Leaptech Corp. was established to help the electronics and semiconductor manufacturing companies in India achieve global standards by adopting the latest technologies available worldwide. It represents the world’s leading companies offering automation equipment for PCB assembly, semiconductor, automotive and final assembly automation.
Suresh Nair, director, said that Leaptech is helping the electronics, semiconductor and automotive manufacturing companies in India by bringing in world class technologies from across the globe in assembly automation, the technologies, which are state-of-the-art.
“We provide both pre-sales and post-sales support to all the systems and solutions that we offer, complete post-sales support includes installation, commissioning, training, production support and process support through our factory trained engineers strategically located in Delhi, Mumbai, Bangalore and Chennai.”
Leaptech provides audit and reconditioning services to enable customers improve productivity and uptime on their existing automated through hole and SMT assembly machines. Nair added: “We do provide audit and reconditioning services to customers where the machines were sold/supported by us. We may not be able to handle machines sold by other suppliers since that will be a breach of contract with out own principals.”
As for the training on operational and maintenance aspects of through hole insertion and SMT machines, Leaptech also provide complete training on machines for operation, periodical maintenance, trouble shooting as well as preventive maintenance.
Leaptech offers consultancy services for new electronics setup as well as for new projects in the existing facility, which includes all detailing as well as knowhow on the process of assembly/production. our expert team is upto date with all latest trends in this industry.
Connected mobile devices
It will be interesting to get Leaptech opinon regarding connected mobile devices. Nair said that connected mobile devices would grow for sure in the immediate future. Growth in the long term may depend on the contents of this segment and how interesting it is to the users.
With regard to automotive electronics driving energy efficiency, he added that Leaptech mostly sells automation equipment and the scope for these equipment toward energy efficiency for automotive sector is limited.
Indian electronics scenario in 2014 and beyond
According to Nair, the Indian electronics scenario is still dull and this may continue in the next year as well. Things could improve once the new manufacturing policy announced by the government starts seeing some investments.
To boost electronics manufacturing in India, it requires a simple action plan: make all finished electronics products imports more expensive and give incentives to local manufacturing.
However, he felt that nanotech will not emerge as a disruption in India, at least, not in the near future. It may make some impact in the long run.
Texas Instruments has been a leader in DLP or digital light processing, a type of projector technology that uses a digital micromirror device. Kent Novak, senior VP, DLP Products, Texas Instruments (TI) mentioned that DLP became the no. 1 supplier of MEMS technology in 2004.
The DLP pico projectors business started in 2009. Now, pico is going into gaming systems, etc. In 2011, it went into the cinema industry. In India, out of 10,000 screens, close to 7,000 are now digital. In 2012, new DLP development kit was launched allowing developers to embed the DLP chip into non-traditional applications in new markets. In 2013, TI started working on DLP automotive chips.
He said: “DLP is an array of millions of digital micromirrors. We ship around 45 million devices. We see India as a growth opportunity for cimemas. In DLP front projection business, we have 60 percent share in India. Only 5 percent of Indian classrooms have projectors, making room for growth.”
In low power pico projection, TI has 95 percent market share in India for standalone pico projection. A phone with pico projection was launched in India with iBall at 35 lumen.
DLP technology is available in India in:
Industrial: Machine vision can improve quality control in the Indian manufacturing sector.
Medical: Intelligent illumination systems for cost effective blood analysis.
Safety: Cost effective, accurate chemical analysis of food and industrial.
Automotive: Infotainment and safety solution being qualified.
DLP in automotive displays has several applications, such as wide field of view head up display (HUD) – app available by 2016, free shape interactive active console – app available by 2017, and smart headlights. Some other features include:
* High image quality: consistent contrast, brightness over lamp.
* Full, deep, accurate cover over lifetime.
* Easily enlarges larger display areas.
* High power efficiency.
* DLP technology automatically reduces reflection.
