Non-mainstream packaging in MEMS, LED and power electronics

Source: Yole, France.

The number of MEMS and sensors going into mobile, consumer and gaming applications is expected to continue to skyrocket. As a result, OSAT and Wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, said Dr. Eric Mourier, Yole Developpement.

It implies that IDMs needs to find second source partnersand qualify some OSATs in order to secure their supply chain. Also, standardization(coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, and test cost of MEMS modules under control. There are many different players with different designs, and it’s not likely we’ll see one solution adopted by all the players.

As for wafer-level packaging (WLP) for LEDs, WLP has not been strongly deployed in the LED industry due to associated technical challenges. In the short-term, there is ESD integration in Si substrate. In the long-term, LED drivers could be integrated at the package level for Intelligent lighting. Ultimately, there are wafer-to-wafer manufacturing schemes for certain packaget types.

Real production of HB-LEDs with a mixed approach of WLP+through silicon vias (TSV) is just starting. There are some Taiwanese players such as TSMC, Xintec, Visera, Touch MicroTech and Sibdi, and South Korea-based LG Innotek. Additional players in the semiconductor and MEMS industry are seeking to enter the field.

Skin inspired electronics for mobile health

Prof. Zhenan Bao

Skin inspired electronics can be used for mobile health such as wireless sensor bands, cell phone and computer at doctor’s office, according to Prof. Zhenan Bao, Stanford University. She was delivering the inaugural lecture on day two of the ongoing 13th Global Electronics Summit in Santa Cruz, USA.

There are organic field-effect transistors (OTFTs). The current flow is moderated by binding of molecules and pressure. E-skin sensor functions have touch (pressure) sensors, chemical sensors and biological sensors. There are other flexible pressure sensors such as conductive rubber, which is thick and has hysteresis. Another type is poly-vinylidene fluoride (PVDF) thin film. Yet another type is the OTFT touch (pressure) sensor.

There is an example of the heart pulse measurement. Another related device is the full pulse wave for medical diagnostics such as blood pressure monitoring, detecting arrhythmia, heart defects and vascular diseases. In terms of temperature sensing, Stanford has developed a flexible body temperature sensor made of plastic.

There is chemical sensing as well. These are very stable and can be put in sea water. There are also electronics to mimic the body, such as the biodegradable OTFT. Another example is the transparent, stretchable pressure sensor. Finally, the other attribute of the human skin is self healing. Stanford University also developed the all-self-healing e-skin.

The e-skin concept ‘Super Skin’ has touch pressure sensors, chemical or biological sensors in air – electronic nose and liquid environments – electronic tongue, flexible strechable materials, biocompatible or biodegradable, self-powered — strechable solar cells and self healing.

Focus on SiC power electronics business 2020

SiC is implemented in several power systems and is gaining momentum and credibility.

Yole Developpement stays convinced that the most pertinent market for SiC lands in high and very high voltage (more than 1.2kV), where applications are less cost-driven and where few incumbent technologies can’t compete in performance. This transition is on its way as several device/module makers have already planned such products at short term.

Even though EV/HEV skips SiC, the industry could expand among other apps. The only question remains: Is there enough business to make so many contenders live decently? Probably, yes, as green-techs are expanding fast, strongly requesting SiC. Newcomers should carefully manage strategy and properly size capex according to the market size.

Source: Yole Developpement, France.

Power electronics industry outlook
Electronics systems were worth $122 billion in 2012, and will likely grow to $144 billion by 2020 at a CAGR of 1.9 percent. Power inverters will grow from $41 billion in 2012 to over $70 billion by 2020 at a CAGR of 7.2 percent. Semiconductor power devices (discretes and modules) will grow from $12.5 billion in 2012 to $21.9 billion by 2020 at a CAGR of 7.9 percent. Power wafers will grow $912 million in 2012 to $1.3 billion by 2020 at a CAGR of 5.6 percent.

