FPGAs serve highly diverse applications. Tailored devices are serving diverging market needs. According to Vince Hu, VP Product & Corporate Marketing, Altera Corp., next-generation portfolio involves an ideal mix of process technologies.
There is greater diversity and capabilities for the broadest range of applications. Finally, Altera has added the 55nm EmbFlash that extends Altera’s tailored approach. Hu was speaking at the 13th Globalpress Electronics Summit being held in Santa Cruz, USA.
Addressing needs of higher-volume systems is key. Industrial and automotive systems tend to be cost sensitive, low power and limited in broad areas. There is an increased pressure to innovate leading to a strong demand for programmable solutions with enhanced features. Altera is expanding the capabilities of non-volatile programmable logic devices (PLDs).
Altera is also bolstering high-volume system solutions. TSMC leading-edge embedded flash technology is a device tailored for high-volume applications. It adds more functionality to non-volatile PLDs. It also re-inforces Altera’s commitment to high-volume applications.
In addressing power/performance challenges, 20SoC is said to be the quickest path to next-generation process. It is tailored for a range of performance and bandwidth-critical applications. There is up to 60 percent lower power vs. 28nm. One of the latest results with 20SoC process is the first 32Gbps transceivers that are operating in 20nm silicon.
Currently, high-end applications are pushing the envelope. Intel’s 14nm tri-gate is said to be a game changer for FPGAs. Tri-gate
surrounds channel on the three sides. It increases channel performance and reduces power. Tri-gate is a proven, second- generation technology. The 14nm tri-gate maintains the Moore’s Law.
Driving toward 400G OTN systems
Altera has acquired OTN IP provider TPACK. It accelerates the company’s OTN roadmap and builds on the Avalon acquisition in 2010. OTN IP, combined with high-performance silicon, positions Altera for continued growth in the high-end networking market.
Tailored devices are now serving diverging market needs. It is an extension of Altera’s tailored approach. There are even greater diversity and capabilities, serving the broadest range of applications. A mixture of application-specific IP provides even greater tailored solutions. Altera is mixing the advanced FinFET process, traditional HKMG planar process and embedded flash technology.
At the ISA CXO Conclave, Matt Grob, SVP, corporate R&D, Qualcomm, said that the company is a world leader in next-generation mobile technologies. It is celebrating 25 years of driving the evolution of wireless communications. It is making wireless more personal, affordable and accessible to people everywhere. Qualcomm is also the world’s largest fabless semiconductor company, #1 in wireless, and #9 in semiconductors.
Qualcomm’s unique business model is to be a technology enabler for the entire mobile value chain. It has continued strategic R&D investments, totalling more than $15.4 billion in 2010.
The 2G to 3G migration is currently taking place, with over 3.1 billion 3G subscriptions likely in 2015. As for the emerging region growth, China leads with 640 percent, followed by Latin America at 465 percent and India at 168 percent, respectively.
Qualcomm is also said to be enabling the mobile broadband in India with 3G and LTE. Besides growing the LTE TDD ecosystem in region, it is building partnerships for long-term strategy and establishing 3G/LTE as best technology path for operators. Qualcomm is also driving the device evolution and growing the market by creating more choices for operators and consumers. It is developing low-cost 3G handsets for emerging markets using 1+ GHz mobile processors and supporting multiple popular OS.
The smartphone industry momentum has ensured that the ecosystem is benefitting from and driving growth. There has been as much as >25 percent YoY data revenue growth from leading operators. OEMs have launched 100+ new smartphones in the first half of CY 2010. The total mobile apps downloads from developers is likely to move up from 7 billion in 2009 to 50 billion by 2012.
As a follow-on to his April 2010 global semiconductor forecast numbers, Mike Cowan constructed (and updated) a table (sourced from the GSA website in order to compare the latest 2010 sales growth forecasts from a large number of leading market researchers to his latest sales growth forecast estimate of 33.4 percent.
Notice that for the thirteen (13) yellow-highlighted market researchers shown in the attached table (including mine), 12 of the market watchers have increased their most recent forecast year-over-year sales growths to a range of 22.6 percent to 33.4 percent with a mean sales growth forecast of 28.7 percent (28.4 percent without Cowan’s forecast number).
