This is a summary by Malcolm Penn, chairman and CEO, Future Horizons. For those who wish to know more, please get in touch with me or Future Horizons.
It was all going so well at the beginning of March when January’s WSTS results were released. The oil and North African issues were being taken in their stride. Then, less than two weeks later, the earthquake and tsunami disaster struck Japan and by the close of the month, the Gaddafi Libyan regime was under western international airstrike siege.
Given the fragility of industry’s confidence since the Lehman Brothers crisis, the industry has weathered these ‘incidents’ with remarkable sanguinity, with concerns focused purely on supply not demand-side issues. In our view this underlines what we have been saying all along; the 2010 recovery and 2011 outlook were both stronger than most people thought.
The industry’s biggest problems in 2011 were always going to be supply not demand driven; the situation in Japan has simply amplified and accelerated their coming.
The chip industry took March’s one-two-three knocks with remarkable calm, hit first by the spike in oil prices following the politic unrest bordering on civil wars in North Africa, then the dreadful 11 March earthquake and Tsunami in Japan, culminating on 19 March with a multi-state coalition military intervention in Libya to implement United Nations Security Council Resolution 1973.
Last year, any of these events would probably have been enough to deal the industry a knockout blow, as with the September 2008 Lehman Brothers collapse; this time around, despite the still fragile global economic confidence, the industry seems to have taken these events in its stride.
Whilst it is far too early to quantify exactly what the industry impact will be, the oil price and North Africa situation pales into insignificance when compared with the aftermath of the earthquake and tsunami. Japan is too important a cog in the global electronics industry for its impact not to have serious global repercussions. It has also brought to a head the far deeper industry problems that we have long warned of – man-made in the corporate boardrooms – that could (should) have been avoided.
In this aspect, Japan’s disasters do have parallels with the Lehman Brothers collapse and its impact of worldwide finance; we hope that the current disruption to manufacturing worldwide from will force a rethink of how the world manages production. Read more…
One wonders what S.D. Shibulal, COO and member of the board, Infosys Technologies, was doing as the speaker for Market and business dynamics in emerging markets. Nevertheless, he was the speaker after the inauguration of the ISA Vision Summit 2011.
More later ;)
STMicroelectronics recently introduced the M24SR dynamic NFC/RFID tag.
Speaking about the USP of the M24SR, Amit Sethi, Product Marketing manager – Memories and RFID, STMicroelectronics India, said: “The unique selling proposition of the M24SR product is its two interfaces, giving users and applications the ability to program or read its memory using either an RF NFC interface or a wired I2C interface, in an affordable and easy-to-use device for a wide range of applications such as consumer/home appliance, OTP card, healthcare/wellness and industrial/smart meter.”
Let us see how the M24SR is beneficial for smartphone or any other audio device.
The M24SR is a dynamic NFC/RFID tag that manages the data exchange between the NFC phone and the microcontroller. The main use cases for data exchange are updating user settings, downloading data logs, and remote programming and servicing. The dynamic tag also enables seamless Bluetooth and Wi-Fi pairing, which is useful in, for example, audio devices.
How is the M24SR different from other products of the same segment?
Sethi said that the key difference is the dual interface: the M24SR memory can be accessed either by a low-power 2C interface or
by an ISO14443A RF interface operating at 13.56MHz. It also features RF status (MCU wake-up) and RF disable functions to minimize power consumption. In addition, the devices support the NFC data exchange format (NDEF from NFC forum) and 128-bit password protection mechanism.
The M24SR series is available in EEPROM memory densities from 2 Kbit to 64 Kbit and three package types: SO8, TSSOP8, and UFDFPN8.
What are the contributions of M24SR toward the Internet of Things?
Accotding to him, the M24SR dynamic NFC/RFID tag interactive and zero power capability, simplifies complex communications setups and enables data exchange among the home automation, wearable electronics, home appliances, smart meter, wellness, etc.
Especially with the NFC capability, the M24SR is ideal for applications waiting for something, like a ticket or ID to launch an activity.
Relevance for India
Finally, what’s the relevance of the product for the Indian market?
Sethi added: “Mobile and NFC based application are gaining its popularity in India. M24SR is an easy-to-use and an affordable product for the Implementation of NFC-based applications in transportation, entertainment, and lifestyle areas.
As for the go-to-market strategy, the M24SR mass market launch is planned for end of February 2014. Some M24SR samples have been delivered to key customers during Q4 2013 and design/development is ongoing.
I had interacted with Dr. Ajoy Bose, CEO of Atrenta, some months ago. It was a pleasure to meet up with Piyush Sancheti, VP of Marketing recently. First, I asked him about the outlook for EDA in 2014.
