Components Direct is a leading source for authorized end-of-life and excess electronic components. The products are guaranteed grade A factory sealed direct from the manufacturer and inventoried in a ESD 20.20 certified and ISO 9001 certified state-of-the art-facility. Components Direct is headquartered in Milpitas, CA with locations in the US and Asia.
It has a leading cloud-based platform for excess and obsolete (E&O) inventory. In 2012, Avnet and Components Direct entered in a strategic relationship. Components Direct is the exclusive channel for Avnet’s factory authorized excess and end-of-life components.
Compared to leading industry giants, such as Element14 and RS Components, Components Direct, currently, doesn’t have a detailed menu showcasing listed products, at least not on the home page, as yet. One hopes that’ll make an appearance soon.
Speaking on the mission of Components Direct, Anne Ting, executive VP, Marketing said: “Components Direct is the premier authorized distributor for excess and end-of-life electronic components. We are the only company working directly with manufacturers and their franchised distributors to offer 100 percent guaranteed traceable E&O components as well as technology services to combat counterfeit components and other gray market activity.
“For our supplier partners, we enable them to put excess product back into the control of an authorized source, as opposed to the gray market. For buyers, we provide them with a secure, authorized one-stop shop for excess, obsolete and unsold factory components.”
Combating gray market
How important is it to combat the gray market? Why will this endeavor stop/lessen gray market activity?
According to Ting, the gray market is a serious and growing problem. As early as 2008, a study by KPMG and the Alliance for Gray Market and Counterfeit Abatement (AGMA) stated that as much as $58 billion of technology products were passing through the gray market, and the problem has only gotten worse.
The gray market is rampant throughout all industries, with everyone from engineers, to procurement professionals and consumers impacted negatively when the products they purchase are advertised as new and authentic, but in reality could be used, refurbished or even worse, counterfeit.
In fact, a 2012 study by market research firm IHS found that over 12 million counterfeit electronics and semiconductor components
have entered the distribution chain since 2007, with 57 percent of all counterfeit parts obsolete or end-of-life components. Many of these parts make their way into mission-critical industries, such as defense and aerospace, where a malfunctioning counterfeit part can mean the difference between life and death.
While provisions in the 2012 National Defense Authorization Act have enabled the government and trade groups to make some progress towards regulating the supply chain to ensure that components are only sourced directly from the manufacturers or their franchised distributors, the problem has not abated. The Act empowers the federal government to hold contractors financially responsible for replacing counterfeit products.
This, together with other changes, puts more responsibility on suppliers of electronic component to have risk mitigation procedures in place. The issue is become more topical and the industry must act in order to comply with the new legislation.
Components Direct takes this problem seriously, and provides supplier insights and tools to help combat gray market activity. In a recent study we conducted for a leading semiconductor supplier of both analog and digital devices, we discovered that over 124 million units of their product were floating in the gray market across 6,500 plus part numbers.
Over 70 percent of the products were found in Asia, and 20 percent also appeared in both North America and EMEA. The product age spanned many years with date codes of less than one year accounting for 22 percent of their gray market product. A further 5 percent had date codes over 11 years, demonstrating that whether you were an OEM looking for the newest product, or a military sub-contractor looking for obsolete components, no end customer is immune to the presence of unauthorized product.
Components Direct’s technology tools and services track gray market activity and provide suppliers with unprecedented visibility to their product leakage in the gray market by part number, region, data code etc. This data enables our suppliers to trace leakage in their supply chain and lessen potential unauthorized product from getting into the gray market.
Additionally, Components Direct provides suppliers and buyers with a secure, factory authorized channel for selling or purchasing 100 percent guaranteed traceable components. “We only sell products that come directly with manufacturers or their franchised distributors and all our products are inventoried in an ESD 20.20 and ISO 9001 certified facility,” said Ting.As an extension of the manufacturer, Components Direct provides the supply chain buyer with complete confidence and peace of mind that all products originate directly from the manufacturer and have been properly stored, handled and packaged. Sourcing from an authorized source like Components Direct eliminates the risks surrounding product quality, reliability and liability. Read more…
Today, Feb. 14th, has turned out to be a great day for me! I received an email early morning, which stated: PC’s Electronic Components Blog is featured on the list of 100 Top Resources for Electrical Engineers that we published on ElectricalEngineeringSchools.org, USA!
