We are in December, and its time for outlook 2014! First, I met up with Neeraj Varma, director-Sales, India, Xilinx. He said: “We expect the 28nm to do really well. From Apr. 13-Mar. 14, we expect revenues worth $250 milion from the 28nm line.
“We are now looking at the embedded market – and expect about $2 billion serviceable available market (SAM). We are looking at $8 billion SAM at the ASIC/ASSP displacement market, and of course $6 billion SAM for core PLD.” After a long time, Xilinx has been seeing positive capex. “We are entering a growth cycle for service providers and enterprises,” he added.
A macro view of capex equipment spend is driven by LTE 27.2 percent at 2011-16, and optical networks 15.9 percent. The other areas include data center, enterprise switching and routing, and service provider switching and routing. Next, 3D ICs will enable Nx100G OTN, 400G OTN, MuxSAR, as well as top of the rack switch, I/O virtualization.
Earlier, there were less than 50 ASICs start in communications in the top 10 OEMs. There were less than 20 28nm ASIC starts in at top 10 OEMs. As of 2012, less than 50 percent of the top 16 ASSPs vendors were losing money. Customer needs are diverse now. Companies end up over designing a chip. People end up paying for what trey are not using.
Xilinx is offering the SMARTCORE IP for smarter networks and data centers. “40 percent of our wins have been achieved by integrating or displacing ASICs and ASSPs,” he said. “We have 25 percent total wins across a broad set of apps/portfolio.”
Some other gains for Xilinx:
* Xilinx gained 3 percent increase in PLDs.
* In wired and data centers, it has 12-percent CAGR from 2013-16.
* In wireless, it has 10-12 percent CAGR.
* In automotive smarter vision, it has 20 percent CAGR growth.
* In industrial, scientific and medical (ISM), it has 12 percent CAGR growth.
* In FY13E-FY16E, Xilinx expects to grow 8-12 percent, and has plans to increase the R&D revenue to 8.6 percent.
Leaptech Corp. was established to help the electronics and semiconductor manufacturing companies in India achieve global standards by adopting the latest technologies available worldwide. It represents the world’s leading companies offering automation equipment for PCB assembly, semiconductor, automotive and final assembly automation.
Suresh Nair, director, said that Leaptech is helping the electronics, semiconductor and automotive manufacturing companies in India by bringing in world class technologies from across the globe in assembly automation, the technologies, which are state-of-the-art.
“We provide both pre-sales and post-sales support to all the systems and solutions that we offer, complete post-sales support includes installation, commissioning, training, production support and process support through our factory trained engineers strategically located in Delhi, Mumbai, Bangalore and Chennai.”
Leaptech provides audit and reconditioning services to enable customers improve productivity and uptime on their existing automated through hole and SMT assembly machines. Nair added: “We do provide audit and reconditioning services to customers where the machines were sold/supported by us. We may not be able to handle machines sold by other suppliers since that will be a breach of contract with out own principals.”
As for the training on operational and maintenance aspects of through hole insertion and SMT machines, Leaptech also provide complete training on machines for operation, periodical maintenance, trouble shooting as well as preventive maintenance.
Leaptech offers consultancy services for new electronics setup as well as for new projects in the existing facility, which includes all detailing as well as knowhow on the process of assembly/production. our expert team is upto date with all latest trends in this industry.
Connected mobile devices
It will be interesting to get Leaptech opinon regarding connected mobile devices. Nair said that connected mobile devices would grow for sure in the immediate future. Growth in the long term may depend on the contents of this segment and how interesting it is to the users.
With regard to automotive electronics driving energy efficiency, he added that Leaptech mostly sells automation equipment and the scope for these equipment toward energy efficiency for automotive sector is limited.
Indian electronics scenario in 2014 and beyond
According to Nair, the Indian electronics scenario is still dull and this may continue in the next year as well. Things could improve once the new manufacturing policy announced by the government starts seeing some investments.
To boost electronics manufacturing in India, it requires a simple action plan: make all finished electronics products imports more expensive and give incentives to local manufacturing.
However, he felt that nanotech will not emerge as a disruption in India, at least, not in the near future. It may make some impact in the long run.
ARM calls the spirit of innovation as collective intelligence at every level. It is within devices, between people, through tech and across the world. We are still pushing boundaries of mobile devices.
Speaking at the ARM Summit in Bangalore, Dr Mark Brass, corporate VP, Operations, ARM, said that the first challenge was the number of people on the planet. Technology development and innovation also pose challenges.
According to him, mobile phones are forecast to grow 7.3 percent in 2013 driven by 1 billion smartphones. Mobile data will ramp up 12 times between now and 2018. Mobile and connectivity are creating further innovation.