Outlook for EDA
Piyush Sancheti said: “EDA does not look that attractive from growth point. However, you cannot do SoC designs without EDA. Right now, EDA’s focus is on implementation. The re-use of IP has been doing the rounds for many years. Drivers for SoCs are mobile and Internet of Things. The design cycle for those markets are very short – about three months. EDA business is shifting to IP re-use. The focus is now toward design aggregation.
“We will have done roughly 66 percent of business – net new — on existing customers. There is an industry shift toward doing more on the front end. EDA growth will come from IP-SoC involvement.
“Sub-20nm has challenges. ST says FT-SoI is the way to go. Complexity of process plays a big role, and the amount of chips you put in will also increase. In 14/16nm, we have an investment going on in 3D design. We are extending our 2D tool into 3D tool. We are also investing in the IP qualification. We have standardized a set of design rules in RTL. There are about 30 companies in the TSMC ecosystem.
“Our main focus is IP enablement. SoC acceptance is another key aspect. Our company focus is IP-enablement for SoCs. IP qualification ensures that it meets guidelines. Second, acceptance and making sure all IPs fit in the blocks. Third, integration. We already have this technology and it is driving the business.”
What’s Atrenta’s take on 3D design? Sancheti replied: “The industry has been slow as 3D designs are not yet to a point of business success. Focus on monolithic 3D-ICs will be a paradigm shift for the semicon industry. For mainstream commercial design, 20nm is still mainstream, but 14/16nm does not look mainstream, as of now. Process node is not necessarily a driver of innovation. EDA as an industry will remain in single digit growth.”
How will EDA move into the embedded software space?
Sancheti said: “We’ve looked into that market. But, the price point is significantly lower. Over time, it could be a strategic area for us. Over time, embedded software development and chip design will co-mingle.”
ESL is where the future of EDA lies. Still true? He added that the future of EDA is going up. It has to head toward integration of embedded software and chip development. However, ESL is not the only viable option.
Atrenta has 220 people in India, about 10 people in Bangalore and 200 in Noida. Sushil Gupta runs the India operations. It has tie-ups with IIT Delhi and IIT Kharagpur as well. Atrenta sees lot of scope for work with the Indian start-ups.
ARM calls the spirit of innovation as collective intelligence at every level. It is within devices, between people, through tech and across the world. We are still pushing boundaries of mobile devices.
Speaking at the ARM Summit in Bangalore, Dr Mark Brass, corporate VP, Operations, ARM, said that the first challenge was the number of people on the planet. Technology development and innovation also pose challenges.
According to him, mobile phones are forecast to grow 7.3 percent in 2013 driven by 1 billion smartphones. Mobile data will ramp up 12 times between now and 2018. Mobile and connectivity are creating further innovation.
August, a compamy, has introduced an electronic lock for doors, controlled by the smartphone. Another one is Proteus, which looks at healthcare. The smartphone is becoming the center of our world. All sorts of sensors are also getting into smartphones. Next, mobile and connectivity are growing in automobiles. Companies like TomTom are competing with automobile companies. Connectivity is also transforming infrastructure and data centers. They are now building off the mobile experience.
As per ARM, an IoT survey done has revealed that 76 percent of companies are dealing with IoT. As more things own information, there will be much more data. The IoT runs on ARM.
“There’s more going on than just what you think. IoT is not just about things. Skills development should not be an afterthought. Co-operation is critical. Solutions will emerge. All sorts of things are going to happen. Three years from now, only 4 percent of companies won’t have IoT in the business at all,” Dr. Brass added.
IoT will be present in industrial, especially motors, transportation, energy, and healthcare. Smart meters are coming in to help with energy management. There is a move to Big Data from Little Data.
Challenges in 2020 would be in transportation, energy, healthcare and education. ARM and the ARM partnership is addressing those. “We are delivering an unmatched diversity of solutions. We are scaling from sensors to servers, connecting our world,” Dr. Brass concluded.
SEMICON Europa was recently held in Dresden, Germany on Oct. 8-10, 2013. I am extremely grateful to Malcolm Penn, chairman and CEO, Future Horizons for sharing this information with me.
SEMICON Europa included a supplier exhibition where quite a few 450mm wafers were on display. One highlight was a working 450mm FOUP load/unload mechanism, albeit from a Japanese manufacturer. These exhibits did illustrate though that 450mm is for real and no longer a paper exercise. There was also a day-long conference dedicated to 450mm in the largest room. This was crowded throughout the time and a large number of papers were given.
Paul Farrar of G450C began with a presentation about Supply Chain Collaboration for 450mm. His key message was there are 25 different tools delivered to G450C of which 15 are installed in the NFN cleanroom. This number will grow to 42 onsite and 19 offsite by Q1 2015.