Wow! This happens to be my sixth world title in a row!! The picture of the award badge is given alongside!!!
I am so very happy that my blog on electronic components has bagged an award! I had started my career writing about electronic components for Asian Sources Media, now Global Sources, in Hong Kong.
Back in those days – 1994-1995, there used to be some presence of electronic components made by local manufacturers, especially in Naraina Industrial Area, New Delhi. I still remember, very clearly, doing the rounds of Naraina, along with my friend, Dolly! Back then, most of the components were made for colour TV sets, and a few makers had just started making components for cellular phones.
Today, there are big-sized, very large representatives of electronic components in India.
I recall one of my earlier stories was on DIP switches. There used to be slide and rocker types of DIP switches. I wonder whether they are still used today! Maybe, they are, in some electronic devices! I also recall there used to be some demand for TV antennae at that time, as well as for cell phone antennae! How time has flown by since!!
May I take this opportunity and offer sincere thanks to all of my readers, well wishers, friends and acquaintances I have made over the years for their continuous love and support! Without you, no award is ever possible! ;)
I’d like to conclude by taking the names of two gentlemen, who have spurred me on to write blogs on components, electronics and semiconductors, as well as telecom. They happen to be Alfred Cheng. country manager, Hong Kong, Global Sources, and Spenser Au, former publisher, CTG and now, CEO, Global Sources, Hong Kong, who made me work on the Telecom specs tables.
A word is also due for Raj Gopinath, my editor-in-chief at Asian Sources, and Daniel Tam, who replaced Spenser, back in 1999, as publisher of CTG. Special mention needs to be made of Claudius Chan, who I consider as a ‘guru’ of electronic components. Whatever I am today is largely due to my time spent at Global Sources! Thanks a lot, my dear friends!!
Alfred just sent me a mail saying: Hi Pradeep, How many more prizes would you like to win, my friend? I wish I could write as good as, maybe 50 percent as good as you do since we used to work together in the electronics industry. :) Thanks a lot, my friend!
You can visit this blog to read more news on the global electronic components industry. There are releases, articles and industry updates, from leading research and consulting houses, such as LEDInside, Frost & Sullivan, etc. Farnell has been a partner, providing updates on RoHS, REACH, WEEE, etc.
PC’s Electronic Components Blog was awarded as a Top Resource For Electrical Engineers 2013 on ElectricalEngineeringSchools.org ! :) Thanks a lot, dear friends! :)
Bangalore based AqTronics Technologies Pvt Ltd is an innovator in the distribution and marketing of semiconductors, passives, interconnects, electro-mechanical, IT and enterprise products. It is a focused demand creation distributor for India markets.
He said: “We would like to bring the latest technologies to India and provide an exemplary standard of quality service through superior product marketing, outstanding technical solution support, in-depth inventory, professional selling procedures and the most reliable operational systems in distribution.”
AqTronics to distribute Mouser’s components in India
AqTronics recently entered into an agreement with Mouser Electronics Inc., a leading global distributor of electronic components.
Under the agreement, AqTronics will distribute Mouser’s electronics components in India. All of Mouser’s components are available through AqTronics through INR (Indian Rupees) and USD (US dollars) with Modvat refund.
Mouser Electronics is one of the fastest growing global catalog and web based distributors in the electronics industry. The company is focused on the rapid introduction of newest products, leading edge technologies, and world class customer service.
It is specially focused on design engineers and buyers demanding small to medium quantities of the latest products. Hence, Mouser provides customer-focused distribution.
Mouser is also an authorized distributor for over 390 industry leading manufacturers. With a new catalog every six months, it ensures that the newest products are added and the end-of-life products removed from the print catalog. Mouser’s website features over a million products for easy purchase in USD, INR and with Modvat refund through AqTronics.