Looking at the power electronics market in 2012 by application and the main expectations to 2015, computer and office will account for 25 percent, industry and energy 24 percent, consumer electronics 18 percent, automotive and transport 17 percent, telecom 7 percent and others 9 percent.

The main trends expected for 2013-2015 are:
* Significant increase of automotive sector following EV and HEV ramp-up.
* Renewable energies and smart-grid implementation will drive industry sector ramp-up.
* Steady erosion of consumer segment due to pressure on price (however, volumes (units) will keep on increase).

The 2011 power devices sales by region reveals that overall, Asia is still the landing-field for more than 65 percent of power products. Most of the integrators are located in China, Japan or Korea. Europe is very dynamic as well with top players in traction, grid, PV inverter, motor control, etc. Asia leads with 39 percent, followed by Japan with 27 percent, Europe with 21 percent and North America with 13 percent.

The 2011 revenues by company/headquarter locations reveals that the big-names of the power electronics industry are historically from Japan. Nine companies of the top-20 are Japanese. There are very few power manufacturers in Asia except in Japan. Europe and US are sharing four of the top five companies. Japan leads with 42 percent, followed by Europe and North America with 28 percent each, respectively, and Asia with 2 percent.

Looking at the TAM comparison for SiC (and GaN), very high voltage, high voltage of 2kV and medium voltage of 1.2kV appear as a more comfortable area for SiC. The apps are less cost-driven and SiC added value is obvious. Low voltage from 0-900V is providing strong competition with traditional silicon technologies, SJ MOSFET and GaN. There are cost-driven apps.

Outlook for electronics and semiconductors in 2013

Happy new year to everyone! Here is an outlook for the electronics and semiconductors sectors in 2013, provided by Jaswinder Ahuja, corporate VP and MD, Cadence Design Systems (India) Pvt Ltd. (Thanks a lot, Pallavi).

First, the past year, 2012, in review.

Jaswinder Ahuja.

Globally, 2012 has been a challenging year for the semiconductor industry with the economic slump in Europe and the US. However, the long term outlook remains positive, with Gartner reporting that the growth in the electronics and semiconductor industries will outpace world GDP growth till 2016.

In India, the ambiguity around the telecom market, traditionally the biggest consumer of semiconductor equipment, was the main handicap to growth. On the positive side, the passing of the National Policy on Electronics (NPE) in 2012 promises a much-needed fillip to the electronics ecosystem. In 2013 we expect to see a positive impact in terms of home-grown electronics thanks to the provisions of the Policy.

Worldwide technology trends in 2013
User experience is the driving force behind many of the semiconductor design trends that we will see in 2013 and beyond. Consumers are demanding devices on which games, music, cameras, internet, and other apps all run simultaneously and seamlessly. As a result, mobility, application-driven design, video, cloud and security, all of which enable an enhanced user experience, are the drivers of the electronics and semiconductor world today.

Mobility is the single biggest driver for the semiconductor industry. The pervasiveness of mobility does not only affect the telecommunications industry, but also entertainment, home electronics, automotive and medical electronics.

For example, cutting edge mobile solutions in the healthcare field include devices that can monitor blood pressure and blood sugar levels remotely, and then transmit the readings to the physician for diagnosis and treatment; in the automotive sector, in-vehicle infotainment is expected to be the next big thing and end-consumers can look forward to real-time traffic reports, weather information, and entertainment options from next-generation cars.

Mobility has fundamentally altered how we produce and consume information. In the future, we can expect that devices will go one step further and actually interact intelligently with the user – we see the first steps of that with Apple’s Siri software.

Mobility has also created a completely new market for applications that enable a more interactive and satisfying user experience. It is via applications that system companies differentiate themselves and stand apart from the competition. The need to have applications on all kinds of devices is posing unique challenges to the semiconductor and EDA companies.

