2 need to come up with stringent manuyfaturing and testing process that ensures zero defects,” he said.
32-bit dual-issue, dual-core MCU family
Finally, why dual core? Yue said that the MCU helps customers to achieve to achieve safety and motor control. Hence, dual core will definitely help deliver results.
“In many automotive applications, especially in safety-related applications, we want to have redundancy for safety. In the lock-step mode, two cores run the same task simultaneously, and results are then compared to each other in every computation. If the results are not matched, it indicates that there are some problems.”
This MCU family definitely simplifies design. It uses a flexible, configurable architecture that addresses both lock-step and dual parallel operation modes on a single dual-core chip. Next, it complies with safety standards.
A redundant architecture provides a compelling solution for real-time applications that require compliance with the IEC61508 SIL3 and ISO26262 ASIL-D safety standards. It also lowers the systems cost.
Dual-core architecture reduces the need for component duplication at the system level, and lowers overall system costs.
Recently, MindTree launched its Intelligent Video Surveillance System (IVSS). Though it seems to be a bit late in the market, the solution has tremendous potential.
Video surveillance globally is said to be a $13 billion market. In India, there has been a huge budget allocation for security worth Rs. 33,000 crores. According to MindTree, its focus is on intelligence, and that would be the company’s differentiator in the years to come.
Technology drivers for such devices include — a move from analog to IP; from networked to distributed; intelligence and analysis; use of allied technologies and standardization.
According to MindTree’s Sharmila Saha, the company wants to become an end-to-end solution provider. Its main value proposition is to bring management and analytics into all of its solutions. MindTree also has a enterprise ready hybrid product that supports both analog and IP cameras. It is starting ready to manufacture/IP licensing products.
Commenting on typical IVSS market and its characteristics, she said these included:
* public infrastructure, defence, educational institutions, etc.,
* financial institutions, retail, enterprise and home,
* server-based storage (networked video recording), and
* server based analytics.
MindTree’s differentiators are said to be the following: video analytics — the solution allows searching metadata, bandwidth management, security managenent — including tamper detection, video watermarking and secure transmission of data; and deployment — MindTree is also going standard compliant, supports multi-vendor devices, and offers customizable solutions.
Let us take a look at some of the features of MindTree’s solutions. Users can certainly do PTZ remotely, and also set camera in the patrol mode. Digital zoom is yet another feature. Image detection is done at 30fps. Image stiching is yet another feature available.
Searches can be done based on both time and data. There is also an events browser. Schedule recording can be performed by setting certain rules. H.264 is used for compressing images. MindTree has also built in face detection and face recognition as part of its video algorithms, besides Virtual TripWire.
S. Janakiraman, President and Group CEO, Product Engineering Services, pointed out that several other algorithms are being developed at the Indian Institute of Science, Bangalore. Another algorithm — image stitching — has been developed by MindTree.
The company is filing the patent for image stitching, as well as for face detection. MindTree can control the storage and network costs since its own algorithms are being used. According to him, the company is in talks with the defence, etc.
MindTree’s network surveillance system helps an existing analog surveillance system to migrate to a centralized and IP based video surveillance system while still exploiting the investment on the analog infrastructure.
Built modularly, the IVSS comprises of multiple components that can also be used individually to increase operational efficiency. OEMs can leverage the reference design from MindTree for creating their own hybrid DVRs and system integrators can use the ready-to-fit solution accelerators and components to provide more robust and flexible surveillance systems to end customers.
IVSS key components
* Digital Video Recorder (DVR)
* Network Video Recorder (NVR)
* Video Management Solution (VMS)
* Video Analytics Algorithms Suite (VAAS)
* Analog-to-IP Encoders
* Smart IP Cameras
Key features of IVSS system:
* Video analytics with distributed intelligence to trigger specific actions on alerts and alarms.
* Intelligent video mining to extract valuable information from raw feed quickly and efficiently.
* Bandwidth management to reduce IP bandwidth requirements for feed transmission.
