Leaptech Corp. was established to help the electronics and semiconductor manufacturing companies in India achieve global standards by adopting the latest technologies available worldwide. It represents the world’s leading companies offering automation equipment for PCB assembly, semiconductor, automotive and final assembly automation.
Suresh Nair, director, said that Leaptech is helping the electronics, semiconductor and automotive manufacturing companies in India by bringing in world class technologies from across the globe in assembly automation, the technologies, which are state-of-the-art.
“We provide both pre-sales and post-sales support to all the systems and solutions that we offer, complete post-sales support includes installation, commissioning, training, production support and process support through our factory trained engineers strategically located in Delhi, Mumbai, Bangalore and Chennai.”
Leaptech provides audit and reconditioning services to enable customers improve productivity and uptime on their existing automated through hole and SMT assembly machines. Nair added: “We do provide audit and reconditioning services to customers where the machines were sold/supported by us. We may not be able to handle machines sold by other suppliers since that will be a breach of contract with out own principals.”
As for the training on operational and maintenance aspects of through hole insertion and SMT machines, Leaptech also provide complete training on machines for operation, periodical maintenance, trouble shooting as well as preventive maintenance.
Leaptech offers consultancy services for new electronics setup as well as for new projects in the existing facility, which includes all detailing as well as knowhow on the process of assembly/production. our expert team is upto date with all latest trends in this industry.
Connected mobile devices
It will be interesting to get Leaptech opinon regarding connected mobile devices. Nair said that connected mobile devices would grow for sure in the immediate future. Growth in the long term may depend on the contents of this segment and how interesting it is to the users.
With regard to automotive electronics driving energy efficiency, he added that Leaptech mostly sells automation equipment and the scope for these equipment toward energy efficiency for automotive sector is limited.
Indian electronics scenario in 2014 and beyond
According to Nair, the Indian electronics scenario is still dull and this may continue in the next year as well. Things could improve once the new manufacturing policy announced by the government starts seeing some investments.
To boost electronics manufacturing in India, it requires a simple action plan: make all finished electronics products imports more expensive and give incentives to local manufacturing.
However, he felt that nanotech will not emerge as a disruption in India, at least, not in the near future. It may make some impact in the long run.
DP Electronics eK (Deutsche Power), based in Germany, with an office in Hong Kong, is showcasing power electronics products at Gitex 2013. It has assembling partners in Hong Kong, Hungary, China, Taiwan and Germany.
Helen Long, manager, International Affairs, said that the company’s mission is to be the best supplier of power solutions. The company will continue to tailor products for market needs, while maintaining high quality, integrated customer service and prompt delivery.
The cycle time for the development of new models of UPS has been rapidly shortening as the manufacturers take advantage of the latest advancements in the use of microprocessors (MPUs) and power semiconductor devices. Hence, the supplier’s products are also becoming lighter, smaller and increasingly intelligent, with a dramatic effect on cost reduction. DP Electronics’ range of UPS include over 60 models/ratings.
Some of its products include the DH series sine-wave inverter (1 KVA-2 KVA), suitable for small/medium home equipment, office and public devices, home lighting systems, fabrication and control systems, PCs, PoS devices, etc. The SOLO series simulated sine-wave inverters (1 KVA-2 KVA) is useful for tubelights, TVs. computers, stereos, PBXs, etc.
It is also offering solar panels (100W-300W), as well as off-grid and on-grid PV imverters with MPPT solar charger, and a PV charge controller. DP Electronics is also displaying optoelectronic LED lights for ceilings, corn ligts, warehouse lights, flood lights, spot lights and other lights of different concepts.
Among UPS, it is offering the XL Plus series line interactive UPS (650VA-3KVA), Elentra series line interactive sinewave UPS (1KVA-6KVA), Elektra series online high frequency UPS (1KVA-30KVA) and 1KVA~10KVA models. The Elektra series is available as online industrial grade UPS — 10KVA~60KVA models and 10KVA-3.5MVA models, respectively. Then, there is the Fuhrer series of modular online UPS from 10KVA~100KVA.