Whereas traditionally the hardware (silicon) was built first and then the software was added later, now developing the software and designing the hardware are becoming a parallel process. This gives rise to new EDA technologies that enable early software development using software models of system hardware long before silicon is ready. We will see this new way of designing continue to be a challenge going into 2013.

Per reports from Cisco, video will soon drive more than 90 percent of all global traffic on the Internet. As more and more entertainment and collaboration tools are launched, bandwidth-hungry video traffic will drive growth both in the end consumer market (mobile platforms) and the enterprise space (networking industry).

The cloud is closely intertwined with the growth in mobility – it is the cloud of network servers and backbone equipment that deliver the content and value to all mobile devices. For every 600 smart phones and every 120 tablets, one dedicated server is needed. With the demand for mobiles showing accelerated growth, the need for cloud computing technologies will be another key driver for the semiconductor industry.

Security underpins our information age. The vast amount of data residing in mobile platforms and cloud architectures is extremely vulnerable. As we move into 2013, we foresee a sharper focus on securing data and critical infrastructure from theft and hacker attacks.

Round-up 2012: Best of electronics, semiconductors and solar

Friends, here is the round-up of 2012, where the best of electronics, semiconductors and solar PV are presented. Best wishes for a very happy and prosperous new year!

Also, a word on the horrendous Delhi rape that has shaken up India. I am ashamed to be a man and a part of India’s society. My family and I are extremely sorry that the brave girl is no more! May her soul rest in peace. May God deliver justice, and quickly!

DECEMBER 2012
Opportunities in turbulent PV equipment market

Global semiconductor industry outlook 2013: Jaswinder Ahuja, Cadence

Next wave of design challenges, and future growth of EDA: Dr. Wally Rhines

Global medical image sensors market to grow 64 percent by 2017

Status of power semiconductor devices industry

NOVEMBER 2012
Global solar PV industry to remain under pressure in 2013!

Dr. Wally Rhines on global semiconductor industry outlook 2013

Focus on monolithic 3D-ICs paradigm shift for semicon industry

Xilinx announces 20nm portfolio strategy

Elliptic intros world’s first commercial touchless gesturing technology!

Global semiconductor industry outlook 2013: Analog Devices

IMEC’s 450mm R&D initiative for nanoelectronics ecosystem

OCTOBER 2012
III-V high mobility semiconductors for advanced CMOS apps

Yet another electronics policy for India?

IEF 2012: Turning recession into opportunity!

Global semicon sales to drop 1.7 percent in 2012?

Virtual prototyping ready for masses

MEMS to be $21 billion market by 2017: Yole

TSMC on 450mm transition: Lithography key!

SEPTEMBER 2012
Cadence Allegro 16.6 accelerates timing closure

Dr. Wally Rhines on global EDA industry

Solarcon India 2012: Solar industry in third wave!

AUGUST 2012
Apple wins big vs. Samsung in patent war!

Can being fabless and M-SIPS take India to top?

JULY 2012
Is Europe ready for 450mm fabs?

APRIL 2012
Xilinx intros Vivado Design Suite

MARCH 2012
Cadence releases latest Encounter RTL-to-GDSII flow

WLCSP market and industrial trends

FEBRUARY 2012
Top 10 semiconductor growth drivers: Intersil

Ingredients for successful fabless Indian semiconductor industry: Dr. Wally Rhines

Tariffs will slow growth in domestic demand for PV systems: The Brattle Group

Wireless leads in global semicon spends!

JANUARY 2012
India to allow imports of low-priced Chinese solar cells? Or, is it beaten?

IMEC’s 450mm R&D initiative for nanoelectronics ecosystem

Roger de Keersmaecker, IMEC, Belgium, presented on IMEC’s 450mm R&D initiative in support of the nanoelectronics ecosystem at the Semicon Europa event in Dresden, Germany. IMEC has prepared an integrated 450mm R&D initiative. This will present an innovation engine supporting the global nanoelectronics ecosystem.