* Single management station that is scalable for future requirements.
* Reliable alarm management that is configurable for any event.
* Multi-camera tracking for specific objects through multiple cameras.
* Enhanced security features including watermarking and tamper protection.
BANGALORE, INDIA: Texas Instruments Inc. (TI) recently introduced a dual, 14-bit analog-to-digital converter (ADC), the ADS62P49, at 250MSPS to deliver a premier combination of wide signal bandwidth, high dynamic performance and low power consumption.
The ADS62P49 achieves 73-dBFS signal-to-noise (S/N) ratio and 85-dBc spurious-free dynamic range (SFDR) at an input frequency of 60 MHz. I was able to catch up with Apoorva Awasthy, Business Development Manager, High Performance Analog, Texas Instruments India, to find out more about this new 14-bit ADC.
Chief features of TI 14-bit ADC
Texas Instruments (TI) has united speed and efficiency with the industry’s fastest dual, 14-bit ADC at 250 MSPS. Key features of this device include:
* It delivers a premier combination of wide signal bandwidth, high dynamic performance and low power consumption;
* Fastest dual, 14-bit ADC at 250MSPS enables multi-channel, wide-bandwidth sampling without sacrificing dynamic performance, for enhanced accuracy in portable test equipment;
* Low power of 625 mW per channel reduces thermal footprint for increased system efficiency in high-density, multi-antenna base station receivers and software defined radios;
* Programmable gain and other user-selectable settings maximizes design flexibility;
* Complete signal chain with comprehensive evaluation tools suite speeds time to market; and
* It is first in a series of four 12- and 14-bit dual channel ADCs with sample rates of 210MSPS and 250MSPS, respectively.
TI also says that the 250-MSPS data converter provides 66 percent greater bandwidth than competing dual ADCs. Has this been based on any on-field performance? Awasthy said that this is the performance specified in the data sheet and was tested in a lab.
Naturally, the key application areas would be interesting to look at! Awasthy said, “The ADS62P49 is suitable for applications such as communications and defense imaging systems, and wide-band test and measurement equipment. The block diagram given here shows an application area.Source: TI
Again, when TI says that the ADS62P49 has the “the industry’s fastest sample rate”, what’s the benchmark? Awasthy said, “We have done comparisons between our device and others in the industry. We are the only one to offer a dual, 14-bit device that achieves 250MSPS.”
Solving customer challenges
What are the main customer challenges solved by the new ADC? Awasthy said: “Communications, defense and test design engineers are constantly challenged to create signal and data acquisition receivers with increasingly wide signal bandwidths that do not compromise overall system performance. Another key feature in demand is the low power capabilities without bargaining on performance.
“TI addresses these challenges with the ADS62P49, which delivers high-performance, compact, power-efficient designs, and enables rapid deployment of 3G and 4G systems, software defined radios and spectrum analyzers.”
What if the competition brings out such a device or a better one soon? TI is not in a position to speculate on what the competition is planning. “The data converter market offers tremendous opportunities to TI. We will continue to offer leading edge data converters that address our customers’ challenges and advance next generation system design,” he added.
This is the first in a series of four 12- and 14-bit dual channel ADCs. Awasthy said that TI expects more of such devices to be released in the second half of this year.
EDA is a complex industry to be in, what with process geometries changing all the time and EDA firms compelled to keep up with those changes. Magma Design Automation Inc. has been one of those, which has kept ahead of the changes and also managed good growth. In other words, Magma has managed to beat the clock consistently and stayed ahead, and continues to do so.
According to Rajeev Madhavan, chairman and CEO, Magma Design Automation Inc.. Magma has been outperforming the EDA industry by 2x globally. He touched upon the drive toward consumerization. Whle it was driven by PCs during the 1980s, mobile phones and PDAs are now the growth drivers for the common man. The consumer space is driving semiconductor applications as well. These are in form of devices with smaller form factors, where power is an important issue.