New market opportunities
There are said to be several new opportunities for DLP. These are in:
Industrial: Machine vision, spectroscopy, interactive display, 3D printing, intelligent lighting, digital light exposure.
Infotainment: Mobile phones, tablets, camcorders, laptops, mobile projection, ultra slim TVs.
Gaming: Dual console gaming, interactive gaming, near eye display.
Digital signage: Interactive surface, storefront interactive, retail engagement.
Automotive: Head up display, interactive display, intelligent lighting.
Medical: Spectroscopy, 3D printing, intelligent lighting.
TI has DLP LightCrafter family of evaluation modules. It enables faster development cycles for end equipment requiring smalll form factor, lower cost and intelligent, high-speed pattern display. The DLP LightCrafter 4500 features the 0.45 WXGA chipset. The DLP chip can enable new and innovative intelligent display apps. If your solution uses, programs or senses light, DLP could be a fit.
DLP catalog offers programmable, ultra-high speed pattern. “DLP is light source agnostic. We use whatever’s most efficient for brightness,” he added.
Yesterday evening, the Indian Cabinet Committee on Economic Affairs has approved setting up of Information Technology Investment Region (ITIR) near Hyderabad.
The Phase I of this project will be from 2013 to 2018 and Phase II will be from 2018 to 2038. The Government of Andhra Pradesh has delineated an area of 202 sq. kms. for the proposed ITIR in three clusters/ agglomerations viz.:
(i) Cyberabad Development Area and its surroundings,
(ii) Hyderabad Airport Development area and Maheshwaram in the south of Hyderabad, and
(iii) Uppal and Pocharam areas in eastern Hyderabad. The ITIR will be implemented in two phases.
Next, the Government of India finalized the setting up of a ‘Ultra-Mega Green Solar Power Project’ in Rajasthan in the SSL (Sambhar Salts Ltd, a subsidiary of Hindustan Salts Ltd – a Central Public Sector Enterprise under the Department of Heavy Industry, Ministry of Heavy Industries & Public Enterprises) area close to Sambhar Lake, about 75 kms from Jaipur.
Further, India was recognized as ‘Authorizing Nation’ under the international Common Criteria Recognition Arrangement (CCRA) to test and certify electronics and IT products with respect to cyber security. India has become the 17th nation to earn this recognition.
Then again, the ‘HTML 5.0 Tour in India’ has now reached Hyderabad.
Also, India has offered to help Cuba develop its renewable energy resources. This has been conveyed to Marino Murillo, vice president of the Republic of Cuba at Havana, by Dr. Farooq Abdullah, Minister of New and Renewable Energy, during his trip to Cuba.
All of this is really brilliant stuff!
At least, I have never seen or heard about so much activity happening, especially in the electronics and solar PV sectors. One sincerely hopes that all of these initiatives will allow India to come to the forefront of the global electronics industry.
The spark seems to be coming back to the India electronics industry, after a very, very long wait! It is hoped that this stays on!!
The government of India recently approved the setting up of two semiconductor wafer fabrication facilities in the country. It is expected to provide a major boost to the Indian electronics system design and manufacturing (ESDM) ecosystem. A look at the two proposals:
Jaiprakash Associates, along with IBM (USA) and Tower Jazz (Israel). The outlay of the proposed fab is about Rs. 26,300 crore for establishing the fab facility of 40,000 wafer starts per month of 300mm size, using advanced CMOS technology. Technology nodes proposed are 90nm, 65nm and 45nm nodes in phase I, 28nm node in phase II with the option of establishing a 22nm node in phase III. The proposed location is Greater Noida.
Hindustan Semiconductor Manufacturing Corp. (HSMC) along with ST Microelectronics (France/Italy) and Silterra (Malaysia). The outlay of the proposed fab is about Rs. 25,250 crore for the fab facility of 40,000 wafer starts per month of 300mm size, using advanced CMOS technology. Technology nodes proposed are 90nm, 65nm and 45nm nodes in phase I and 45nm, 28nm and 22nm nodes in phase II. The proposed location is Prantij, near Gandhinagar, Gujarat.
