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Semicon industry needs to keep delivering value: Anil Gupta


Anil Gupta

Anil Gupta

In 2013, the global semiconductor industry had touched $306 billion or so. Sales had doubled from $100 billion to $200 billion in six years — from 1994 to 2000. It was enterprise sales that was driving this. It has taken 14 years to move past $300 billion, said Anil Gupta, managing director, Applied Micro Circuits India Pvt Ltd, at the UVM 1.2 day.

This time, consumption of semiconductors is not only around enterprise, but social networks as well. Out of the $306 billion, logic was approximately $86 billion, memory was $67 billion, and micro was $58 billion. We, as consumers, are starting to play a huge role.

However, the number of large players seem to be shrinking. Mid-size firms, like Applied Micro, are said to be struggling. Technology is playing an interesting role. There is a very significant investment in FinFETs. It may only get difficult for all of us. Irrespective, all of this is a huge barrier to the mid- to small-companies. Acquisitions are probably the only route, unless you are in software.

In India, we have been worried for a while, whether the situation will be a passing phase. We definitely will have a role to play. From an expertise perspective, thanks to our background, we have been a poor nation. For us, the job is the primary goal. We need to think: how do we deliver value? We have to try and keep creating value for as long as possible.

As more and more devices actually happen, many other things are also happening. An example for devices is power. We still have a fair number of years ahead where there will be opportunities to deliver value.

What’s happening between hardware and software? The latter is in demand. Clearly, there is a trend to make the hardware a commodity. However, hardware s not going away! Therefore, the opportunity for us to deliver value is huge.

Taking the tools to make something, is critical. UVM tools are critical. But, somewhere along the way, we seem to stop at that. We definitely need to add value. UVM’s aim is to make things re-usable.

Don’t loose your focus while doing verification. Think about the block, the subsystem and the top. You need to and will discover and realize how valuable it is to find a bug, before the tape out of the chip.

Three things in Indian semicon: Vinay Shenoy


Vinay Shenoy

Vinay Shenoy

There have been a variety of announcements made by the Government of India in the last one year or so. In the pre-90s period, the country showed just 1 percent GDP growth rate. It was adverse to FDI and had a regulated market. All of this led to deregulation under the late PM, PV Narasimha Rao.

The Indian government was averse to foreign investment, which was opened up around 1994. Since then, we have seen 6-8 percent growth, said Vinay Shenoy, MD, Infineon Technologies (India). He was delivering the keynote at the UVM 1.2 day, being held in Bangalore, India.

Around 1997, India signed the ITA-1 with the WTO. Lot of electronic items had their import duty reduced to zero. It effectively destroyed the electronics manufacturing industry in India. We were now reduced to being a user of screwdriver technology. In 1985, the National Computer Policy, and in 1986, the National Software Policy, were drafted. The government of India believed that there existed some opportunities. The STPI was also created, as well as 100 percent EoUs. So far, we have been very successful in services, but have a huge deficit on manufacturing.

We made an attempt to kick off semicon manufacturing in 2007, but that didn’t take off for several reasons. It was later revived in 2011-12. Under the latest national policy of electronics, there have been a couple announcements – one, setting up of two semicon fabs in India. The capital grant – nearly 25-27 percent — is being given by the government. It has provided a financial incentive – of about $2 billion.

Two, electronics manufacturing per se, unless it is completely an EoU, the semicon industry will find it difficult to survive. There is the M-SIPS package that offers 25 percent capital grant to a wide range of industries.

Three, we have granted some incentives for manufacturing. But, how are you going to sell? The government has also proposed ‘Made in India’, where, 30 percent of the products will be used within India. These will largely be in the government procurements, so that the BoM should be at least 30 percent from India. The preferential market policy applies to all segments, except defense.

Skill development is also key. The government has clearly stated that there should be innovation-led manufacturing. The government also wants to develop PhDs in selected domains. It intends to provide better lab facilities, better professors, etc. Also, young professors seeking to expand, can seek funding from the government.