The supplier is also offering VRLA/SLA/GEL batteries in 2V/6V/12V types
Yesterday evening, the Indian Cabinet Committee on Economic Affairs has approved setting up of Information Technology Investment Region (ITIR) near Hyderabad.
The Phase I of this project will be from 2013 to 2018 and Phase II will be from 2018 to 2038. The Government of Andhra Pradesh has delineated an area of 202 sq. kms. for the proposed ITIR in three clusters/ agglomerations viz.:
(i) Cyberabad Development Area and its surroundings,
(ii) Hyderabad Airport Development area and Maheshwaram in the south of Hyderabad, and
(iii) Uppal and Pocharam areas in eastern Hyderabad. The ITIR will be implemented in two phases.
Next, the Government of India finalized the setting up of a ‘Ultra-Mega Green Solar Power Project’ in Rajasthan in the SSL (Sambhar Salts Ltd, a subsidiary of Hindustan Salts Ltd – a Central Public Sector Enterprise under the Department of Heavy Industry, Ministry of Heavy Industries & Public Enterprises) area close to Sambhar Lake, about 75 kms from Jaipur.
Further, India was recognized as ‘Authorizing Nation’ under the international Common Criteria Recognition Arrangement (CCRA) to test and certify electronics and IT products with respect to cyber security. India has become the 17th nation to earn this recognition.
Then again, the ‘HTML 5.0 Tour in India’ has now reached Hyderabad.
Also, India has offered to help Cuba develop its renewable energy resources. This has been conveyed to Marino Murillo, vice president of the Republic of Cuba at Havana, by Dr. Farooq Abdullah, Minister of New and Renewable Energy, during his trip to Cuba.
All of this is really brilliant stuff!
At least, I have never seen or heard about so much activity happening, especially in the electronics and solar PV sectors. One sincerely hopes that all of these initiatives will allow India to come to the forefront of the global electronics industry.
The spark seems to be coming back to the India electronics industry, after a very, very long wait! It is hoped that this stays on!!
The number of MEMS and sensors going into mobile, consumer and gaming applications is expected to continue to skyrocket. As a result, OSAT and Wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, said Dr. Eric Mourier, Yole Developpement.
It implies that IDMs needs to find second source partnersand qualify some OSATs in order to secure their supply chain. Also, standardization(coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, and test cost of MEMS modules under control. There are many different players with different designs, and it’s not likely we’ll see one solution adopted by all the players.
As for wafer-level packaging (WLP) for LEDs, WLP has not been strongly deployed in the LED industry due to associated technical challenges. In the short-term, there is ESD integration in Si substrate. In the long-term, LED drivers could be integrated at the package level for Intelligent lighting. Ultimately, there are wafer-to-wafer manufacturing schemes for certain packaget types.
Real production of HB-LEDs with a mixed approach of WLP+through silicon vias (TSV) is just starting. There are some Taiwanese players such as TSMC, Xintec, Visera, Touch MicroTech and Sibdi, and South Korea-based LG Innotek. Additional players in the semiconductor and MEMS industry are seeking to enter the field.
Skin inspired electronics can be used for mobile health such as wireless sensor bands, cell phone and computer at doctor’s office, according to Prof. Zhenan Bao, Stanford University. She was delivering the inaugural lecture on day two of the ongoing 13th Global Electronics Summit in Santa Cruz, USA.
There are organic field-effect transistors (OTFTs). The current flow is moderated by binding of molecules and pressure. E-skin sensor functions have touch (pressure) sensors, chemical sensors and biological sensors. There are other flexible pressure sensors such as conductive rubber, which is thick and has hysteresis. Another type is poly-vinylidene fluoride (PVDF) thin film. Yet another type is the OTFT touch (pressure) sensor.
There is an example of the heart pulse measurement. Another related device is the full pulse wave for medical diagnostics such as blood pressure monitoring, detecting arrhythmia, heart defects and vascular diseases. In terms of temperature sensing, Stanford has developed a flexible body temperature sensor made of plastic.
There is chemical sensing as well. These are very stable and can be put in sea water. There are also electronics to mimic the body, such as the biodegradable OTFT. Another example is the transparent, stretchable pressure sensor. Finally, the other attribute of the human skin is self healing. Stanford University also developed the all-self-healing e-skin.