He stated that Nikon aims to have a working 193i litho machine in 2H 2014 and install one in Albany in 1H 2015. Farrar also reported a great improvement in wafer quality which now exceed the expected M76 specification, and prime wafers to the M1 spec should be available in Q3 2014. There has also been good progress on wafer reclaim and it is hoped some wafers can be reused up to 10 times, although at least three is the target.
Metrology seems to be one of the most advanced areas with eight different machines already operational. The number of 450mm wafers in their inventory now stands at over 10,000 with these moving between the partners more rapidly. It was immediately noticeable from Farrar’s speech that G450C is now recognising the major contribution Europe is making to 450mm and is looking for more collaborations.
Facilities part of F450C
Peter Csatary of M&W then dealt with the facilities part of G450C, known as F450C. This group consists of:
• M&W (co-ordination)
• Mega Fluid Systems
• Haws Corp.
• Air Liquide
• Ceres Technlogies
• CS Clean Systems
F450C is seen as streamlining communications with the semiconductor companies and their process tool suppliers. The group will focus on four key areas, namely Environmental Footprint, Facility Interface Requirements, Cost and Duration, and Safety and Sustainability.
One interesting point raised was that 450mm equipment is inherently more massive and one suggestion has been that ceiling mounted cranes will be required to install and remove equipment. This of course means that fab roofs would need to be stronger than previously. This topic was discussed at the latest F450C meeting subsequent to this conference.
Another new concept is that of a few standardised 3D templates and adapter plates to allow fab services to be pre-installed before the equipment is placed. An interesting point made elsewhere by M&W is that the current preference is to place a fab where there are already other fabs in existence so that the infrastructure to transport products, materials and services is already in place, as are basic utilities such as power, natural gas and water supply.
However, the scale of the expected utility demand at 450 mm ups the stakes as for example a large 300 mm facility uses about 4 million gallons of water per day, whereas a 450 mm fab will use almost double that, putting immense strain on a location’s infrastructure should there be other fabs in the region. This could affect future site selections.
An outcome of this phenomenon is that the reduction, reclaim and re-use of materials will no longer be driven only by the desire to be a good corporate citizen, but will also be driven by cost control and to ensure availability of required resources such as power, water, specialty gases and chemicals.
Intergence is a consulting organisation specialising in network, application, and process optimisation. It provides consulting services to align IT to your business strategy; resourcing to provide highly skilled expertise and managed services to deliver challenging IT projects on time and to budget.
Utilising a unique combination of world class expertise, industry-leading methodology and unique tools, Intergence has a clear and common purpose – to allow clients to extract more value from their existing assets, whilst delivering a first-class service.
Peter Job, CEO, Intergence, said that Intergence is all about expertise in IT optimization. This is about extracting more value. “One key challenges we found was that we were on the second or third generation structure. It is about of our expertise. We operate on three areas – IT optimization, managed sourcing and managed services around managing applications.
“One of the challenges we are addressing are addressng the end user themselves. They have fast and quicker access to applications. We have launced two new products at Gitex – AppFire – allows you to look at the LAN and WAN and the application itself.
“The AppFlare – gives the ability to monitor applications running across the Internet. We place software agents and they report how apps are running.
“We also do lots of managed sourcing – building infrastructure. We are able to mobilise and get a team of experts to come and build the IT team and build the infrastructure. The third is infrastructure. We are looking at cloud, security, etc.
“We are from the UK, and our business is growing at 35 percent. We moved to Dubai in 2008.This is our fifth Gitex. It can be any medium- or large-enterprise, public sector organization.
“The geography is UK and Europe, as well as the GCC countries. We have plans to go to Africa in the future.
The expertise of Intergence is IT optimization. Enterprises can use the AppFlare to make their infrastructure run more efficiently.
This year’s show is the best according to Intergence. You are always going to see security issues. More people are offering cloud services.
Some trends in 2014 include:
* BYoD will become mainstream.
* IT departments will have to become business centers.
* As for the cloud market, by 2016, 60-70 percent of businesses will have hybrid cloud. Lot of companies are looking at software-defined networks.
* Cloud analytics will go up by two to three years. People can actually see their data, and take informed decisions.
Yesterday evening, the Indian Cabinet Committee on Economic Affairs has approved setting up of Information Technology Investment Region (ITIR) near Hyderabad.
The Phase I of this project will be from 2013 to 2018 and Phase II will be from 2018 to 2038. The Government of Andhra Pradesh has delineated an area of 202 sq. kms. for the proposed ITIR in three clusters/ agglomerations viz.:
(i) Cyberabad Development Area and its surroundings,
(ii) Hyderabad Airport Development area and Maheshwaram in the south of Hyderabad, and
(iii) Uppal and Pocharam areas in eastern Hyderabad. The ITIR will be implemented in two phases.