IMEC will play a key role in the acceleration of 450mm equipment development by timely installation of alpha/beta-demo tools for early learning, in an industry-relevant technology flow and ensuring patterning capability by early 2016. The 450mm R&D pilot line will enable full 450mm process capability for advanced nodes by early 2017.

Source: IMEC, Belgium.

Scaling
Logic device scaling slows down and ‘interim’ nodes are likely to be introduced. Disruptive devices are needed beyond 10nm. NAND flash is migrating from 2D floating gate to 3D SONOS device architecture.

Emerging memories are being introduced at 1x nm node. The parallel system scaling path done using 3D TSV technology is established and slowly gaining in momentum. Die cost is also exploding. There is an increasing need for an innovation pipeline, early design/technology co-optimization and cost reduction.

IMEC announced the opening of 300mm CR expansion on June 8, 2010. The cleanroom expansion is 450mm ready. There is 1,200m2 extra clean room space, and ready for EUV. Fab 1 is a 200mm pilot line and 5200 m2 CR (1750 m2 Class 1), with 24/7 continuous operation. Fab 2 is a 300mm pilot line with ball room, clean sub-fab, and 3200 m2 + 1200 m2 CR, also in 24/7 continuous operation.

IMEC started engineering new 450mm clean room in 2012. It has plans to stat constructing the clean room in 2013 and complete by 2015. The Flemish Minister of Innovation, Ingrid Lieten, announced to invest in the building of imec’s 450mm clean room facilities.

With the combination of a state-of-the-art 300mm clean room and the transition to 450mm, imec will be able to keep on delivering its partners topnotch research on (sub)-10nm devices enabling the future growth of the global nanoelectronics industry.

Yet another electronics policy for India?

India has once again announced an Electronics Policy, and frankly, I’ve lost count, how many times! Nevertheless, one hopes that this policy somehow takes off, and helps India get off the ground!  There are certain points in the policy that are worth a relook.

One, the setting up of electronic manufacturing clusters. This has been time and again stressed and re-stressed. Will it come around, this time? Let’s wait and watch, if it happens this time!

Two, as per the policy, there is a proposal for setting up two semiconductor wafer manufacturing fabrication facilities. Where? As far as one knows, there is hardly any infrastructure around to support even one semicon fab! Some people may say, Bangalore, but well, they are welcome to say that! As for people buying more of ‘domestically manufactured electronic goods’, it remains to be seen!

Three, back in 2007, when the SIPS program was announced, there were great expectations! If you recall some time ago, I mentioned that the Indian semiconductor policy, announced back in 2007, had supposedly expired on March 31, 2010! Then, the Indian industry came up with recommendations that included extending the Indian semicon policy up to March 2015! So, what happens to that? Or, is it dead and buried?

Four, back in 2007, the ‘ecosystem units’ were clearly defined as units, other than a fab unit, for manufacture of semiconductors, displays including LCDs, OLEDs, PDPs, any other emerging displays; storage devices; solar cells; photovoltaics; other advanced micro and nanotechnology products; and assembly and test of all the above products. What’s happening now?

Five, does all of this mean that the role of India-based semiconductor companies as a percentage of the semiconductor market globally, will improve? Or, do we take India as a system/gadget maker and thus, as a percentage of that market??

Six, fabrication is increasingly expensive, much involved and the actual global fabrication players are declining and will be about three to four companies. There is talk of 450mm fabs across the world! Have we even heard a word from India?

Okay, so let’s say, India will have two fabs? By when? What process technology? If it is a 450mm fab, India can very well kiss goodbye to this decade, at least. And, India continues to slip back in having a ((proper) fab!

Electronics For You has a new website!

EFY’s Website.

Electronics For You, India’s leading electronics magazine, has a brand new website (see image)!

This is a great effort made by the Web development team at EFY Enterprises  as the site was long overdue. This launch also co-incides with Electronics Rocks, an EFY event for design engineers that is taking place today and tomorrow in Bangalore.