TSMC promotes small IP companies. Similarly, it should be done in India. For semicon, these two fabs in India will likely come up in two-three years time. “Look at how you can partner with these fabs. Your interest in the semicon industry will be highly critical. The concern of the industry has been the stability of the tax regime. The government of India has assured 10 years of stable tax regime. The returns will come in 10-15 years,” added Shenoy.

The government has set up electronics manufacturing clusters (EMC). These will make it easy for helping companies to set up within the EMC. The NSDC is tying up with universities in bringing skill-sets. The industry is also defining what skills will be required. The government is funding PhDs, to pursue specialization.

Global semicon industry trends in 2014: Analog Devices


Sam Fuller

Sam Fuller

I recently met Sam Fuller, CTO, Analog Devices, and had an interesting conversation. First, I asked him about the state of the global semicon industry in 2013.

Industry in 2013
He said: “Due to the uncertainties in the global economy in the last couple of years, the state of the global semiconductor industry has been quite modest growth. Because of the modest growth, there has been a buildup in demand. As the global economies begin to be more robust going forward, we expect to see more growth.”

Industry in 2014?
How does Analog Devices see the industry going forward in 2014? What are the five key trends?

He added: “I would talk about the trends more from an eco-system and applications perspective. Increased capability on a single chip: Given all the advances to Moore’s law, the capability of a chip has increased considerably in all dimensions and not just performance, be it the horsepower we see in today’s smartphones or the miniaturization and power consumption of wearable gadgets that were on show this year at CES.

“In Analog Devices’ case, as we are focused on high performance signal processing, we can put more of the entire signal chain on a single die. For our customers, the challenge is to provide their customers a more capable product which means a more complex product, but with a simpler interface.

“A classic example is our AD9361 chip, which is a single chip wideband radio transceiver for Software Defined Radio (SDR). It is a very capable ASSP (Application Specific Standard Products) as well as RF front end with a wide operating frequency of 70 MHz to 6 GHz.

“This chip, coupled with an all-purpose FPGA, can build a very flexible SDR operating across different radio protocols, wide frequency range and bandwidth requirements all controlled via software configuration. It finds a number of applications in wireless communication infrastructure, small cell Base stations as well as a whole range of custom radios in the industrial and aerospace businesses.”

Now, let’s see the trends for 2014!

More collaboration with customers: There is a greater emphasis on understanding customers’ end applications to provide a complete signal chain, all in a System on a Chip (SoC) or a System in a package (SiP). The relationship with our customers is changing as we move more towards ASSPs focused with few lead customers for target markets and target applications. While this has already been ongoing in the consumer industry with PCs and laptops, customers in other vertical markets like healthcare, automotive and industrial are and will collaborate more with semiconductor companies like Analog Devices to innovate at a solutions level.

More complete products: We have evolved from delivering just the silicon at a component level to delivering more complete products with more advanced packaging for various 3D chips or multi-die within a package. Our solutions now have typically much more software that makes it easier to configure or program the chips. It is a solution that is a combination of more advanced silicon, advanced packaging and more appropriate software.

With providing the complete solution, the products are more application specific and hence, the need for more collaboration with customers. For example, there may be one focused on Software Defined Radio, one for motor control, and one for vital signs monitoring for consumer health that we have launched recently.

We need it to be generic enough that multiple customers can use it, but it needs to be as tailored as possible to the customers’ needs for specific market segments. While because of the volume and standardization, availability of complete reference designs in the consumer world has been the norm, other market segments are demanding more complete products not-withstanding the huge variation in protocols and applications.

Truly global industry: The semiconductor and electronics industry has become truly global, so multiple design sites around the globe collaborate to create products. For example for Analog Devices, one of our premier design sites is our Bangalore product design center where we quite literally developed our most complex and capable chips. At the same time our customers are also global.

We see large multinational companies like GE, Honeywell, Cisco, Juniper, ABB, Schneider and many of our top strategic customers globally doing substantial system design work in Bangalore along with a multitude of India design houses. Our fastest growing region is in Asia, but we have substantial engagement with customers in North America and Europe. And our competition is also global, which means that the industry is ever moving faster as the competition is global.

Smarter design tools: The final trend worth talking about is the need for smarter design tools.  As our products and our customers’ products become more complex and capable, there have to be rapidly developing design tools, for us to design them.

