Components Direct is a leading source for authorized end-of-life and excess electronic components. The products are guaranteed grade A factory sealed direct from the manufacturer and inventoried in a ESD 20.20 certified and ISO 9001 certified state-of-the art-facility. Components Direct is headquartered in Milpitas, CA with locations in the US and Asia.
It has a leading cloud-based platform for excess and obsolete (E&O) inventory. In 2012, Avnet and Components Direct entered in a strategic relationship. Components Direct is the exclusive channel for Avnet’s factory authorized excess and end-of-life components.
Compared to leading industry giants, such as Element14 and RS Components, Components Direct, currently, doesn’t have a detailed menu showcasing listed products, at least not on the home page, as yet. One hopes that’ll make an appearance soon.
Speaking on the mission of Components Direct, Anne Ting, executive VP, Marketing said: “Components Direct is the premier authorized distributor for excess and end-of-life electronic components. We are the only company working directly with manufacturers and their franchised distributors to offer 100 percent guaranteed traceable E&O components as well as technology services to combat counterfeit components and other gray market activity.
“For our supplier partners, we enable them to put excess product back into the control of an authorized source, as opposed to the gray market. For buyers, we provide them with a secure, authorized one-stop shop for excess, obsolete and unsold factory components.”
Combating gray market
How important is it to combat the gray market? Why will this endeavor stop/lessen gray market activity?
According to Ting, the gray market is a serious and growing problem. As early as 2008, a study by KPMG and the Alliance for Gray Market and Counterfeit Abatement (AGMA) stated that as much as $58 billion of technology products were passing through the gray market, and the problem has only gotten worse.
The gray market is rampant throughout all industries, with everyone from engineers, to procurement professionals and consumers impacted negatively when the products they purchase are advertised as new and authentic, but in reality could be used, refurbished or even worse, counterfeit.
In fact, a 2012 study by market research firm IHS found that over 12 million counterfeit electronics and semiconductor components
have entered the distribution chain since 2007, with 57 percent of all counterfeit parts obsolete or end-of-life components. Many of these parts make their way into mission-critical industries, such as defense and aerospace, where a malfunctioning counterfeit part can mean the difference between life and death.
While provisions in the 2012 National Defense Authorization Act have enabled the government and trade groups to make some progress towards regulating the supply chain to ensure that components are only sourced directly from the manufacturers or their franchised distributors, the problem has not abated. The Act empowers the federal government to hold contractors financially responsible for replacing counterfeit products.
This, together with other changes, puts more responsibility on suppliers of electronic component to have risk mitigation procedures in place. The issue is become more topical and the industry must act in order to comply with the new legislation.
Components Direct takes this problem seriously, and provides supplier insights and tools to help combat gray market activity. In a recent study we conducted for a leading semiconductor supplier of both analog and digital devices, we discovered that over 124 million units of their product were floating in the gray market across 6,500 plus part numbers.
Over 70 percent of the products were found in Asia, and 20 percent also appeared in both North America and EMEA. The product age spanned many years with date codes of less than one year accounting for 22 percent of their gray market product. A further 5 percent had date codes over 11 years, demonstrating that whether you were an OEM looking for the newest product, or a military sub-contractor looking for obsolete components, no end customer is immune to the presence of unauthorized product.
Components Direct’s technology tools and services track gray market activity and provide suppliers with unprecedented visibility to their product leakage in the gray market by part number, region, data code etc. This data enables our suppliers to trace leakage in their supply chain and lessen potential unauthorized product from getting into the gray market.
Additionally, Components Direct provides suppliers and buyers with a secure, factory authorized channel for selling or purchasing 100 percent guaranteed traceable components. “We only sell products that come directly with manufacturers or their franchised distributors and all our products are inventoried in an ESD 20.20 and ISO 9001 certified facility,” said Ting.As an extension of the manufacturer, Components Direct provides the supply chain buyer with complete confidence and peace of mind that all products originate directly from the manufacturer and have been properly stored, handled and packaged. Sourcing from an authorized source like Components Direct eliminates the risks surrounding product quality, reliability and liability. Read more…
Today, Feb. 14th, has turned out to be a great day for me! I received an email early morning, which stated: PC’s Electronic Components Blog is featured on the list of 100 Top Resources for Electrical Engineers that we published on ElectricalEngineeringSchools.org, USA!
Wow! This happens to be my sixth world title in a row!! The picture of the award badge is given alongside!!!