As revealed in the table, Cowan’s most recent 2010 sales growth forecast estimate is the most bullish of the bunch (at least for this month; stay tuned for my monthly forecast numbers as the year plays out!).
Also note that the just published (last week – June 8 and 10, respectively), WSTS and SIA Spring 2010 forecast sales growth results for 2010 are included in the table.
Here is the concluding part of my conversation with Synopsys’ Rich Goldman on the global semiconductor industry.
Global semicon in sub 20nm era
How is the global semicon industry performing after entering the sub 20nm era? Rich Goldman, VP, corporate marketing and strategic alliances, Synopsys, said that driving the fastest pace of change in the history of mankind is not for the faint of heart. Keeping up with Moore’s Law has always required significant investment and ingenuity.
“The sub-20nm era brings additional challenges in device structures (namely FinFETs), materials and methodologies. As costs rise, a dwindling number of semiconductor companies can afford to build fabs at the leading edge. Those thriving include foundries, which spread capital expenses over the revenue from many customers, and fabless companies, which leverage foundries’ capital investment rather than risking their own. Thriving, leading-edge IDMs are now the exception.
“Semiconductor companies focused on mobile and the Internet of Things are also thriving as their market quickly expands. Semiconductor companies who dominate their space in such segments as automotive, mil/aero and medical are also doing quite well, while non-leaders find rough waters.”
Performance of FinFETs
Have FinFETs gone to below 20nm? Also, are those looking for power reduction now benefiting?
He added that 20nm was a pivotal point in advanced process development. The 20nm process node’s new set of challenges, including double patterning and very leaky transistors due to short channel effects, negated the benefits of transistor scaling.
To further complicate matters, the migration from 28nm to 20nm lacked the performance and area gains seen with prior generations, making it economically questionable. While planar FET may be nearing the end of its scalable lifespan at 20nm, FinFETs provide a viable alternative for advanced processes at emerging nodes.
The industry’s experience with 20nm paved the way for an easier FinFET transition. FinFET processes are in production today, and many IC design companies are rapidly moving to manufacture their devices on the emerging 16nm and 14nm FinFET-based process geometries due to the compelling power and performance benefits. Numerous test chips have taped out, and results are coming in.
“FinFET is delivering on its promise of power reduction. With 20nm planar FET technologies, leakage current can flow across the channel between the source and the drain, making it very difficult to completely turn the transistor off. FinFETs provide better channel control, allowing very little current to leak when the device is in the “off” state. This enables the use of lower threshold voltages, resulting in better power and performance. FinFET devices also operate at a lower nominal voltage supply, significantly improving dynamic power.”
Early this month, I caught up with Jaswnder Ahuja, corporate VP and MD, Cadence Desiign Systems India. With the global semiconductor industry having entered the sub-20nm era, there are a lot of things happening, and Cadence is sure to be present.
Performance in sub-2onm era
First, let’s see how’s the global semiconductor industry performing after entering the sub-20nm era.
Ahuja replied: “Increased demand for faster, smaller, low-power chips continues to drive the geometry shrink as one of the ways to manage the low-power, higher performance goals in smaller form factors—in other words, PPA is driving the move to advanced node design.
“At Cadence, we are seeing a lot of interest in the wireless space, which includes smartphones, tablets, and consumer devices. In this market, you must support different standards, the device must be really fast, it must have Internet access, and all this must be done at lower power so the that it does not drain the battery. We’re also seeing interest for advanced nodes in other segments such as computing and graphics processors.”
When speaking of advanced nodes, let’s also try and find out what Cadence is doing in helping achieve 10X faster power integrity analysis and signoff.
Cadence Voltus IC power integrity Solution is a full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies to designers for debugging, verifying, and fixing IC chip power consumption, IR drop, and electromigration (EM) constraints and violations.
The Voltus solution includes innovative technologies such as massively parallel execution, hierarchical architecture, and physically aware power grid analysis and optimization. Beneficial as a standalone power signoff tool, Voltus IC Power Integrity Solution delivers even more significant productivity gains when used in a highly integrated flow with other key Cadence products, providing the industry’s fastest design closure technology.
Developed with advanced algorithms and a new power integrity analysis engine with massively parallel execution, Voltus IC Power Integrity solution:
* Performs 10X faster than other solutions on the market.
* Supports very large designs—up to one billion instances—with its hierarchical architecture.