This cannot be done by brute force but by designing smarter and better tools. There is a lot of innovation that goes on in developing better tool suites. There is also ever more capable software that caters to a market moving from 100s of transistors to literally billions of transistors for an application.

Top five trends likely to rule global semicon industry in 2014


Rich Goldman

Rich Goldman

What are the top five trends likely to rule the semicon industry in 2014 and why? Rich Goldman, VP, corporate marketing and strategic alliances, Synopsys, had this to say.

FinFETs
FinFETs will be a huge trend through 2014 and beyond. Semiconductor companies will certainly keep us well informed as they progress through FinFET tapeouts and ultimately deliver production FinFET processes.

They will tout the power and speed advantages that their FinFET processes deliver for their customers, and those semiconductor companies early to market with FinFETs will press their advantage by driving and announcing aggressive FinFET roadmaps.

IP and subsystems
As devices grow more complex, integrating third-party IP has become mainstream. Designers recognize as a matter of course that today’s complex designs benefit greatly from integrating third-party IP in such areas as microprocessors and specialized I/Os.

The trend for re-use is beginning to expand upwards to systems of integrated, tested IP so that designers no longer need to redesign well-understood systems, such as memory, audio and sensor systems.

Internet of Things/sensors
Everybody is talking about the Internet of Things for good reason. It is happening, and 2014 will be a year of huge growth for connected things. Sensors will emerge as a big enabler of the Internet of Things, as they connect our real world to computation.

Beyond the mobile juggernaut, new devices such as Google’s (formerly Nest’s) thermostat and smoke detector will enter the market, allowing us to observe and control our surrounding environment remotely.

The mobile phone will continue to subsume and disrupt markets, such as cameras, fitness devices, satellite navigation systems and even flashlights, enabled by sensors such as touch, capacitive pattern, gyroscopic, accelerometers, compasses, altimeters, light, CO, ionization etc. Semiconductor companies positioned to serve the Internet of Things with sensor integration will do well.

Systems companies bringing IC design in-house
Large and successful systems companies wanting to differentiate their solutions are bringing IC specification and/or design in house. Previously, these companies were focused primarily on systems and solutions design and development.

Driven by a belief that they can design the best ICs for their specific needs, today’s large and successful companies such as Google, Microsoft and others are leading this trend, aided by IP reuse.

Advanced designs at both emerging and established process nodes  
While leading-edge semiconductor companies drive forward on emerging process nodes such as 20nm, others are finding success by focusing on established nodes (28nm and above) that deliver required performance at reduced risk. Thus, challenging designs will emerge at both ends of the spectrum.

Part II of this discussion will look at FinFETs below 20nm and 3D ICs.

Can 2014 be a major year for global semicon industry?


The year 2014 is expected to be a major year for the global semiconductor industry. The industry will and continue to innovate!

Apparently, there are huge expectations from certain segments such as the so-called Internet of Things (IoT) and wearable electronics. There will likely be focus on the connected car. Executives have been stating there could be third parties writing apps that can help cars. Intel expects that technology will be inspiring optimism for healthcare in future. As per a survey, 57 percent of people believe traditional hospitals will be obsolete in the future.

Some other entries from 2013 include Qualcomm, who introduced the Snapdragon 410 chipset with integrated 4G LTE world mode for high-volume smartphones. STMicroelectronics joined ARM mbed project that will enable developers to create smart products with ARM-based industry-leading STM32 microcontrollers and accelerate the Internet of Things.

A look at the industry itself is interesting! The World Semiconductor Trade Statistics Inc. (WSTS) is forecasting the global semiconductor market to be $304 billion in 2013, up 4.4 percent from 2012. The market is expected to recover throughout 2013, driven mainly by double digit growth of Memory product category. By region, all regions except Japan will grow from 2012. Japan market is forecasted to decline from 2012 in US dollar basis due to steep Japanese Yen depreciation compared to 2012.