Now, this is excellent news for everyone interested in the Indian semiconductor industry.
One look at the numbers above tell me – NONE OF THESE are going to be 450mm fabs! Indeed, both will be 300mm fabs! After waiting for such a long time to even get passed by the Union Cabinet, are these 300mm fabs going to be enough for India? Is the technology choice even right for the upcoming wafer fabs in India? Let’s examine!
As you can probably see, both the projects have placed 22nm right at the very last phase! That’s very interesting!
Intel just showcased its Xeon processor E5-2600 v2 product family a few days back. I distinctly remember Intel’s Narendra Bhandari showing off the 22nm wafer sometime last week during a product launch!
For discussion’s sake, let’s say, a fab in India comes up by say, early 2015. Let’s assume that Phase 1 takes a full year. Which means, Phase 2, where 22nm node would be used, shall only be touched in 2016 or even beyond! Isn’t it? Where will the rest of the global industry be by then?
You are probably aware of the Global 450 Consortium or G450C, which has Intel, IBM, Samsung, GlobalFoundries and TSMC among its members. What is the consortium currently doing? It is a 450mm wafer and equipment development program, which is leveraging on the industry and government investments to demonstrate 450mm process capabilities at the CNSE’s Albany Nanotech Complex. CNSE, also a consortium member, is the SUNY’s College of Nanoscale Science and Engineering!
So, what does all of this tell me?
One, these upcoming fabs in India will probably produce low- to mid-range chips, and some high-end ones at a later stage. Well, two, this does raise a question or two about India’s competitive advantage in the wafer fab space! Three, there is lot of material on 450mm fabs, and some of that is available right here, on this blog! Have the Indian semiconductor industry folks paid enough attention to all that? I really have no idea!
Four, only the newer 300mm fabs built with higher ceilings and stronger floors will be able to be upgraded to 450mm, as presented by The Information Network’s Dr. Robert Castellano at the Semicon West 2013. Five, what are the likely alternative markets for 200mm and 300mm fabs? These are said to be MEMs and TSV, LEDs and solar PV. Alright, stop!
Perhaps, these product lines will be good for India and serve well, for now, but not for long!
ReneSola Ltd, a leading global manufacturer of solar PV modules and wafers, has introduced its new Virtus II multicrystalline modules in India. ReneSola has started providing locally produced PV modules to the Indian market and expects to provide 250 MW of India-made PV modules over a two-year period.
The India launch follows the successful introduction of the Virtus II solar modules to the US and Australian markets.
Founded in 2005, Renesola has 17 subsidiaries worldwide. Production sites located in Zhejiang, Jiangsu and Sichuan, China. The supplier estimates to ship 1,550 ingots and 700 wafers during 2012, up from 1,014.1 ingots and 295,2 million wafers in 2011.
Some of Renesola’s projects include 4MW and 2MW in Slovakia, 11.5MW in Germany, 20MW in China, 9.21MW in Italy, and 27.6MW again in Germany. A couple of Renesola’s rooftop projects include 118.8KW in Slovakia, 1.95MW and 100.8KW in Greece, 1.4MW in Belgium, 12.96KW in Bulgaria, and 806.4KW in Germany.
Virtus II modules
Characteristics of the Virtus II modules include higher power output, higher performance at same cost, same LID, and same CTM cost. Virtus ingot improves the distribution of grain size and lifetime, and provides higher lifetime and lower dislocation density. The Virtus A++ wafer allows uniform grain distribution with less defects. The Virtus A++ wafer also has much lower defects.
Major defects of conventional multi‐crystalline wafers can be reduced by the innovative controlled DSS method. The Virtus I module provides better temperature coefficient of power and lower light induced degradation compared to mono modules. The Virtus II wafer increases cell efficiency due to higher lifetime, lower dislocation and uniform grain size. The Virtus II module shows better performance and the same production cost of multi-module.