I am so very happy that my blog on electronic components has bagged an award! I had started my career writing about electronic components for Asian Sources Media, now Global Sources, in Hong Kong.
Back in those days – 1994-1995, there used to be some presence of electronic components made by local manufacturers, especially in Naraina Industrial Area, New Delhi. I still remember, very clearly, doing the rounds of Naraina, along with my friend, Dolly! Back then, most of the components were made for colour TV sets, and a few makers had just started making components for cellular phones.
Today, there are big-sized, very large representatives of electronic components in India.
I recall one of my earlier stories was on DIP switches. There used to be slide and rocker types of DIP switches. I wonder whether they are still used today! Maybe, they are, in some electronic devices! I also recall there used to be some demand for TV antennae at that time, as well as for cell phone antennae! How time has flown by since!!
May I take this opportunity and offer sincere thanks to all of my readers, well wishers, friends and acquaintances I have made over the years for their continuous love and support! Without you, no award is ever possible! ;)
I’d like to conclude by taking the names of two gentlemen, who have spurred me on to write blogs on components, electronics and semiconductors, as well as telecom. They happen to be Alfred Cheng. country manager, Hong Kong, Global Sources, and Spenser Au, former publisher, CTG and now, CEO, Global Sources, Hong Kong, who made me work on the Telecom specs tables.
A word is also due for Raj Gopinath, my editor-in-chief at Asian Sources, and Daniel Tam, who replaced Spenser, back in 1999, as publisher of CTG. Special mention needs to be made of Claudius Chan, who I consider as a ‘guru’ of electronic components. Whatever I am today is largely due to my time spent at Global Sources! Thanks a lot, my dear friends!!
Alfred just sent me a mail saying: Hi Pradeep, How many more prizes would you like to win, my friend? I wish I could write as good as, maybe 50 percent as good as you do since we used to work together in the electronics industry. :) Thanks a lot, my friend!
You can visit this blog to read more news on the global electronic components industry. There are releases, articles and industry updates, from leading research and consulting houses, such as LEDInside, Frost & Sullivan, etc. Farnell has been a partner, providing updates on RoHS, REACH, WEEE, etc.
PC’s Electronic Components Blog was awarded as a Top Resource For Electrical Engineers 2013 on ElectricalEngineeringSchools.org ! :) Thanks a lot, dear friends! :)
Bangalore based AqTronics Technologies Pvt Ltd is an innovator in the distribution and marketing of semiconductors, passives, interconnects, electro-mechanical, IT and enterprise products. It is a focused demand creation distributor for India markets.
He said: “We would like to bring the latest technologies to India and provide an exemplary standard of quality service through superior product marketing, outstanding technical solution support, in-depth inventory, professional selling procedures and the most reliable operational systems in distribution.”
AqTronics to distribute Mouser’s components in India
AqTronics recently entered into an agreement with Mouser Electronics Inc., a leading global distributor of electronic components.
Under the agreement, AqTronics will distribute Mouser’s electronics components in India. All of Mouser’s components are available through AqTronics through INR (Indian Rupees) and USD (US dollars) with Modvat refund.
Mouser Electronics is one of the fastest growing global catalog and web based distributors in the electronics industry. The company is focused on the rapid introduction of newest products, leading edge technologies, and world class customer service.
It is specially focused on design engineers and buyers demanding small to medium quantities of the latest products. Hence, Mouser provides customer-focused distribution.
Mouser is also an authorized distributor for over 390 industry leading manufacturers. With a new catalog every six months, it ensures that the newest products are added and the end-of-life products removed from the print catalog. Mouser’s website features over a million products for easy purchase in USD, INR and with Modvat refund through AqTronics.
USP of AqTronics-Mouser relationship
Ranga Prasad says: “AqTronics’ focus is demand creation distribution. This calls for supporting customers on the complete product development life cycle (PDLC).”
Mouser Electronics will help AqTronics will support customers for — functional engineering, embedded development tool selection, bread board to engineering BOM, prototyping with small quantities, and NPI or pilot production – broken pack (Non MoQ, non MoV).
Components distribution and India advantage
Estimating the global components distribution market, according to Mouser, the semiconductor markets globally are estimated to be $1.2 trillion.
The Indian market share in percentage terms is said to be lesser than 2 percent of the world TAM (total available market). According to the companies, this calls for tremendous growth opportunities for components distribution in the Indian market.
Naturally, the India advantage comes into play!