August, a compamy, has introduced an electronic lock for doors, controlled by the smartphone. Another one is Proteus, which looks at healthcare. The smartphone is becoming the center of our world. All sorts of sensors are also getting into smartphones. Next, mobile and connectivity are growing in automobiles. Companies like TomTom are competing with automobile companies. Connectivity is also transforming infrastructure and data centers. They are now building off the mobile experience.
As per ARM, an IoT survey done has revealed that 76 percent of companies are dealing with IoT. As more things own information, there will be much more data. The IoT runs on ARM.
“There’s more going on than just what you think. IoT is not just about things. Skills development should not be an afterthought. Co-operation is critical. Solutions will emerge. All sorts of things are going to happen. Three years from now, only 4 percent of companies won’t have IoT in the business at all,” Dr. Brass added.
IoT will be present in industrial, especially motors, transportation, energy, and healthcare. Smart meters are coming in to help with energy management. There is a move to Big Data from Little Data.
Challenges in 2020 would be in transportation, energy, healthcare and education. ARM and the ARM partnership is addressing those. “We are delivering an unmatched diversity of solutions. We are scaling from sensors to servers, connecting our world,” Dr. Brass concluded.
Texas Instruments has been a leader in DLP or digital light processing, a type of projector technology that uses a digital micromirror device. Kent Novak, senior VP, DLP Products, Texas Instruments (TI) mentioned that DLP became the no. 1 supplier of MEMS technology in 2004.
The DLP pico projectors business started in 2009. Now, pico is going into gaming systems, etc. In 2011, it went into the cinema industry. In India, out of 10,000 screens, close to 7,000 are now digital. In 2012, new DLP development kit was launched allowing developers to embed the DLP chip into non-traditional applications in new markets. In 2013, TI started working on DLP automotive chips.
He said: “DLP is an array of millions of digital micromirrors. We ship around 45 million devices. We see India as a growth opportunity for cimemas. In DLP front projection business, we have 60 percent share in India. Only 5 percent of Indian classrooms have projectors, making room for growth.”
In low power pico projection, TI has 95 percent market share in India for standalone pico projection. A phone with pico projection was launched in India with iBall at 35 lumen.
DLP technology is available in India in:
Industrial: Machine vision can improve quality control in the Indian manufacturing sector.
Medical: Intelligent illumination systems for cost effective blood analysis.
Safety: Cost effective, accurate chemical analysis of food and industrial.
Automotive: Infotainment and safety solution being qualified.
DLP in automotive displays has several applications, such as wide field of view head up display (HUD) – app available by 2016, free shape interactive active console – app available by 2017, and smart headlights. Some other features include:
* High image quality: consistent contrast, brightness over lamp.
* Full, deep, accurate cover over lifetime.
* Easily enlarges larger display areas.
* High power efficiency.
* DLP technology automatically reduces reflection.
New market opportunities
There are said to be several new opportunities for DLP. These are in:
Industrial: Machine vision, spectroscopy, interactive display, 3D printing, intelligent lighting, digital light exposure.
Infotainment: Mobile phones, tablets, camcorders, laptops, mobile projection, ultra slim TVs.
Gaming: Dual console gaming, interactive gaming, near eye display.
Digital signage: Interactive surface, storefront interactive, retail engagement.
Automotive: Head up display, interactive display, intelligent lighting.
Medical: Spectroscopy, 3D printing, intelligent lighting.
TI has DLP LightCrafter family of evaluation modules. It enables faster development cycles for end equipment requiring smalll form factor, lower cost and intelligent, high-speed pattern display. The DLP LightCrafter 4500 features the 0.45 WXGA chipset. The DLP chip can enable new and innovative intelligent display apps. If your solution uses, programs or senses light, DLP could be a fit.
DLP catalog offers programmable, ultra-high speed pattern. “DLP is light source agnostic. We use whatever’s most efficient for brightness,” he added.
SEMICON Europa was recently held in Dresden, Germany on Oct. 8-10, 2013. I am extremely grateful to Malcolm Penn, chairman and CEO, Future Horizons for sharing this information with me.
SEMICON Europa included a supplier exhibition where quite a few 450mm wafers were on display. One highlight was a working 450mm FOUP load/unload mechanism, albeit from a Japanese manufacturer. These exhibits did illustrate though that 450mm is for real and no longer a paper exercise. There was also a day-long conference dedicated to 450mm in the largest room. This was crowded throughout the time and a large number of papers were given.
Paul Farrar of G450C began with a presentation about Supply Chain Collaboration for 450mm. His key message was there are 25 different tools delivered to G450C of which 15 are installed in the NFN cleanroom. This number will grow to 42 onsite and 19 offsite by Q1 2015.