As an example, Madhavan highlighted the fact that 75 percent of the chips in the iPhone type of complex cell phone has been done using Magma. “We enable such points to happen. Consumer applications are driving EDA, and we are providing that change.”
According to him, India is a major center for Magma. An entire business line of products are now being driven out of India. The physical verification units – DRC, etc., — are all done here. Magma is consistently developing new products and product lines. Any MNC in India has an opportunity to build relationships with the EDA powerhouse.
EDA is all about integration. With operating margins getting slimmer, most companies have been moving to Fab-Lite. India has great expertise in design knowledge. India should shift its focus on developing the intellectual knowledge side, contended Madhavan. As for fabs, as and when those happen in India, they will definitely create jobs. “Fab-lite is actually good for EDA. It means more design productivity. Leading firms such as TI, NVIDIA, Broadcom, etc., are our customers,” he said.
Magma is now looking at more value addition and faster development. It has covered the entire EDA domain. Magma has a culture of rewriting its software a lot more and also covers all new process geometries. According to Madhavan, Magma is constantly in touch with leading foundries such as TSMC.
It is said that right now, around 75 percent of the chips in 45nm currently use Magma. Magma is also working with a customer in 32nm. Madhavan said: “You have to develop the tools as the processes change. At Magma, we need smart people who can understand electrical engineering and computer science. Growth comes in identifying and building the talent pools.”
As for product lines developed in India, Magma’s Quartz Formal has been developed largely in India. Most of the development work is happening in NOIDA, near Delhi. Work on DRC is being done out of Bangalore. “Every single product from Magma has some footprint in India,” he said. The complexities of chips have been growing and those require more automation.
Magma intends to grow from $178 million to $211 million during 2008. Madhavan felt that as the eco-system units come up in India, the company can move forward. Magma is hopeful that more design companies will be getting into India.
90nm designs major in India
Ricky Bedi, Senior Director, Application Engineering, Magma Design Automation India Pvt Ltd, added that the EDA industry had moved on from being optimizers. India too has to now move forward from being outsourcers to enablers.
He said, “When that happens, India will play a bigger role and offer more services. For example, Wipro, etc., are now doing full turnkey solutions.” Magma India is now working with over 32 universities, regional engineering colleges (RECs), IITs, etc. The intent is to facilitate VLSI programs in all of those places.
However, he agreed that the innovation has not really kicked off in the country. As of now, 90nm designs are in the majority in India, and in comparison, 65nm designs are lesser. Magma has already gone into 45nm, and even into 32nm. Bedi said: “Right now, yield is imperative in 45nm. Innovation will continue in the smaller geometries. Innovation has to focus more on predictability, etc.”
There is another trend worth mentioning — about re-usable IPs. According to Magma, there will be even more of re-usable IPs. As the designs themselves get complex, designers need to achieve those in shorter timeframes as the time-to-market (TTM) is crucial. Replication of blocks is also happening. Implementation of re-usable IPs will go up a notch, added Bedi.
While the EDA tools are now catching up with the advances in semiconductors, it has not been smooth sailing for language. Bedi added: “As far as language is concerned, language itself does not blend so easily. It takes great effort to move from Verilog to VHDL.”
Yatin Trivedi, director, Industry Partnership Program, Design Implementation Business Unit, Magma Design Automation Inc., touched upon the aspect of power. He said: “In the EDA format, it is important that the power format is accepted by as many vendors. The difference should be in the usage, not the format. In any design flow — from RTL to GDS — any design that is implemented must be simulated. Power information is now an integral part of the design. Leakage can destroy a die.”
The EDA 360 was an industry vision. It reflected a change in market requirements. It was application driven system design. From a Cadence perspective, the company has done system design enablement, according to Nimish Modi, senior VP, marketing and business development, Cadence Design Systems Inc.