India, with the second largest population in the world, and a huge talent pool of engineers, is a promising market. Especially, in the R&D activities, there are a lot of technology companies in major cities such as Bangalore, Chennai, etc.
Mouser will focus and continue to put an effort into developing this market. Mouser is very excited about the growth in the Indian market and the opportunity to bring its world class product line card to the region.
AqTronics’ strategies to tap Indian market with Mouser
AqTronics and Mouser have aggressive plans for the Indian market.
According to Ranga Prasad: “Mouser will re-inforce resources in India by increasing its presence through partners, e-marketing through the Internet, e-magazines and appropriate search engines. Mouser’s focus is on bringing the ‘newest parts for the newest designs’, and ensuring that the engineering community is best served with all of the latest parts.
“To support this, AqTronics, and also Mouser, will update their website daily with new parts and components from over 390 major manufacturers. There will also also be a fully updated catalog in India every six months.”
Warehouse in pipeline
Entering India in the electronic components space also calls for having a dedicated warehouse at some point of time. Since customer support is one of Mouser’s strength, the company is serious in its approach toward India, and will provide its best services for after sales support.
Putting appropriate resource to support customers is Mouser’s belief. Therefore, it will not neglect the needs of adding a warehouse wherever and whenever required. It also partners with FEDEX for international operations and has a three-day shipping from Texas, USA, to its customer base in the region.
Companies represented by AqTronics
AqTronics represents the following companies:
Mouser Electronics: Catalogue sales distribution.
Digi International: Leaders in device networking and M2M.
SST: Serial/parallel Flash, NAN drive (solid-state drive), 8051 microcontrollers.
ISSI: Synchronous SRAM, DDR-II, asynchronous SRAM, DRAM, automotive and industrial versions.
Fujistu: Thermal printers, interface boards, touch panels, Bluetooth modules.
Upek: Capacitive type -– large area, swipe sensors, controllers, RSA tokens.
Ember: Zigbee chipsets.
ORing: Ethernet switches.
Sarantel: GPS Geo Helix antennae.
iWatt: AC/DC ICs, DC/DC ICs, Advance power solutions
Tysso: Magnetic swipe readers, keyboards, bar code readers/scanners, POS systems.
Everlight: LED lighting solutions.
MPS: Monolithic power systems — regulators, low drop regulators, battery, chargers/protection, transformer based power supplies.
Narda Batteries: Batteries for telecom, UPS, power, solar energy, emergency lighting and power systems, mobile communications, radio, railways.
Taking on competition
India is also home to leading electronic components and distributors, such as Farnell. Contending with such stiff competition is key on the agenda.
Ranga Prasad adds: “In addition to the strategies mentioned earlier, we would like to re-inforce and strengthen our relationships with the universities’ research teams, and ensure that the engineers are aware of Mouser’s services and support when they are still in the universities.
“Mouser’s focus is driven by ensuring that the latest components are always available. Its stock profile is focused on electronic components, and not on other peripheral ranges.”
Here is the concluding part of my discussion with Sam Fuller, CTO, Analog Devices. We discussed the technology aspects of Moore’s Law and
‘More than Moore’, among other things.
Are we at the end of Moore’s Law?
First, I asked Fuller that as Gordon Moore suggested – are we about to reach the end of Moore’s Law? What will it mean for personal computing?
Fuller replied: “There is definitely still life left in Moore’s law, but we’re leaving the golden age after the wonderful ride that we have had for the last 40 years. We will continue to make chips denser, but it is becoming difficult to continue to improve the performance as well as lower the power and cost.
“Therefore, as Moore’s law goes forward, more innovation is required with each new generation. As we move from Planer CMOS to FinFET (a new technology for multi-gate architecture of transistors); from silicon to more advanced materials Moore’s law will still have life for the next decade, but we are definitely moving into its final stages.
“For personal computing, there is still a lot of innovation left before we begin to run out of ideas. There will continue to be great advances in smart phones, mobile computing and tablets because software applications are really just beginning to take advantage of the phenomenal power and capacity of today’s semiconductors. The whole concept of ‘Internet of things’ will also throw up plenty of new opportunities.
“As we put more and more sensors in our personal gadgets, in factories, in industries, in infrastructures, in hospitals, and in homes and in vehicles, it will open up a completely new set of applications. The huge amount of data generated out of these sensors and wirelessly connected to the Internet will feed into the big data and analytics. This would create a plethora of application innovations.”
What’s happening in the plane?