He stated that Nikon aims to have a working 193i litho machine in 2H 2014 and install one in Albany in 1H 2015. Farrar also reported a great improvement in wafer quality which now exceed the expected M76 specification, and prime wafers to the M1 spec should be available in Q3 2014. There has also been good progress on wafer reclaim and it is hoped some wafers can be reused up to 10 times, although at least three is the target.
Metrology seems to be one of the most advanced areas with eight different machines already operational. The number of 450mm wafers in their inventory now stands at over 10,000 with these moving between the partners more rapidly. It was immediately noticeable from Farrar’s speech that G450C is now recognising the major contribution Europe is making to 450mm and is looking for more collaborations.
Facilities part of F450C
Peter Csatary of M&W then dealt with the facilities part of G450C, known as F450C. This group consists of:
• M&W (co-ordination)
• Mega Fluid Systems
• Haws Corp.
• Air Liquide
• Ceres Technlogies
• CS Clean Systems
F450C is seen as streamlining communications with the semiconductor companies and their process tool suppliers. The group will focus on four key areas, namely Environmental Footprint, Facility Interface Requirements, Cost and Duration, and Safety and Sustainability.
One interesting point raised was that 450mm equipment is inherently more massive and one suggestion has been that ceiling mounted cranes will be required to install and remove equipment. This of course means that fab roofs would need to be stronger than previously. This topic was discussed at the latest F450C meeting subsequent to this conference.
Another new concept is that of a few standardised 3D templates and adapter plates to allow fab services to be pre-installed before the equipment is placed. An interesting point made elsewhere by M&W is that the current preference is to place a fab where there are already other fabs in existence so that the infrastructure to transport products, materials and services is already in place, as are basic utilities such as power, natural gas and water supply.
However, the scale of the expected utility demand at 450 mm ups the stakes as for example a large 300 mm facility uses about 4 million gallons of water per day, whereas a 450 mm fab will use almost double that, putting immense strain on a location’s infrastructure should there be other fabs in the region. This could affect future site selections.
An outcome of this phenomenon is that the reduction, reclaim and re-use of materials will no longer be driven only by the desire to be a good corporate citizen, but will also be driven by cost control and to ensure availability of required resources such as power, water, specialty gases and chemicals.
Intergence is a consulting organisation specialising in network, application, and process optimisation. It provides consulting services to align IT to your business strategy; resourcing to provide highly skilled expertise and managed services to deliver challenging IT projects on time and to budget.
Utilising a unique combination of world class expertise, industry-leading methodology and unique tools, Intergence has a clear and common purpose – to allow clients to extract more value from their existing assets, whilst delivering a first-class service.
Peter Job, CEO, Intergence, said that Intergence is all about expertise in IT optimization. This is about extracting more value. “One key challenges we found was that we were on the second or third generation structure. It is about of our expertise. We operate on three areas – IT optimization, managed sourcing and managed services around managing applications.
“One of the challenges we are addressing are addressng the end user themselves. They have fast and quicker access to applications. We have launced two new products at Gitex – AppFire – allows you to look at the LAN and WAN and the application itself.
“The AppFlare – gives the ability to monitor applications running across the Internet. We place software agents and they report how apps are running.
“We also do lots of managed sourcing – building infrastructure. We are able to mobilise and get a team of experts to come and build the IT team and build the infrastructure. The third is infrastructure. We are looking at cloud, security, etc.
“We are from the UK, and our business is growing at 35 percent. We moved to Dubai in 2008.This is our fifth Gitex. It can be any medium- or large-enterprise, public sector organization.
“The geography is UK and Europe, as well as the GCC countries. We have plans to go to Africa in the future.
The expertise of Intergence is IT optimization. Enterprises can use the AppFlare to make their infrastructure run more efficiently.
This year’s show is the best according to Intergence. You are always going to see security issues. More people are offering cloud services.
Some trends in 2014 include:
* BYoD will become mainstream.
* IT departments will have to become business centers.
* As for the cloud market, by 2016, 60-70 percent of businesses will have hybrid cloud. Lot of companies are looking at software-defined networks.
* Cloud analytics will go up by two to three years. People can actually see their data, and take informed decisions.
Today, at San Francisco, Apple introduced the iPad Air that features a 9.7-inch Retina display in a new thinner and lighter design!
Earlier, yesterday, in India, Samsung announced the GALAXY Note 10.1! However, it isn’t any match for the iPad Air!!
The release says that precision-engineered to weigh just one pound, the iPad Air is now 20 percent thinner and 28 percent lighter than the fourth generation iPad, and with a narrower bezel the borders of iPad Air are dramatically thinner-making content even more immersive.
Apple also introduced the new iPad mini featuring Retina display and 64-bit Apple-designed A7 chip.