USP of AqTronics-Mouser relationship
Ranga Prasad says: “AqTronics’ focus is demand creation distribution. This calls for supporting customers on the complete product development life cycle (PDLC).”
Mouser Electronics will help AqTronics will support customers for — functional engineering, embedded development tool selection, bread board to engineering BOM, prototyping with small quantities, and NPI or pilot production – broken pack (Non MoQ, non MoV).
Components distribution and India advantage
Estimating the global components distribution market, according to Mouser, the semiconductor markets globally are estimated to be $1.2 trillion.
The Indian market share in percentage terms is said to be lesser than 2 percent of the world TAM (total available market). According to the companies, this calls for tremendous growth opportunities for components distribution in the Indian market.
Naturally, the India advantage comes into play!
India, with the second largest population in the world, and a huge talent pool of engineers, is a promising market. Especially, in the R&D activities, there are a lot of technology companies in major cities such as Bangalore, Chennai, etc.
Mouser will focus and continue to put an effort into developing this market. Mouser is very excited about the growth in the Indian market and the opportunity to bring its world class product line card to the region.
AqTronics’ strategies to tap Indian market with Mouser
AqTronics and Mouser have aggressive plans for the Indian market.
According to Ranga Prasad: “Mouser will re-inforce resources in India by increasing its presence through partners, e-marketing through the Internet, e-magazines and appropriate search engines. Mouser’s focus is on bringing the ‘newest parts for the newest designs’, and ensuring that the engineering community is best served with all of the latest parts.
“To support this, AqTronics, and also Mouser, will update their website daily with new parts and components from over 390 major manufacturers. There will also also be a fully updated catalog in India every six months.”
Warehouse in pipeline
Entering India in the electronic components space also calls for having a dedicated warehouse at some point of time. Since customer support is one of Mouser’s strength, the company is serious in its approach toward India, and will provide its best services for after sales support.
Putting appropriate resource to support customers is Mouser’s belief. Therefore, it will not neglect the needs of adding a warehouse wherever and whenever required. It also partners with FEDEX for international operations and has a three-day shipping from Texas, USA, to its customer base in the region.
Companies represented by AqTronics
AqTronics represents the following companies:
Mouser Electronics: Catalogue sales distribution.
Digi International: Leaders in device networking and M2M.
SST: Serial/parallel Flash, NAN drive (solid-state drive), 8051 microcontrollers.
ISSI: Synchronous SRAM, DDR-II, asynchronous SRAM, DRAM, automotive and industrial versions.
Fujistu: Thermal printers, interface boards, touch panels, Bluetooth modules.
Upek: Capacitive type -– large area, swipe sensors, controllers, RSA tokens.
Ember: Zigbee chipsets.
ORing: Ethernet switches.
Sarantel: GPS Geo Helix antennae.
iWatt: AC/DC ICs, DC/DC ICs, Advance power solutions
Tysso: Magnetic swipe readers, keyboards, bar code readers/scanners, POS systems.
Everlight: LED lighting solutions.
MPS: Monolithic power systems — regulators, low drop regulators, battery, chargers/protection, transformer based power supplies.
Narda Batteries: Batteries for telecom, UPS, power, solar energy, emergency lighting and power systems, mobile communications, radio, railways.
Taking on competition
India is also home to leading electronic components and distributors, such as Farnell. Contending with such stiff competition is key on the agenda.
Ranga Prasad adds: “In addition to the strategies mentioned earlier, we would like to re-inforce and strengthen our relationships with the universities’ research teams, and ensure that the engineers are aware of Mouser’s services and support when they are still in the universities.
“Mouser’s focus is driven by ensuring that the latest components are always available. Its stock profile is focused on electronic components, and not on other peripheral ranges.”