The plane opportunity – 90nm – 65nm – 45nm – 22nm – 20nm – 14/18nm – is starting to get difficult and probably won’t work at 12nm, for purely physics reasons. What is Analog Devices’ take on this?
Fuller said: “You are right! We have been going from 45 nm down to lower nodes, it’ll probably go down to 10 nm, but we are beginning to run into some fundamental physics issues here. After all, it’s a relatively finite number of atoms that make up the channels in these transistors. So, you’re going to have to look at innovations beyond simply going down to finer dimensions.
“There are FinFETS and other ways that can help move you into the third dimension. We’re getting to a point where we can put a lot of complexity and a number of functions on a single die. We have moved beyond purely digital design to having more analog and mixed signal components in the same chip. There are also options such as stacked dies and multiple dies.
“Beyond integration on a single chip, Analog Devices leads in advanced packaging technologies for System in a Package (SiP) where sensors, digital and analog/mixed signal components are all in a single package as the individual components would typically use different technology nodes and it might not be practical to do such integration on a single die.
“So, the challenge often gets described as “More than Moore”, which is going beyond Moore’s law, bringing those capabilities to do analog processing as well as digital and then integrating sensors for temperature sensing, pressure sensing, motion sensing and a whole range of sensors integrated for enabling the ‘Internet of Things’.
“At Analog Devices, we have the capability in analog as well as digital, and having worked for over 20 years on MEMS devices, we are particularly well positioned as we get into ‘More than Moore’.”
Early this month, I caught up with Jaswnder Ahuja, corporate VP and MD, Cadence Desiign Systems India. With the global semiconductor industry having entered the sub-20nm era, there are a lot of things happening, and Cadence is sure to be present.
Performance in sub-2onm era
First, let’s see how’s the global semiconductor industry performing after entering the sub-20nm era.
Ahuja replied: “Increased demand for faster, smaller, low-power chips continues to drive the geometry shrink as one of the ways to manage the low-power, higher performance goals in smaller form factors—in other words, PPA is driving the move to advanced node design.
“At Cadence, we are seeing a lot of interest in the wireless space, which includes smartphones, tablets, and consumer devices. In this market, you must support different standards, the device must be really fast, it must have Internet access, and all this must be done at lower power so the that it does not drain the battery. We’re also seeing interest for advanced nodes in other segments such as computing and graphics processors.”
When speaking of advanced nodes, let’s also try and find out what Cadence is doing in helping achieve 10X faster power integrity analysis and signoff.
Cadence Voltus IC power integrity Solution is a full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies to designers for debugging, verifying, and fixing IC chip power consumption, IR drop, and electromigration (EM) constraints and violations.
The Voltus solution includes innovative technologies such as massively parallel execution, hierarchical architecture, and physically aware power grid analysis and optimization. Beneficial as a standalone power signoff tool, Voltus IC Power Integrity Solution delivers even more significant productivity gains when used in a highly integrated flow with other key Cadence products, providing the industry’s fastest design closure technology.
Developed with advanced algorithms and a new power integrity analysis engine with massively parallel execution, Voltus IC Power Integrity solution:
* Performs 10X faster than other solutions on the market.
* Supports very large designs—up to one billion instances—with its hierarchical architecture.
* Delivers SPICE-level accuracy.
* Enhances physical implementation quality via physically aware power integrity optimization.
Supported by major foundries and intellectual property (IP) providers, Voltus IC Power Integrity Solution has been validated and certified on advanced nodes processes such as 16nm FinFET and included in reference design flows such as for 3D-IC technology. Backed by Cadence’s rigorous quality control and product release procedures, the Voltus solution delivers best-in-class signoff quality on accuracy and stability for all process nodes and design technologies.
FinFETs to 20nm – are folks benefiting?
It is common news that FinFETs have gone to 20nm and perhaps, lower. Therefore, are those folks looking for power reduction now benefiting?
Ahuja replied that FinFETs allow semiconductor and systems companies to continue to develop commercially viable chips for the mobile devices that are dominating the consumer market. FinFETs enable new generations of high-density, high-performance, and ultra-low-power systems on chip (SoCs) for future smart phones, tablets, and other advanced mobile devices. Anyone who adopts FinFET technology will reap the benefits.
Foundry support for FinFETs will begin at 16nm and 14nm. In April of this year, Cadence announced a collaboration with ARM to implement the industry’s first ARM Cortex-A57 processor on TSMC’s 16nm FinFET manufacturing process. At ARM TechCon 2012, Cadence announced a 14nm test chip tapeout using an ARM Cortex-M0 processor and IBM’s FinFET process technology.