WSTS estimates that the worldwide semiconductor market is predicted to grow further in 2014 and 2015. According to WSTS, the global semiconductor market is forecasted to be up 4.1 percent to $317 billion in 2014, surpassing historical high of $300 billion registered in 2011. For 2015, it is forecasted to be $328 billion, up 3.4 percent.

All product categories and regions are forecasted to grow positively in each year, with the assumption of macro economy recovery throughout the forecast period. By end market, wireless and automotive are expected to grow faster than total market, while consumer and computer are assumed to remain stagnant.

Now, all of this remains to be seen!

Earlier, while speaking with Dr. Wally Rhines of Mentor, and Jaswinder Ahuja of Cadence, both emphasized the industry’s move to 14/16nm. Xilinx estimates that 28nm will have a very long life. It also shipped the 20nm device in early Nov. 2013.

In a 2013 survey, carried out by KPMG, applications markets identified as most important by at least 55 percent of the respondents were: Mobile technology – 69 percent; Consumer – 66 percent; Computing – 63 percent; Alternative/Renewal Energy – 63 percent; Industrial – 62 percent; Automotive – 60 percent; Medical – 55 percent; Wireline Communications – 55 percent.

Do understand that there is always a line between hope and forecasts, and what the end result actually turns out to be! In the meantime, all of us continue to live with the hope that the global semiconductor will carry on flourishing in the years to come. As Brian Fuller, Cadence, says, ‘the future’s in our hands; let’s not blow it!’

Round-up 2013: Best of semiconductors, electronics and solar


Virtex UltraScale device.

Virtex UltraScale device.

Friends, here’s a review of 2013! There have been the usual hits and misses, globally, while in India, the electronics and semiconductor industries really need to do a lot more! Enjoy, and here’s wishing everyone a Very Happy and Prosperous 2014! Be safe and stay safe!!

DEC. 2013
What does it take to create Silicon Valley!

How’s global semicon industry performing in sub-20nm era?

Xilinx announces 20nm All Programmable UltraSCALE portfolio

Dr. Wally Rhines: Watch out for 14/16nm technologies in 2014!

Outlook 2014: Xilinx bets big on 28nm

NOV. 2013
Indian electronics scenario still dull: Leaptech

Connecting intelligence today for connected world: ARM

India poses huge opportunity for DLP: TI

SEMICON Europa 2013: Where does Europe stand in 450mm path?

OCT. 2013
Apple’s done it again, wth iPad Air!

IEF 2013: New markets and opportunities in sub-20nm era!

SEPT. 2013
ST intros STM32F4 series high-performance Cortex-M4 MCUs

Great, India’s having fabs! But, is the tech choice right?

G450C

G450C

Now, India to have two semicon fabs!

Higher levels of abstraction growth area for EDA

AUG. 2013
Moore’s Law could come to an end within next decade: POET

What’s happening with 450mm: G450C update and status

300mm is the new 200mm!

JULY 2013
Xilinx tapes-out first UltraScale ASIC-class programmable architecture

JUNE 2013
EC’s goal: Reach 20 percent share in chip manufacturing by 2020!
Read more…

How’s global semicon industry performing in sub-20nm era?


Early this month, I caught up with Jaswnder Ahuja, corporate VP and MD, Cadence Desiign Systems India. With the global semiconductor industry having entered the sub-20nm era, there are a lot of things happening, and Cadence is sure to be present.

Performance in sub-2onm era
First, let’s see how’s the global semiconductor industry performing after entering the sub-20nm era.

Jaswinder Ahuja

Jaswinder Ahuja

Ahuja replied: “Increased demand for faster, smaller, low-power chips continues to drive the geometry shrink as one of the ways to manage the low-power, higher performance goals in smaller form factors—in other words, PPA is driving the move to advanced node design.

“At Cadence, we are seeing a lot of interest in the wireless space, which includes smartphones, tablets, and consumer devices. In this market, you must support different standards, the device must be really fast, it must have Internet access, and all this must be done at lower power so the that it does not drain the battery. We’re also seeing interest for advanced nodes in other segments such as computing and graphics processors.”

When speaking of advanced nodes, let’s also try and find out what Cadence is doing in helping achieve 10X faster power integrity analysis and signoff.