The e-skin concept ‘Super Skin’ has touch pressure sensors, chemical or biological sensors in air – electronic nose and liquid environments – electronic tongue, flexible strechable materials, biocompatible or biodegradable, self-powered — strechable solar cells and self healing.
SiC is implemented in several power systems and is gaining momentum and credibility.
Yole Developpement stays convinced that the most pertinent market for SiC lands in high and very high voltage (more than 1.2kV), where applications are less cost-driven and where few incumbent technologies can’t compete in performance. This transition is on its way as several device/module makers have already planned such products at short term.
Even though EV/HEV skips SiC, the industry could expand among other apps. The only question remains: Is there enough business to make so many contenders live decently? Probably, yes, as green-techs are expanding fast, strongly requesting SiC. Newcomers should carefully manage strategy and properly size capex according to the market size.
Power electronics industry outlook
Electronics systems were worth $122 billion in 2012, and will likely grow to $144 billion by 2020 at a CAGR of 1.9 percent. Power inverters will grow from $41 billion in 2012 to over $70 billion by 2020 at a CAGR of 7.2 percent. Semiconductor power devices (discretes and modules) will grow from $12.5 billion in 2012 to $21.9 billion by 2020 at a CAGR of 7.9 percent. Power wafers will grow $912 million in 2012 to $1.3 billion by 2020 at a CAGR of 5.6 percent.
Looking at the power electronics market in 2012 by application and the main expectations to 2015, computer and office will account for 25 percent, industry and energy 24 percent, consumer electronics 18 percent, automotive and transport 17 percent, telecom 7 percent and others 9 percent.
The main trends expected for 2013-2015 are:
* Significant increase of automotive sector following EV and HEV ramp-up.
* Renewable energies and smart-grid implementation will drive industry sector ramp-up.
* Steady erosion of consumer segment due to pressure on price (however, volumes (units) will keep on increase).
The 2011 power devices sales by region reveals that overall, Asia is still the landing-field for more than 65 percent of power products. Most of the integrators are located in China, Japan or Korea. Europe is very dynamic as well with top players in traction, grid, PV inverter, motor control, etc. Asia leads with 39 percent, followed by Japan with 27 percent, Europe with 21 percent and North America with 13 percent.
The 2011 revenues by company/headquarter locations reveals that the big-names of the power electronics industry are historically from Japan. Nine companies of the top-20 are Japanese. There are very few power manufacturers in Asia except in Japan. Europe and US are sharing four of the top five companies. Japan leads with 42 percent, followed by Europe and North America with 28 percent each, respectively, and Asia with 2 percent.
Looking at the TAM comparison for SiC (and GaN), very high voltage, high voltage of 2kV and medium voltage of 1.2kV appear as a more comfortable area for SiC. The apps are less cost-driven and SiC added value is obvious. Low voltage from 0-900V is providing strong competition with traditional silicon technologies, SJ MOSFET and GaN. There are cost-driven apps.
Happy new year to everyone! Here is an outlook for the electronics and semiconductors sectors in 2013, provided by Jaswinder Ahuja, corporate VP and MD, Cadence Design Systems (India) Pvt Ltd. (Thanks a lot, Pallavi).
First, the past year, 2012, in review.
Globally, 2012 has been a challenging year for the semiconductor industry with the economic slump in Europe and the US. However, the long term outlook remains positive, with Gartner reporting that the growth in the electronics and semiconductor industries will outpace world GDP growth till 2016.
In India, the ambiguity around the telecom market, traditionally the biggest consumer of semiconductor equipment, was the main handicap to growth. On the positive side, the passing of the National Policy on Electronics (NPE) in 2012 promises a much-needed fillip to the electronics ecosystem. In 2013 we expect to see a positive impact in terms of home-grown electronics thanks to the provisions of the Policy.
Worldwide technology trends in 2013
User experience is the driving force behind many of the semiconductor design trends that we will see in 2013 and beyond. Consumers are demanding devices on which games, music, cameras, internet, and other apps all run simultaneously and seamlessly. As a result, mobility, application-driven design, video, cloud and security, all of which enable an enhanced user experience, are the drivers of the electronics and semiconductor world today.