The top most block is the Editor’s Choice, consisting of nine entry points, for now, to various stories. There is a smattering of choices – from Solar LED lantern to analog wattmeter, and to SMT components.

Folks, there is a block on Circuit Ideas! It is meant for all of those electronics geeks,who spend hours and hours browsing for new electronic designs and circuits!

Next, there is a block on videos, that runs things like  How to Solder Waterproof LED Strip Light to World’s first Mixed Domain Oscilloscope. This section should be quite captivating!

There are several other sections such as Innovators, Test & Measurement, Microcontrollers, Tech Focus, Interviews, etc. Career Trends is one section that is sure to get lot of hits!

A concern could be too many banner ads on the right, especially with the flash, moving parts, which makes for a really busy site. With two ads next to each other, just feels too busy. However, that’s what generates revenues, so maybe, it is fine!

The Electronics For You website is still in beta. The final version will go live on October 1, 2012. Kudos to the entire team at EFY!

Round-up 2011: Best of electronics, solar/PV and telecom

Here’s the best of electronics, solar/PV and telecom for the year 2011. Enjoy!

ELECTRONICS
M/H can truly deliver ‘real TV’ experience!

Cisco’s borderless networks architecture help enterprises overcome security challenges

Symantec releases latest Intelligence Report!

Norton cybercrime report 2011: Exposing the true scale!

Cloud deployment trends in APAC: IDC

Very fitting finale to Harry Potter!

XConnect’s VIE set to make video calls as easy as voice calls!

Vision technology can add valuable capabilities to electronic products: Jeff Bier, EVA

Tablets likely to transform ICT industry landscape: Computex 2011

Embedded Vision Alliance (EVA) is born!

Kotura leads the way in silicon photonics!

Aftermath of Japanese earthquake: Implications for global electronics industry!

Disruptions to global electronics supply chain following Japan’s quake!

Japanese quake and tsunami — too devastating to watch on TV!

What’s with attack toolkits and malicious websites?

SOLAR/PV
Global solar PV industry likely to be 22 GW in 2012!

HCPV on way to utility market!

Solar PV industry recommended to stay optimistic; US govt. supports India’s clean energy initiative!

Solarcon India 2011 begins with record exhibitors

PV inverter — innovations and market trends

Solar installations: How long will boom last?

Lessons to learn from Solyndra debacle!

Solar power becoming increasingly affordable: Dr. Charlie Gay

What’s happening with Indian solar/PV industry?

TELECOM
LogMeIn resolving IT challenges due to enterprise mobility!

Microsoft launches developer program for Windows Phone

Lava Mobiles launches classy S12 smartphone!

Steve Jobs: Master of the game!

Telesphere Videoconnect: Videoconferencing in the cloud!

Ether 1.3.1 phone adaptive antenna solution integrates with smartphones!

Wavion offers gamer changer in Wi-Fi offloading

Celebrating the World IPv6 Day!

Future material and devices for power electronics

Alexandre Avron, market analyst in power electronics, Yole Développement, provided a briefing on semiconductor material’s potential through an analysis of devices and systems for power electronics.

According to him,  there is still a bright future for silicon. It will keep good market share until at least 2016 and even further, being cost competitive and very standard. On the other side, SiC is more applied to higher voltages. These are the smallest markets, but probably the one requiring SiC properties the most. PV inverters and EV/HEV are at intermediary voltage levels, they could both be targeted by SiC and GaN, this makes the predictions very difficult.

No technical aspects helps in knowing which material will be more used. They have their advantages and drawbacks, and both deserve their place. Prediction must be based on developments advancements.

The points to watch about SiC and GaN devices include: samples availability is a main point for future integration, reliability is also a main concern, especially for SiC devices, voltage capability seems to keep GaN at smaller power, and cost: GaN appears to be potentially cheaper, as it is based on Si wafers and can be CMOS compatible.