In Apple’s case, the iOS is unique. Cadence feels that the heart of the design is the SoC. The electrical analysis is becoming very important. For instance, how do you optimize before tape-out? Hardware and software conversion presents a huge problem as well. The IP plays an important part. Cadence did IP-as-a-service. It now has an IP strategy.
Today, EDA is about possibility, not productivity. Cadence provides tools and content for semiconductor and systems companies. It is now realizing the EDA 360 vision.
According to Modi, each IP is immensely complex. Standards based or interface IP is not enough! Silicon-proven design is the need of the hour. Now, more and more IP blocks are said to be coming together.
Cadence is offering the Palladium XP, and its primary use is for system verification. Software development is becoming a little bit difficult. People are providing software prototypes. The Palladium compile, turnaround and debug are very fast, best-in-class. All memory, clocking, partitioning, etc., is now automated.
The capacity of the Protium platform is 100 million gates. It will enable hardware and software developers. The use model for Protium is:
* Hardware folks use it for hardware regression.
* Software folks use it for early software development.
The main value proposition is the faster bring-up time. Also, the Palladium hybrid model helps customers overcome the boot problem. It is a hybrid of emulation and virtual prototyping. The dynamic power analysis is another issue. The Palladium hybrid model helps to do the testing.
Collaboration with ARM
ARM provides processor IPs. Cadence works closely with ARM. Cadence is also co-optimizing its tools to provide the best PPA. Physical libraries and tools get optimized. Cadence’s tools are optimized for ARM architecture. Cadence is also the first ones on the access to the V8 ARM models.
Cadence Design Systems Inc. recently announced the Quantus QRC extraction solution had been certified for TSMC 16nm FinFET.
So, what’s the uniqueness about the Cadence Quantus QRC extraction solution?
KT Moore, senior group director – Product Marketing, Digital and Signoff Group, Cadence Design Systems, said: “There are several parasitic challenges that are associated with advanced node designs — especially FinFET – and it’s not just about tighter geometries and new design rules. We can bucket these challenges into two main categories: increasing complexity and modeling challenges.
“The number of process corners is exploding, and for FinFET devices specifically, there is an explosion in the parasitic coupling capacitances and resistances. This increases the design complexity and sizes. The netlist is getting bigger and bigger, and as a result, there is an increase in extraction runtimes for SoC designs and post-layout simulation and characterization runtimes for custom/analog designs.
“Our customers consistently tell us that, for advanced nodes, and especially for FinFET designs, while their extraction runtimes and time-to-signoff is increasing, their actual time-to-market is shrinking and putting an enormous amount of pressure on designers to deliver on-time tapeout. In order to address these market pressures, we have employed the massively parallel technology that was first introduced in our Tempus Timing Signoff Solution and Voltus IC Power Integrity Solution to our next-generation extraction tool, Quantus QRC Extraction Solution.
“Quantus QRC Extraction Solution enables us to deliver up to 5X better performance than competing solutions and allows scalability of up to 100s of CPUs and machines.”
Support for FinFET features
How is Quantus providing significant enhancements to support FinFET features?
Parasitic extraction is at the forefront with the introduction of any new technology node. For FinFET designs, it’s a bit more challenging due to the introduction of non-planar FinFET devices. There are more layers to be handled, more RC effects that need to be modeled and an introduction of local interconnects. There are also secondary and third order manufacturing effects that need to modeled, and all these new features have to be modeled with precise accuracy.
Performance and turnaround times are absolutely important, but if you can’t provide accuracy for these devices — especially in correlation to the foundry golden data — designers would have to over-margin their designs and leave performance on the table.
How can Cadence claim that it has the ‘tightest correlation to foundry golden data at TSMC vs. competing solutions’? And, why 16nm only?
According to Moore, the foundry partner, TSMC, asserts that Quantus QRC Extraction Solution provides best-in-class accuracy, which was referenced in the recent press announcement:
“Cadence Quantus QRC Extraction Solution successfully passed TSMC’s rigorous parasitic extraction certification requirements to achieve best-in-class accuracy against the foundry golden data for FinFET technology.”