* Delivers SPICE-level accuracy.
* Enhances physical implementation quality via physically aware power integrity optimization.
Supported by major foundries and intellectual property (IP) providers, Voltus IC Power Integrity Solution has been validated and certified on advanced nodes processes such as 16nm FinFET and included in reference design flows such as for 3D-IC technology. Backed by Cadence’s rigorous quality control and product release procedures, the Voltus solution delivers best-in-class signoff quality on accuracy and stability for all process nodes and design technologies.
FinFETs to 20nm – are folks benefiting?
It is common news that FinFETs have gone to 20nm and perhaps, lower. Therefore, are those folks looking for power reduction now benefiting?
Ahuja replied that FinFETs allow semiconductor and systems companies to continue to develop commercially viable chips for the mobile devices that are dominating the consumer market. FinFETs enable new generations of high-density, high-performance, and ultra-low-power systems on chip (SoCs) for future smart phones, tablets, and other advanced mobile devices. Anyone who adopts FinFET technology will reap the benefits.
Foundry support for FinFETs will begin at 16nm and 14nm. In April of this year, Cadence announced a collaboration with ARM to implement the industry’s first ARM Cortex-A57 processor on TSMC’s 16nm FinFET manufacturing process. At ARM TechCon 2012, Cadence announced a 14nm test chip tapeout using an ARM Cortex-M0 processor and IBM’s FinFET process technology.
Its been warm and sunny in Dubai, UAE, host to the Gitex Technology Week 2013, at the Dubai World Trade Center. Opening today, the show is literally the live wire for the Middle East technology roadmap.
Well, it seems that this show is all about the Big Data and cloud. On Oct. 21st, there is the Cloud Confex, where enterprises can learn how they can achieve the benefits of transformation. Are the CIOs and the businesses really prepared for Big Data? You can find that out by attending the session on Big Data on Oct. 22nd. There is the digital strategies day as well, on Oct. 23rd, where enterprises can find out more about how to integrate mobile and social media into their business models. This session should help you understand what customers or users do online, and more importantly, why they do that!
There are said to be 1,500 or so exhibitors at Gitex 2013. My attention was drawn to the gsmExchange, said to be the global trading platform for mobile phone wholesale since 2000. You can buy or sell mobiles phones as well as refurbished mobile phones at this portal. You can also buy and sell mobile phone accessories as well. Kaspersky Lab has a large booth, catering to the Internet security and mobile security products. Cisco is showcasing its intelligent network products portfolio.
Elsewhere, there’s news about Datawind, and its low-cost phablet for the Indian market at Rs. 6,999 (taxes extra). Cyberoam is showcasing the next generation firewall (NGFW) and its enterprise security offerings. TP-LINK has launched its flagship 802.11ac wireless router, which is providing up to 1750Mbps of wireless bandwidth and set to change the way we look at home networking.
Olivetti is presenting innovative solutions and products whose features will be of particular interest to banks and post offices, such as the revolutionary MB-2 ADF, an all-in-one product for bank front offices that combines specialised printer functions with those of an A4 scanner, a cheque reader and allows the automatic multi-page documents feed thanks to the ADF. It is also displaying the Oliscan A600, a duplex colour scanner, the M206 and M210 multiservice terminals, and so on.
I saw a booth from Dubai Silicon Oasis Authority (DSOA), which is showcasing the park’s hi-tech ecosystem. Five years ago, when I was in Dubai, the director had informed me that the DSOA was large enough to fit in eight wafer fabs! Where are those fabs, dear sirs? Does it seem that the focus has shifted from fabs to providing incentives and state-of-the-art infrastructure to technology companies looking to set up shop in Dubai? We will try and find out, time permitting.
There is a strong presence of the local government, with large booths showcasing their wares. The Dubai Smart Government has introduced several new applications, such as the mobile gateway app – mDubai, mPay app, HR self-service app, MyID and iProc mobile app, and the suggestions and complaints app. Great work!
There are large booths mostly, especially from Etisalat, the Middle East’s leading telecommunications operator and one of the largest corporations in the six Arab countries of the Gulf Co-operation Council, Intel, which is showcasing its enterprise solutions, and Huawei, which is targeting the data centers, as well as enterprises.
There will be more updates tomorrow, as I’ve to rush for a meeting.