Cadence Voltus IC power integrity Solution is a full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies to designers for debugging, verifying, and fixing IC chip power consumption, IR drop, and electromigration (EM) constraints and violations.

The Voltus solution includes innovative technologies such as massively parallel execution, hierarchical architecture, and physically aware power grid analysis and optimization. Beneficial as a standalone power signoff tool, Voltus IC Power Integrity Solution delivers even more significant productivity gains when used in a highly integrated flow with other key Cadence products, providing the industry’s fastest design closure technology.

Developed with advanced algorithms and a new power integrity analysis engine with massively parallel execution, Voltus IC Power Integrity solution:
* Performs 10X faster than other solutions on the market.
* Supports very large designs—up to one billion instances—with its hierarchical architecture.
* Delivers SPICE-level accuracy.
* Enhances physical implementation quality via physically aware power integrity optimization.

Supported by major foundries and intellectual property (IP) providers, Voltus IC Power Integrity Solution has been validated and certified on advanced nodes processes such as 16nm FinFET and included in reference design flows such as for 3D-IC technology. Backed by Cadence’s rigorous quality control and product release procedures, the Voltus solution delivers best-in-class signoff quality on accuracy and stability for all process nodes and design technologies.

FinFETs to 20nm – are folks benefiting?
It is common news that FinFETs have gone to 20nm and perhaps, lower. Therefore, are those folks looking for power reduction now benefiting?

Ahuja replied that FinFETs allow semiconductor and systems companies to continue to develop commercially viable chips for the mobile devices that are dominating the consumer market. FinFETs enable new generations of high-density, high-performance, and ultra-low-power systems on chip (SoCs) for future smart phones, tablets, and other advanced mobile devices. Anyone who adopts FinFET technology will reap the benefits.

Foundry support for FinFETs will begin at 16nm and 14nm. In April of this year, Cadence announced a collaboration with ARM to implement the industry’s first ARM Cortex-A57 processor on TSMC’s 16nm FinFET manufacturing process. At ARM TechCon 2012, Cadence announced a 14nm test chip tapeout using an ARM Cortex-M0 processor and IBM’s FinFET process technology.
Read more…

SEMICON Europa 2013: Where does Europe stand in 450mm path?


SEMICON Europa was recently held in Dresden, Germany on Oct. 8-10, 2013. I am extremely grateful to Malcolm Penn, chairman and CEO, Future Horizons for sharing this information with me.

Semicon Europa 2013SEMICON Europa included a supplier exhibition where quite a few 450mm wafers were on display. One highlight was a working 450mm FOUP load/unload mechanism, albeit from a Japanese manufacturer. These exhibits did illustrate though that 450mm is for real and no longer a paper exercise.  There was also a day-long conference dedicated to 450mm in the largest room. This was crowded throughout the time and a large number of papers were given.

Paul Farrar of G450C began with a presentation about Supply Chain Collaboration for 450mm. His key message was there are 25 different tools delivered to G450C of which 15 are installed in the NFN cleanroom. This number will grow to 42 onsite and 19 offsite by Q1 2015.

He stated that Nikon aims to have a working 193i litho machine in 2H 2014 and install one in Albany in 1H 2015. Farrar also reported a great improvement in wafer quality which now exceed the expected M76 specification, and prime wafers to the M1 spec should be available in Q3 2014. There has also been good progress on wafer reclaim and it is hoped some wafers can be reused up to 10 times, although at least three is the target.

Metrology seems to be one of the most advanced areas with eight different machines already operational. The number of 450mm wafers in their inventory now stands at over 10,000 with these moving between the partners more rapidly. It was immediately noticeable from Farrar’s speech that G450C is now recognising the major contribution Europe is making to 450mm and is looking for more collaborations.

Facilities part of F450C
Peter Csatary of M&W then dealt with the facilities part of G450C, known as F450C. This group consists of:
• M&W (co-ordination)
• Edwards
• Swagelok
• Mega Fluid Systems
• Ovivo
• CH2MHILL
• Haws Corp.
• Air Liquide
• Ceres Technlogies
• CS Clean Systems

F450C is seen as streamlining communications with the semiconductor companies and their process tool suppliers. The group will focus on four key areas, namely Environmental Footprint, Facility Interface Requirements, Cost and Duration, and Safety and Sustainability.