The iPads feature two antennae to support Multiple-In-Multiple-Out (MIMO) technology, thus bringing twice the Wi-Fi performance to iPad Air and iPad mini with Retina display at a blazingly fast data rate up to 300 Mbps. The fact that Apple will be offering 128GB for both the models shows that it really means business!
And, what will it do to Apple’s business? Well, there will definitely be many more buyers for sure. Gosh, what will I do? I have a third-gen iPad and this is a fifth-gen model! Never mind! All the best to those who would be buying the iPad Air!
Besides the iPad Air, there were some other announcements made by Apple. First, Apple introduced the next gen iWork and iLife apps for OS X, as well as the OS X Mavericks, which is now available free from Mac App store. Apple also introduced the all new Mac Pro! Brilliant!
DP Electronics eK (Deutsche Power), based in Germany, with an office in Hong Kong, is showcasing power electronics products at Gitex 2013. It has assembling partners in Hong Kong, Hungary, China, Taiwan and Germany.
Helen Long, manager, International Affairs, said that the company’s mission is to be the best supplier of power solutions. The company will continue to tailor products for market needs, while maintaining high quality, integrated customer service and prompt delivery.
The cycle time for the development of new models of UPS has been rapidly shortening as the manufacturers take advantage of the latest advancements in the use of microprocessors (MPUs) and power semiconductor devices. Hence, the supplier’s products are also becoming lighter, smaller and increasingly intelligent, with a dramatic effect on cost reduction. DP Electronics’ range of UPS include over 60 models/ratings.
Some of its products include the DH series sine-wave inverter (1 KVA-2 KVA), suitable for small/medium home equipment, office and public devices, home lighting systems, fabrication and control systems, PCs, PoS devices, etc. The SOLO series simulated sine-wave inverters (1 KVA-2 KVA) is useful for tubelights, TVs. computers, stereos, PBXs, etc.
It is also offering solar panels (100W-300W), as well as off-grid and on-grid PV imverters with MPPT solar charger, and a PV charge controller. DP Electronics is also displaying optoelectronic LED lights for ceilings, corn ligts, warehouse lights, flood lights, spot lights and other lights of different concepts.
Among UPS, it is offering the XL Plus series line interactive UPS (650VA-3KVA), Elentra series line interactive sinewave UPS (1KVA-6KVA), Elektra series online high frequency UPS (1KVA-30KVA) and 1KVA~10KVA models. The Elektra series is available as online industrial grade UPS — 10KVA~60KVA models and 10KVA-3.5MVA models, respectively. Then, there is the Fuhrer series of modular online UPS from 10KVA~100KVA.
The supplier is also offering VRLA/SLA/GEL batteries in 2V/6V/12V types
Odyssey Consultants is a PCI QSA, ISO 27001 certified infosecurity, infrastructure and risk management solutions integrator, and a managed security and outsourcing services provider. Founded 2002, it has since evolved into a regional leader in managed security and outsourcing services.
Odyssey’s range of solutions and services lie within a four-phase information security continuum, such as test and access, design and implement, monitor and respond, and outsourcing. According to the company, information security management involves the development, deployment, and ongoing monitoring and review of a combination of preventive, detective, and response processes and controls.
Odyssey is offering the ClearSkies security-as-a-service (SaaS) line of cloud-based integrated security services. ClearSkies platform has the necessary tools that enable the organizations reap benefits of the cloud without compromising on infosecurity.
The first of the ClearSkies series of services offered by Odyssey is the security information and event management (SIEM). SIEM provides organizations an adequate infrastructure in-house, with the opportunity to gain such capability in the cloud. ClearSkies is enriched with the vast know-how, expertise and intelligence of the latest threats and vulnerabilities that come right out of Odyssey’s Ithaca Labs. It transforms the service into a powerful information security tool for the client.
Odyssey also offers managed security and outsourcing (MSOS) services. Key benefits include:
* Enhanced 24/7/365 protection and monitoring of network, systems and security components.
* Continuous log analysis and correlation of events with real-time incident escalation.
* Focus internal resources on core organizational competencies.
* Threat analysis and access to security advisories issued by Ithaca Labs team.
* Minimized mean time to restore/recovery (MTTR) capability by proactive indentification of Internet threats.
* Retention of logs collected in a secure environment, helping clients meet regulatory compliance without needing to deploy costly and complex reporting tools and processes.
* Low TCO by eliminating the need to recruit, train and retain an in-house security capability.
* Notification of in-scope devices outage that impacts log collection.
* Access to MSOS secure portal for reviewing real-time alerts, published incidents and generate reports.
Odyssey has offices in Cyprus and Greece, and is exhibiting at the Gitex 2013 show in Dubai.