My dear friends, I am now in the process of selling off Pradeep’s Point! as well as all of my other blogs! :)
As most of you are probably aware, Webstatsdomain.org estimated Pradeep’s Point! at a whopping $19.1 billion in July 2014. As I write this post, the number has slightly reduced to $16.6 billion. Pradeep’s Point! is my flagship blog! ;)
It’s been a long time! I started Pradeep’s Point! back in 2007, having just returned to India after my second stint in Hong Kong and China. Actually, it was initially placed under Blogspot as Pradeep Chakraborty’s Blog – when it won the first international award – Pradeep Chakraborty’s Blog was selected as the best in the world in the Electronic Hardware category for 2008-10, by Electronics Weekly, UK. I remember and would again like to thank all of those folks who voted for me to the first ever international title! :)
Next, Pradeep Chakraborty’s Blog received an Honorable Mention @ Blognet Awards 2009! That’s also the time when someone succeeded in adding malware to that blog, and there was absolutely no fault of mine, and it was later removed by Google! I recall spending an entire night migrating the content to WordPress, where I had a secondary blog – Pradeep’s Point!
I moved on to WordPress, migrated all of the posts, and Pradeep’s Point! was reborn, or rather, born!
Thereafter, it has been hugely satisfying journey for me! I managed to pick up at least one international award / international recognition for all of my blogs, every year, till this year! ;) These are:
* PC’s Semicon Blog awarded the Top Digital Media Blog by Online IT Degree (in November 2010).
* Green Gadget of Texas, USA, awarded Pradeep’s Point! as the “Featured Tech Site” for 2011!
* In 2012, Gorkana, UK, selected Pradeep’s Point! as the Blog Influencer 2012!
* PC’s Telecom Blog listed among Best VoIP blogs by HostedSwitch, USA.
* In Feb. 2013, PC’s Electronic Components Blog selected as 100 Top Resources for Electrical Engineers on ElectricalEngineeringSchools.org, USA.
* In August 2014, PC’s Electronic Components Blog was ranked 11th in the “Top 101 Best Resources for Electrical Engineers.”
Now, this year, the huge estimation of Pradeep’s Point! by Webstatsdomain.org! :)
As I write, two folks – from Bangalore — are trying to gather funds to buy Pradeep’s Point! Although, my personal preference is for a very good friend! :)
The other five blogs up for sale are:
* PC’s Semiconductors Blog. (Won an award)
* PC’s Solar Photovoltaics Blog.
* PC’s Electronics Blog.
* PC’s Electronic Components Blog. (Won two awards)
* PC’s Telecom Blog. (Won an award)
I hope that the blogs will all remain, as will the content, but the owner (or owners) will be different! Perhaps, the blogs could have a different name!
Maybe, the new owners will try and keep me on board, too! ;) (I hope, they do).
I already have feelers, again from Bangalore, for buying out PC’s Semiconductors Blog and PC’s Electronic Components Blog. Again, I would prefer, if a friend, hopefully, tried to buy all of them, together! One blog definitely can’t do without the other – that’s my estimation! ;) Well, let’s see what happens!
So, my dear friends, once again, it has been a pleasure serving you all via my blogs! Now, they are in the process of being sold off. Whoever buys those, will definitely have a great future! :) (In case, I change my mind, the blogs will remain as they are! ;) )
About time ;) I guess!! Thanks everyone, for your tremendous love and continuous support! :)
“I’d rather attempt to do something great and fail, than to attempt to do nothing and succeed!” — Robert H. Schuller.
Yes, I definitely agree! :)
Optic2Connect will be present at this year’s DAC. I caught up with Sean Seah, project manager, to find out more.
First, what’s the company’s X factor and why? (What is it that makes your offering special and noteworthy – how are you different from competitors)?
Optic2Connect develops software solutions for the photonics industry. The demand to manage high volumes of data in networks, especially with the current smart-phone and cloud computing trend, has increased tremendously. As design gets more complex, simulation tools need to scale with regard to fidelity and accuracy.
Currently, photonic designers, scientists, and fabrication engineers adopt an approximated approach from the electrical data to build an equivalent optical model, hence losing on device physics details. At the same time the process is long as the model needs to be described block-by-block with denser blocks representing a more detailed model. Our competitors are well established in their respective domains, electrical or optical, but they are strong in their own respective fields. However, intimate knowledge in both are essential to fully understand this newer generation of photonic devices. Failure to understand fully results in false results from the manufacturing.