Odyssey Consultants is a PCI QSA, ISO 27001 certified infosecurity, infrastructure and risk management solutions integrator, and a managed security and outsourcing services provider. Founded 2002, it has since evolved into a regional leader in managed security and outsourcing services.
Odyssey’s range of solutions and services lie within a four-phase information security continuum, such as test and access, design and implement, monitor and respond, and outsourcing. According to the company, information security management involves the development, deployment, and ongoing monitoring and review of a combination of preventive, detective, and response processes and controls.
Odyssey is offering the ClearSkies security-as-a-service (SaaS) line of cloud-based integrated security services. ClearSkies platform has the necessary tools that enable the organizations reap benefits of the cloud without compromising on infosecurity.
The first of the ClearSkies series of services offered by Odyssey is the security information and event management (SIEM). SIEM provides organizations an adequate infrastructure in-house, with the opportunity to gain such capability in the cloud. ClearSkies is enriched with the vast know-how, expertise and intelligence of the latest threats and vulnerabilities that come right out of Odyssey’s Ithaca Labs. It transforms the service into a powerful information security tool for the client.
Odyssey also offers managed security and outsourcing (MSOS) services. Key benefits include:
* Enhanced 24/7/365 protection and monitoring of network, systems and security components.
* Continuous log analysis and correlation of events with real-time incident escalation.
* Focus internal resources on core organizational competencies.
* Threat analysis and access to security advisories issued by Ithaca Labs team.
* Minimized mean time to restore/recovery (MTTR) capability by proactive indentification of Internet threats.
* Retention of logs collected in a secure environment, helping clients meet regulatory compliance without needing to deploy costly and complex reporting tools and processes.
* Low TCO by eliminating the need to recruit, train and retain an in-house security capability.
* Notification of in-scope devices outage that impacts log collection.
* Access to MSOS secure portal for reviewing real-time alerts, published incidents and generate reports.
Odyssey has offices in Cyprus and Greece, and is exhibiting at the Gitex 2013 show in Dubai.
Future Horizons hosted the 22nd Annual International Electronics Forum, in association with IDA Ireland, on Oct. 2-4, 2013, at Dublin, Blanchardstown, Ireland. The forum was titled ‘New Markets and Opportunities in the Sub-20nm Era: Business as Usual OR It’s Different This Time.” Here are excerpts from some of the sessions. Those desirous of finding out much more should contact Malcolm Penn, CEO, Future Horizons.
The global interest in graphene research has facilitated our understanding of this rather unique material. However, the transition from the laboratory to factory has hit some challenging obstacles. In this talk I will review the current state of graphene research, focusing on the techniques which allow large scale production.
I will then discuss various aspects of our research which is based on more complex structures beyond graphene. Firstly, hexagonal boron nitride can be used as a thin dielectric material where electrons can tunnel through. Secondly, graphene-boron nitride stacks can be used as tunnelling transistor devices with promising characteristics. The same devices show interesting physics, for example, negative differential conductivity can be found at higher biases. Finally, graphene stacked with thin semiconducting layers which show promising results in photodetection.
I will conclude by speculating the fields where graphene may realistically find applications and discuss the role of the National Graphene Institute in commercializing graphene.
The key challenge for future high-end computing chips is energy efficiency in addition to traditional challenges such as yield/cost, static power, data transfer. In 2020, in order to maintain at an acceptable level the overall power consumption of all the computing systems, a gain in term of power efficiency of 1000 will be required.
To reach this objective, we need to work not only at process and technology level, but to propose disruptive multi-processor SoC architecture and to make some major evolutions on software and on the development of
applications. Some key semiconductor technologies will definitely play a key role such as: low power CMOS technologies, 3D stacking, silicon photonics and embedded non-volatile memory.
To reach this goal, the involvement of semiconductor industries will be necessary and a new ecosystem has to be put in place for establishing stronger partnerships between the semiconductor industry (IDM, foundry), IP provider, EDA provider, design house, systems and software industries.
This presentation looks at the development of the semiconductor and electronics industries from an African perspective, both globally and in Africa. Understanding the challenges that are associated with the wide scale adoption of new electronics in the African continent.