FinFET structures present unique challenges since they are non-planar devices as opposed to its CMOS predecessor, which is a planar device. We partnered with TSMC from the very beginning to address the modeling challenges, and we’ve seen many complex shapes and structures over the year that we’ve modeled accurately.
“We’re not surprised that TSMC has recognized our best-in-class accuracy because we’re the leader in providing extraction solutions for RF designs. Cadence Quantus QRC Extraction Solution has been certified for TSMC 16nm FinFET, however, it’s important to note that we’ve been certified for all other technology nodes and our QRC techfiles are available to our customers from TSMC today.”
Intersolar North America successfully concluded its seventh annual show in the heart of the United States’ largest solar market, California. More than 17,000 visitors from 74 countries visited 530 exhibitors.
The show had the latest innovations in the photovoltaic, energy storage, balance of systems, mounting and tracking systems, and solar heating and cooling market sectors.
It just shows how the USA has evolved as a leading market for solar PV over the years. One could feel USA creeping up on China! Which brings me to the other significant news.
Recently, there was news regarding the USA-China solar dispute. USA has won huge anti-dumping tariffs in the US-China solar panel trade case. A preliminary decision by the US Department of Commerce has imposed significant tariffs on Chinese solar modules in the anti-dumping portion of the case.
The decision has also closed SolarWorld’s “loophole,” which is said to have allowed Chinese module manufacturers to use Taiwanese cells in their modules, circumventing US trade duties.
Will this affect the Chinese PV module suppliers? Perhaps, not that much. Why so? China itself has a very huge domestic market for solar PV. They can continue to do well in China itself. It can also sell solar PV modules in India, as well, besides other regions in the Asia Pacific.
That brings me back to Intersolar North America 2014. Why was there such a low presence of Indian companies? The exhibitor list for the show reads only two — Lanco Solar Pvt Ltd and Vikram Solar Pvt Ltd. Where are the others?
If one looks at the Ministry for New and Renewable Energy (MNRE) website, there is a notification stating that a National Solar Mission (NSM) is being implemented to give a boost to solar power generation in the country. It has a long-term goal of adding 20,000 MWp of grid-connected solar power by 2022, to be achieved in three phases (first phase up to 2012-13, second phase from 2013 to 2017 and the third phase from 2017 to 2022).
Well, the MNRE has also put up a release stating complaints received about the non-function of the systems installed by channel partners. Without getting into details, why can’t Indian suppliers get to the ground and work up solidly? Some of the complaints are actually not even so serious. System not working. Channel partner not attending complaint! And, plant not working due to inverter (PPS) burnt down. These should be attended to quickly, unless, there is some monetary or other issue, which, at least, I am not aware of!
The CNA Corp.s Energy, Water, & Climate division released two studies earlier this week, which found that cost-effective options that power plants can use to cut water use can also help plants reduce CO2 emissions.
The first report, Capturing Synergies Between Water Conservation and Carbon Dioxide Emissions in the Power Sector, focuses on strategy recommendations based on analyses of water use and CO2 emissions in four case studies, which are detailed in the second report, A Clash of Competing Necessities: Water Adequacy and Electric Reliability in China, India, France, and Texas.
CNA’s Energy, Water, & Climate division released two studies, which found that cost-effective options that power plants can use to cut water use can also help plants reduce CO2 emissions.
“It’s a very important issue,” said lead study author Paul Faeth, director of Energy, Water, & Climate at CNA. “Water used to cool power plants is the largest source of water withdrawals in the United States and France, and a large source in China and India.”
“The recommendations in these reports can serve as a starting point for leaders in these countries, and for leaders around the world, to take the steps needed to ensure the reliability of current generating plants and begin planning for how to meet future demands for electric power.”
India needs to learn from the Intersolar North America show. It also needs to look carefully at CNA’s reports. It is always great and good work that attracts global attention. India has all of the requred capabilities to do so!