Mobility is the single biggest driver for the semiconductor industry. The pervasiveness of mobility does not only affect the telecommunications industry, but also entertainment, home electronics, automotive and medical electronics.
For example, cutting edge mobile solutions in the healthcare field include devices that can monitor blood pressure and blood sugar levels remotely, and then transmit the readings to the physician for diagnosis and treatment; in the automotive sector, in-vehicle infotainment is expected to be the next big thing and end-consumers can look forward to real-time traffic reports, weather information, and entertainment options from next-generation cars.
Mobility has fundamentally altered how we produce and consume information. In the future, we can expect that devices will go one step further and actually interact intelligently with the user – we see the first steps of that with Apple’s Siri software.
Mobility has also created a completely new market for applications that enable a more interactive and satisfying user experience. It is via applications that system companies differentiate themselves and stand apart from the competition. The need to have applications on all kinds of devices is posing unique challenges to the semiconductor and EDA companies.
Whereas traditionally the hardware (silicon) was built first and then the software was added later, now developing the software and designing the hardware are becoming a parallel process. This gives rise to new EDA technologies that enable early software development using software models of system hardware long before silicon is ready. We will see this new way of designing continue to be a challenge going into 2013.
Per reports from Cisco, video will soon drive more than 90 percent of all global traffic on the Internet. As more and more entertainment and collaboration tools are launched, bandwidth-hungry video traffic will drive growth both in the end consumer market (mobile platforms) and the enterprise space (networking industry).
The cloud is closely intertwined with the growth in mobility – it is the cloud of network servers and backbone equipment that deliver the content and value to all mobile devices. For every 600 smart phones and every 120 tablets, one dedicated server is needed. With the demand for mobiles showing accelerated growth, the need for cloud computing technologies will be another key driver for the semiconductor industry.
Security underpins our information age. The vast amount of data residing in mobile platforms and cloud architectures is extremely vulnerable. As we move into 2013, we foresee a sharper focus on securing data and critical infrastructure from theft and hacker attacks.
Roger de Keersmaecker, IMEC, Belgium, presented on IMEC’s 450mm R&D initiative in support of the nanoelectronics ecosystem at the Semicon Europa event in Dresden, Germany. IMEC has prepared an integrated 450mm R&D initiative. This will present an innovation engine supporting the global nanoelectronics ecosystem.
IMEC will play a key role in the acceleration of 450mm equipment development by timely installation of alpha/beta-demo tools for early learning, in an industry-relevant technology flow and ensuring patterning capability by early 2016. The 450mm R&D pilot line will enable full 450mm process capability for advanced nodes by early 2017.
Logic device scaling slows down and ‘interim’ nodes are likely to be introduced. Disruptive devices are needed beyond 10nm. NAND flash is migrating from 2D floating gate to 3D SONOS device architecture.
Emerging memories are being introduced at 1x nm node. The parallel system scaling path done using 3D TSV technology is established and slowly gaining in momentum. Die cost is also exploding. There is an increasing need for an innovation pipeline, early design/technology co-optimization and cost reduction.
IMEC announced the opening of 300mm CR expansion on June 8, 2010. The cleanroom expansion is 450mm ready. There is 1,200m2 extra clean room space, and ready for EUV. Fab 1 is a 200mm pilot line and 5200 m2 CR (1750 m2 Class 1), with 24/7 continuous operation. Fab 2 is a 300mm pilot line with ball room, clean sub-fab, and 3200 m2 + 1200 m2 CR, also in 24/7 continuous operation.
IMEC started engineering new 450mm clean room in 2012. It has plans to stat constructing the clean room in 2013 and complete by 2015. The Flemish Minister of Innovation, Ingrid Lieten, announced to invest in the building of imec’s 450mm clean room facilities.
With the combination of a state-of-the-art 300mm clean room and the transition to 450mm, imec will be able to keep on delivering its partners topnotch research on (sub)-10nm devices enabling the future growth of the global nanoelectronics industry.