Electronics have taken over the world, and it is unthinkable in today’s modern life to operate without utilising some form of electronics on a daily basis. Similarly, in Africa the development and adoption of electronics and utilisation of semiconductors have grown exponentially. This growth on the African continent was due to the rapid uptake of mobile communications. However, this has placed in stark relief the challenges facing increased adoption of electronics in Africa, namely power consumption.
This background is central to the thesis that the industry needs to look at addressing the twin challenges of low powered and low cost devices. In Africa there are limits to the ability to frequently and consistently charge or keep electronics connected to a reliable electricity grid. Therefore, the current advances in electronics has resulted in the power industry being the biggest beneficiary of the growth in the adoption of electronics.
What needs to be done is for the industry to support and foster research on this subject in Africa, working as a global community. The challenge is creating electronics that meet these cost and power challenges. Importantly, the solution needs to be driven by the semiconductor industry not the power industry. Focus is to be placed on operating in an off-grid environment and building sustainable solutions to the continued challenge of the absence of reliable and available power.
It is my contention that Africa, as it has done with the mobile communications industry and adoption of LED lighting, will leapfrog in terms of developing and adopting low powered and cost effective electronics.
Personalized, preventive, predictive and participatory healthcare is on the horizon. Many nano-electronics research groups have entered the quest for more efficient health care in their mission statement. Electronic systems are proposed to assist in ambulatory monitoring of socalled ‘markers’ for wellness and health.
New life science tools deliver the prospect of personal diagnostics and therapy in e.g., the cardiac, neurological and oncology field. Early diagnose, detailed and fast screening technology and companioning devices to deliver the evidence of therapy effectiveness could indeed stir a – desperately needed – healthcare revolution. This talk addresses the exciting trends in ‘PPPP’ health care and relates them to an innovation roadmap in process technology, electronic circuits and system concepts.
POET Technologies Inc., based in Storrs Mansfield, Connecticut, USA, and formerly, OPEL Technologies Inc., is the developer of an integrated circuit platform that will power the next wave of innovation in integrated circuits, by combining electronics and optics onto a single chip for massive improvements in size, power, speed and cost.
POET’s current IP portfolio includes more than 34 patents and seven pending. POET’s core principles have been in development by director and chief scientist, Dr. Geoff Taylor, and his team at the University of Connecticut for the past 18 years, and are now nearing readiness for commercialization opportunities. It recently managed to successfully integrate optics and electronics onto one monolithic chip.
Elaborating, Dr. Geoff Taylor, said: “POET stands for Planar Opto Electronic Technology. The POET platform is a patented semiconductor fabrication process, which provides integrated circuit devices containing both electronic and optical elements on a single chip. This has significant advantages over today’s solutions in terms of density, reliability and power, at a lower cost.
“POET removes the need for retooling, while providing lower costs, power savings and increased reliability. For example, an optoelectronic device using POET technology can achieve estimated cost savings back to the manufacturer of 80 percent compared to the hybrid silicon devices that are widely used today.
“The POET platform is a flexible one that can be applied to virtually any market, including memory, digital/mobile, sensor/laser and electro-optical, among many others. The platform uses two compounds – gallium and arsenide – that will allow semiconductor manufacturers to make microchips that are faster and more energy efficient than current silicon devices, and less expensive to produce.
“The core POET research and development team has spent more than 20 years on components of the platform, including 32 patents (and six patents pending).”
Moore’s Law to end next decade?
Is silicon dead and how much more there is to Moore’s Law?
According to Dr. Taylor, POET Technologies’ view is that Moore’s Law could come to an end within the next decade, particularly as semiconductor companies have recently highlighted difficulties in transitioning to the next generation of chipsets, or can only see two to three generations ahead.
Transistor density and its impact on product cost has been the traditional guideline for advancing computer technology because density has been accomplished by device shrinkage translating to performance improvement. Moore’s Law begins to fail when performance improvement translates less and less to device shrinkage – and this is occurring now at an increasing rate.
He added: “For POET Technologies, however, the question to answer is not when Moore’s Law will end – but what next. Rather than focus on how many more years we can expect Moore’s Law to last – or pinpoint a specific stumbling block to achieving the next generation of chipsets, POET looks at the opportunities for new developments and solutions to continue advancements in computing.
“So, for POET Technologies, we’re focusing less on existing integrated circuit materials and processes and more towards a different track with significant future runway. Our platform is a patented semiconductor fabrication process, which concentrates on delivering increases in performance at lower cost – and meets ongoing consumer appetites for faster, smaller and more power efficient computing.”