With patented know-how, Optic2Connect provides software solutions that SOLVES this pertinent challenge. It maps accurately simulations from one domain to another, e.g. electrical to optical. This technology has been developed by a team of researchers at A*Star – Singapore Public Research Institute. The technology overcomes error-prone and detailed oriented simulation setups. We demonstrated the ability to map without losing any fidelity in the simulation files.
Optic2Connect’s IP differs from its competitors because it simulates directly from the beginning device processing, to electrical device performance until the final high-speed optical eye diagram. This is in stark contrast to the usual method of representing their operation using simplified transfer functions.
Furthermore, the Optic2Connect design flow uses the same reliable tools and processes from the semiconductor industry that are fully compatible with the Complementary Metal Oxide Semiconductor (CMOS) fabrication process of silicon microelectronics. This design flow uses standard tools libraries, device models especially for active components such as modulators, and simulation of these components incorporating the models.
How have you been doing this year so far? Seah said: “It has been excellent! We are racing to complete our product prototypes and we secured a contract from an MNC and another from universities.”
What’s the future path likely to be? Seah added: “We intend to further validate our prototype with our partners from industry and academia, and integrating advanced modulation formats into our solutions. We want to offer a fully integrated solution for photonic devices to our customers. Our goal is to offer a one-stop solution for leading integrated-circuit (IC) manufacturers!”
Why this name? You sounded like a telecom company!
Seah said: “We strongly believe the future of communications is via optics which has the ability to circumvent the data bottleneck issues. Optic2Connect is meant to offer connect using optical communications. Our goal is a one-stop solution for optical connections. “
How will the solution significantly shorten product time-to-market and reduce development costs of photonics devices?
For complex photonics devices, minute changes to design parameters are significant and could affect loss performance, and operating voltage requirements. One common approach in the industry today is to physically build the variations into multiple device / runs and test them out. Each run cost is the range of hundreds of thousands and consume precious time. Especially, if the first batch of devices do not meet required parameters and additional batches are required. This cost both money and time, which in turn is more money.
Hence, Optic2Connect provides an elegant solution with our accurate modelling and simulation solutions, this accelerates manufacturing prototypes and at much lower production costs. Our software solutions provide a 10x improvement in time reduction and time to market. Further, our cloud solution overcomes traditional problems of insufficient servers / licenses, especially during periods of peak demand.
This is the third installment on verification, now, taken up by Synopsys. Regarding the biggest verification mistakes today, Arindam Ghosh, director – Global Technical Services, Synopsys India, attributed these as:
* Spending no time on verification planning (not documenting what needs to be verified) and focusing more on running simulations or on execution.
* No or very low investment in building better verification environments (based on best/new methodologies and best practices); instead maintaining older verification environments.
* Compromising on verification completeness because of tape out pressures and time-to-market considerations.
Would you agree that many companies STILL do not know how to verify a chip?
He said that it could be true for smaller companies or start-ups, but most of the major semiconductor design engineers know about the better approaches/methodologies to verify their chips. However, they may not be investing in implementing the new methodologies for multiple reasons and may instead continue to follow the traditional flows.
One way to address these mistakes would be to set up strong methodology teams to create a better verification infrastructure for future chips. However, few companies are doing this.
Are companies realizing this and building an infrastructure that gets you business advantage? He added that some companies do realize this and are investing in building a better infrastructure (in terms of better methodology and flows) for verification.
When should good verification start?
When should good verification start — after design; as you are designing and architecting your design environment? Ghosh said that good verification starts as soon as we start designing and architecting the design. Verification leads should start discussing the verification environment components with the lead architect and also start writing the verification plan.
Are folks mistaking by looking at tools and not at the verification process itself? According to him, tools play a major role in the effectiveness of any verification process, but we still see a lot of scope in methodology improvements beyond the tools.