One interesting point raised was that 450mm equipment is inherently more massive and one suggestion has been that ceiling mounted cranes will be required to install and remove equipment. This of course means that fab roofs would need to be stronger than previously. This topic was discussed at the latest F450C meeting subsequent to this conference.

Another new concept is that of a few standardised 3D templates and adapter plates to allow fab services to be pre-installed before the equipment is placed. An interesting point made elsewhere by M&W is that the current preference is to place a fab where there are already other fabs in existence so that the infrastructure to transport products, materials and services is already in place, as are basic utilities such as power, natural gas and water supply.

However, the scale of the expected utility demand at 450 mm ups the stakes as for example a large 300 mm facility uses about 4 million gallons of water per day, whereas a 450 mm fab will use almost double that, putting immense strain on a location’s infrastructure should there be other fabs in the region. This could affect future site selections.

An outcome of this phenomenon is that the reduction, reclaim and re-use of materials will no longer be driven only by the desire to be a good corporate citizen, but will also be driven by cost control and to ensure availability of required resources such as power, water, specialty gases and chemicals.
Read more…

Now, India to have two semicon fabs!

September 12, 2013 10 comments

Finally, the Government of India has approved the establishment of a semiconductor wafer fab (fab) in India!

This is indeed heart warming news, especially for the Indian semiconductor and electronics industries. For years, India has been trying to get at least one fab up and running! Now, the dream is about to be realized!

Speaking from China, an ecstatic BV Naidu, chairman and managing director, Sagitaur Ventures, co-chairman, Karnataka ICT Grioup and former president, India Semiconductor Association (ISA) said: “This is really a fantastic news for the Indian semiconductor industry. The government has been trying to achieve this since 2008. The announcement goes as a strong signal to global community.”

Pradip Dutta, corporate VP and MD, Synopsys, said: “It is a momentous decision for the semiconductor industry and by extension the electronics industry for our country. It should lead to a level playing field for the local manufacturers and mitigate some of the disability factors. I sincerely hope the industry reacts positively to this news and this leads to a vibrant local IC design industry.”

Raghu Panicker, sales director, Mentor Graphics India, added: “For years, India has been trying to get at least one fab up and running! This has indeed been a long awaited news. Finally its not ONE, but TWO. The fabs would fuel the growth of semicon start up’s and electronics industry as a whole. It is a big step forward for the overall ESDM inititaive by IESA and government.”

Jaypee Group, IBM and Tower form one consortium. HSMC, STMicroelectronics and a Malaysian company are said to be part of the other consortium.

Global semiconductor companies delivering platforms: Jaswinder Ahuja, Cadence


Jaswinder Ahuja.

Jaswinder Ahuja.

Some time ago, Cadence Design Systems Inc. had announced the EDA360 vision! As per Jaswinder Ahuja, corporate VP and MD of Cadence Design Systems India, the Cadence vision of EDA360 is said to be well and alive. The organization has been aligned around the EDA360 vision.

The EDA360 is a five-year vision for defining the trends in the EDA industry, based on what Cadence is observing in the industry and the direction in which, it feels, the industry will go.

At Cadence,  the Silicon Realization Group is headed by Dr. Chi-ping Hsu. The SoC Realization Group is headed by Martin Lund, and Nimish Modi is looking after the System Realization Group. Cadence’s focus has been on in-house development and innovation. Tempus has been a major announcement from the Silicon Realization Group.

What’s going on with EDA360?
There has been a renewed thrust in the SoC Realization Group at Cadence. Already, there have been three acquisitions this year — Cosmic Circuits, Tensilica and Evatronix. Cadence is buying the IP part of the business from Evatronix. This acquisition is ongoing and will be announced in June 2013.

On the relationship between the electronics and the EDA industries, Ahuja said the electronics industry is going through a transition, and that the EDA industry needs to change. The importance of system-level design has increased. Companies are currently focusing on optimizing the end user experience.
Read more…

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