Next, the Government of India finalized the setting up of a ‘Ultra-Mega Green Solar Power Project’ in Rajasthan in the SSL (Sambhar Salts Ltd, a subsidiary of Hindustan Salts Ltd – a Central Public Sector Enterprise under the Department of Heavy Industry, Ministry of Heavy Industries & Public Enterprises) area close to Sambhar Lake, about 75 kms from Jaipur.
Further, India was recognized as ‘Authorizing Nation’ under the international Common Criteria Recognition Arrangement (CCRA) to test and certify electronics and IT products with respect to cyber security. India has become the 17th nation to earn this recognition.
Then again, the ‘HTML 5.0 Tour in India’ has now reached Hyderabad.
Also, India has offered to help Cuba develop its renewable energy resources. This has been conveyed to Marino Murillo, vice president of the Republic of Cuba at Havana, by Dr. Farooq Abdullah, Minister of New and Renewable Energy, during his trip to Cuba.
All of this is really brilliant stuff!
At least, I have never seen or heard about so much activity happening, especially in the electronics and solar PV sectors. One sincerely hopes that all of these initiatives will allow India to come to the forefront of the global electronics industry.
The spark seems to be coming back to the India electronics industry, after a very, very long wait! It is hoped that this stays on!!
The government of India recently approved the setting up of two semiconductor wafer fabrication facilities in the country. It is expected to provide a major boost to the Indian electronics system design and manufacturing (ESDM) ecosystem. A look at the two proposals:
Jaiprakash Associates, along with IBM (USA) and Tower Jazz (Israel). The outlay of the proposed fab is about Rs. 26,300 crore for establishing the fab facility of 40,000 wafer starts per month of 300mm size, using advanced CMOS technology. Technology nodes proposed are 90nm, 65nm and 45nm nodes in phase I, 28nm node in phase II with the option of establishing a 22nm node in phase III. The proposed location is Greater Noida.
Hindustan Semiconductor Manufacturing Corp. (HSMC) along with ST Microelectronics (France/Italy) and Silterra (Malaysia). The outlay of the proposed fab is about Rs. 25,250 crore for the fab facility of 40,000 wafer starts per month of 300mm size, using advanced CMOS technology. Technology nodes proposed are 90nm, 65nm and 45nm nodes in phase I and 45nm, 28nm and 22nm nodes in phase II. The proposed location is Prantij, near Gandhinagar, Gujarat.
Now, this is excellent news for everyone interested in the Indian semiconductor industry.
One look at the numbers above tell me – NONE OF THESE are going to be 450mm fabs! Indeed, both will be 300mm fabs! After waiting for such a long time to even get passed by the Union Cabinet, are these 300mm fabs going to be enough for India? Is the technology choice even right for the upcoming wafer fabs in India? Let’s examine!
As you can probably see, both the projects have placed 22nm right at the very last phase! That’s very interesting!
Intel just showcased its Xeon processor E5-2600 v2 product family a few days back. I distinctly remember Intel’s Narendra Bhandari showing off the 22nm wafer sometime last week during a product launch!
For discussion’s sake, let’s say, a fab in India comes up by say, early 2015. Let’s assume that Phase 1 takes a full year. Which means, Phase 2, where 22nm node would be used, shall only be touched in 2016 or even beyond! Isn’t it? Where will the rest of the global industry be by then?
You are probably aware of the Global 450 Consortium or G450C, which has Intel, IBM, Samsung, GlobalFoundries and TSMC among its members. What is the consortium currently doing? It is a 450mm wafer and equipment development program, which is leveraging on the industry and government investments to demonstrate 450mm process capabilities at the CNSE’s Albany Nanotech Complex. CNSE, also a consortium member, is the SUNY’s College of Nanoscale Science and Engineering!
So, what does all of this tell me?
One, these upcoming fabs in India will probably produce low- to mid-range chips, and some high-end ones at a later stage. Well, two, this does raise a question or two about India’s competitive advantage in the wafer fab space! Three, there is lot of material on 450mm fabs, and some of that is available right here, on this blog! Have the Indian semiconductor industry folks paid enough attention to all that? I really have no idea!
Four, only the newer 300mm fabs built with higher ceilings and stronger floors will be able to be upgraded to 450mm, as presented by The Information Network’s Dr. Robert Castellano at the Semicon West 2013. Five, what are the likely alternative markets for 200mm and 300mm fabs? These are said to be MEMs and TSV, LEDs and solar PV. Alright, stop!
Perhaps, these product lines will be good for India and serve well, for now, but not for long!