What all needs to get into verification planning as the ‘right’ verification path is fraught with complexities? Ghosh said that there is no single, full-proof recipe for a ‘right’ verification path. It depends on multiple factors, including whether the design is a new product or derivative, the design application etc. But yes, it is very important to do comprehensive verification planning before starting the verification process.
Synopsys is said to be building a comprehensive, unified and integrated verification environment is required for today’s revolutionary SoCs and would offer a fundamental shift forward in productivity, performance, capacity and functionality. Synopsys’ Verification Compiler provides the software capabilities, technology, methodologies and VIP required for the functional verification of advanced SoC designs in one solution.
Verification Compiler includes:
* Better capacity and compile and runtime performance.
* Next-generation static and formal technology delivering performance improvement and the capacity to analyze a complete SoC (Property checking, LP, CDC, connectivity).
* Comprehensive low power verification solution.
* Verification planning and management.
* Next-generation verification IP and a deep integration between VIP and the simulation engine, which in turn can greatly improve productivity. The constraint engine is tuned for optimal performance with its VIP library. It has integrated debug solutions for VIP so one can do protocol-level analysis and transaction-based analysis with the rest of the testbench.
* Support for industry standard verification methodologies.
* X-propagation simulation with both RTL and low power simulations.
* Common debug platform with better debug technology having new capabilities, tight integrations with simulation, emulation, testbench, transaction debug, power-aware debug , hw/sw debug, formal, VIP and coverage.
Top five recommendations for verification
What would be Synopsys’ top five recommendations for verification?
* Spend a meaningful amount of time and effort on verification planning before execution.
* Continuously invest in building a better verification infrastructure and methodologies across the company for better productivity.
* Collaborate with EDA companies to develop, evaluate and deploy new technologies and flows, which can bring more productivity to verification processes.
* Nurture fresh talent through regular on and off-the-job trainings (on flows, methodologies, tools, technology).
* Conduct regular reviews of the completed verification projects with the goal of trying to improve the verification process after every tapeout through methodology enhancements.
Here is the concluding part of my discussion with Sam Fuller, CTO, Analog Devices. We discussed the technology aspects of Moore’s Law and
‘More than Moore’, among other things.
Are we at the end of Moore’s Law?
First, I asked Fuller that as Gordon Moore suggested – are we about to reach the end of Moore’s Law? What will it mean for personal computing?
Fuller replied: “There is definitely still life left in Moore’s law, but we’re leaving the golden age after the wonderful ride that we have had for the last 40 years. We will continue to make chips denser, but it is becoming difficult to continue to improve the performance as well as lower the power and cost.
“Therefore, as Moore’s law goes forward, more innovation is required with each new generation. As we move from Planer CMOS to FinFET (a new technology for multi-gate architecture of transistors); from silicon to more advanced materials Moore’s law will still have life for the next decade, but we are definitely moving into its final stages.
“For personal computing, there is still a lot of innovation left before we begin to run out of ideas. There will continue to be great advances in smart phones, mobile computing and tablets because software applications are really just beginning to take advantage of the phenomenal power and capacity of today’s semiconductors. The whole concept of ‘Internet of things’ will also throw up plenty of new opportunities.
“As we put more and more sensors in our personal gadgets, in factories, in industries, in infrastructures, in hospitals, and in homes and in vehicles, it will open up a completely new set of applications. The huge amount of data generated out of these sensors and wirelessly connected to the Internet will feed into the big data and analytics. This would create a plethora of application innovations.”
What’s happening in the plane?
The plane opportunity – 90nm – 65nm – 45nm – 22nm – 20nm – 14/18nm – is starting to get difficult and probably won’t work at 12nm, for purely physics reasons. What is Analog Devices’ take on this?
Fuller said: “You are right! We have been going from 45 nm down to lower nodes, it’ll probably go down to 10 nm, but we are beginning to run into some fundamental physics issues here. After all, it’s a relatively finite number of atoms that make up the channels in these transistors. So, you’re going to have to look at innovations beyond simply going down to finer dimensions.
“There are FinFETS and other ways that can help move you into the third dimension. We’re getting to a point where we can put a lot of complexity and a number of functions on a single die. We have moved beyond purely digital design to having more analog and mixed signal components in the same chip. There are also options such as stacked dies and multiple dies.
“Beyond integration on a single chip, Analog Devices leads in advanced packaging technologies for System in a Package (SiP) where sensors, digital and analog/mixed signal components are all in a single package as the individual components would typically use different technology nodes and it might not be practical to do such integration on a single die.
“So, the challenge often gets described as “More than Moore”, which is going beyond Moore’s law, bringing those capabilities to do analog processing as well as digital and then integrating sensors for temperature sensing, pressure sensing, motion sensing and a whole range of sensors integrated for enabling the ‘Internet of Things’.
“At Analog Devices, we have the capability in analog as well as digital, and having worked for over 20 years on MEMS devices, we are particularly well positioned as we get into ‘More than Moore’.”
Early this month, I caught up with Jaswnder Ahuja, corporate VP and MD, Cadence Desiign Systems India. With the global semiconductor industry having entered the sub-20nm era, there are a lot of things happening, and Cadence is sure to be present.
Performance in sub-2onm era
First, let’s see how’s the global semiconductor industry performing after entering the sub-20nm era.
Ahuja replied: “Increased demand for faster, smaller, low-power chips continues to drive the geometry shrink as one of the ways to manage the low-power, higher performance goals in smaller form factors—in other words, PPA is driving the move to advanced node design.
“At Cadence, we are seeing a lot of interest in the wireless space, which includes smartphones, tablets, and consumer devices. In this market, you must support different standards, the device must be really fast, it must have Internet access, and all this must be done at lower power so the that it does not drain the battery. We’re also seeing interest for advanced nodes in other segments such as computing and graphics processors.”
When speaking of advanced nodes, let’s also try and find out what Cadence is doing in helping achieve 10X faster power integrity analysis and signoff.
Cadence Voltus IC power integrity Solution is a full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies to designers for debugging, verifying, and fixing IC chip power consumption, IR drop, and electromigration (EM) constraints and violations.
The Voltus solution includes innovative technologies such as massively parallel execution, hierarchical architecture, and physically aware power grid analysis and optimization. Beneficial as a standalone power signoff tool, Voltus IC Power Integrity Solution delivers even more significant productivity gains when used in a highly integrated flow with other key Cadence products, providing the industry’s fastest design closure technology.
Developed with advanced algorithms and a new power integrity analysis engine with massively parallel execution, Voltus IC Power Integrity solution:
* Performs 10X faster than other solutions on the market.
* Supports very large designs—up to one billion instances—with its hierarchical architecture.
* Delivers SPICE-level accuracy.
* Enhances physical implementation quality via physically aware power integrity optimization.
Supported by major foundries and intellectual property (IP) providers, Voltus IC Power Integrity Solution has been validated and certified on advanced nodes processes such as 16nm FinFET and included in reference design flows such as for 3D-IC technology. Backed by Cadence’s rigorous quality control and product release procedures, the Voltus solution delivers best-in-class signoff quality on accuracy and stability for all process nodes and design technologies.
FinFETs to 20nm – are folks benefiting?
It is common news that FinFETs have gone to 20nm and perhaps, lower. Therefore, are those folks looking for power reduction now benefiting?
Ahuja replied that FinFETs allow semiconductor and systems companies to continue to develop commercially viable chips for the mobile devices that are dominating the consumer market. FinFETs enable new generations of high-density, high-performance, and ultra-low-power systems on chip (SoCs) for future smart phones, tablets, and other advanced mobile devices. Anyone who adopts FinFET technology will reap the benefits.
Foundry support for FinFETs will begin at 16nm and 14nm. In April of this year, Cadence announced a collaboration with ARM to implement the industry’s first ARM Cortex-A57 processor on TSMC’s 16nm FinFET manufacturing process. At ARM TechCon 2012, Cadence announced a 14nm test chip tapeout using an ARM Cortex-M0 processor and IBM’s FinFET process technology.