Yes, looks like it!
First, on August 31, the India Semiconductor Association and the UK-TI would be signing an MoU. The next day, September 1, there is a presentation by Ministry of New and Renewable Energy and key officials on the government of India’s policies to the industry!
Next, on September 4, the DIT Secretary R. Chandrasekhar and the Additional Secretary, will be interacting with semiconductor companies in Bangalore.
Further on, September 16 is the day when the Union Minister for New and Renewable Energy, Dr Farooq Abdullah, will be interacting with a small group of industry leaders at a solar PV conclave in Hyderabad!
That’s quite a lot, within a span of 15-odd days! Must say, this augurs well for the Indian semicon and solar/photovoltaics industry.
Interestingly, a lot of the big events are focusing on solar. So, my hunch is that the Indian solar industry may have some serious announcements to make in the coming weeks. Should that happen, I hope to bring those to you, time permitting.
TI bids for Qimonda’s tools
Oh, by the way, there’s news all over the Internet about Texas Instruments (TI) placing a bid of $172.5 million for Qimonda’s 300mm production tools from its closed DRAM fab. While this highlights TI’s focus on building the world’s first 300mm analog fab, I can’t stop wondering, what would have happened had an Indian investor really bought Qimonda!
I had the pleasure of attending the 20th International Conference on VLSI Design and 6th International Conference on Embedded Systems in Bangalore, and had the good fortune of meeting a range of top experts from these fields.
One panel discussion: “Are EDA technology/products becoming a commodity?”, particularly caught my attention. Speakers debated on whether commoditization of EDA tools was happening with little/no differentiation toward project success.
Dr. Anand Anandkumar, managing director, Magma India, also a good friend, elucidated that the semiconductor design industry cannot do a complex SoC without EDA. And if there’s no EDA, there’s no integration. “If you are a commodity, you cannot solve problems!”
Now EDA is a key driver for semiconductor design companies to achieve objectives of building more and more complex (SoCs). However, the overall market size of EDA industry [estimated at US $4 billion] remains a fraction of the overall semiconductor market size [estimated at US $240 billion].
Dr Anandkumar added there had been various paradigm shifts and problems. The EDA industry was in a way the IP partner with the semiconductor industry. However, he agreed that parts of the tools had been commoditized. The EDA industry had become a prisoner of its own business model.
Nevertheless, newer things have been racing forward. There are also a variety of conflicting problems. Understanding those problems could be a way of handling and solving complex designs. The part of taking over risks had been completely absent. There was little ownership in sharing risks, which needed to change.
From the perspective of consumer electronics eco-system, available EDA technology is often viewed as not being in sync with the expectations and requirements of various design teams. Claims of productivity and quality of results advantages from EDA teams can seem more like wishful thinking than reality to end users.
More so, related issues of quality, inter-operability of standard formats, usability and understanding of designer needs are other areas of ongoing concern. These are not necessarily new issues, so what were EDA companies and their customers doing to address them? Has the EDA industry been getting its proportional value out of the semiconductor industry? Would love to hear from you.
Bangalore-based Softjin Technologies is an electronic design automation (EDA) company providing unique EDA solutions for the semiconductor industry. According to Kamal Aggarwal, VP-Marketing and Strategy, the company’s core-capability lies in developing innovative EDA tools for specific requirements of customers, such as semiconductor companies and other EDA product companies.
Softjin’s business model is a “hybrid” model, which is a mix of services and products. It also provides FPGA based system design services and design methodology services for customers.
Softjin’s current products are licensable EDA building blocks that can be used as part of proving an EDA solution to customers in post-layout and logic synthesis technology area within EDA.
Post the announcement of India’s historic semicon policy, Softjin expects to see more investments happening in the semiconductor manufacturing space. As the policy provides incentives for setting up semiconductor manufacturing units above a certain size, Aggarwal expects to see more big-ticket announcements emerging in near future.
Watch the Indian semicon space, guys, as the action heats up…
Xilinx Inc. has announced of its 20nm All Programmable UltraScale portfolio with product documentation and Vivado Design Suite support.
Neeraj Varma, director-Sales, India, Xilinx, said: “We are enabling All Programmable and smarter systems. We are using smart IP. We are aligning to produce smarter systems. We are helping customers to differentiate their products faster.
“In future, we will go with concurrent nodes with FPGAs, SoCs and 3D ICs. As per our estimates, 28nm will have a very long life. We shipped the 20nm device in early Nov. 2013. It complements 28nm or new high-performance architectures. 16nm complements 20nm with FinFET, multiprocessing, memory.”
Strategy execution has kept Xilinx a generation ahead. As of Dec. 2013, its 20nm portfolio is available to customers. There are two major announcements from Xilinx.
* Xilinx 20nm All Programmable UltraScale portfolio now available with ASIC-class architecture and ASIC-strength design solution.
* Xiilinx doubles industry’s highest capacity device to 4.4 mn logic, delivering density adantage, a full generation ahead.
KINTEX UltraSCALE – XCKU035, 040, 060, 075, 100, 115.
VIRTEX UltraSCALE – XCVU065, 080, 095, 125, 145, 160.
There is a family migration path. There is scalability for derivative applications. You can leverage PCB investment across platforms. It is future-proof with migration path to 16nm. For making these happen, Xilinx is using the TSMC 20SoC.
Varma added, “We have increased the logic cells in Kintex and Virtex, and added 100G Ethenet blocks and 150G Interlaken blocks.”
The second announcement – highest density in FPGAs in industry. The XCVU440 is the largest in the industry by 4X, a full generation ahead, and uses 50M equivalent ASIC gates. Xilinx is delivering an ASIC-class advantage through silicon, tools and methodology.
There is UltraSCALE ASIC-class architecture, and ASIC-class capabilities. There is also the Vivado ASIC-strength design suite.
UltraFAST is the design methodology. UltraSCALE will support networking, digital video and wireless.
Interconnect bottlenecks impede next generation performance.
* Routing delay dominates overall delay.
* Clock skew consumes more timing margin.
* Sub-optimal CLB packing reduces performance and utilization.
Varma added: “We have solved these issues – as UltraSCALE re-architects the core. There is 90 percent utilization now with maximum performance. We added next-generation routing, ASIC-like clocking – have clocks by segment, and logic cell packing.
“Block-level innovations optimize critical paths for massive bandwidth and processing. We are going to support DDR4, and there will be a lot more security features.”
The Vivado design suite accelerates productivity. Analytical placer solves the interconnect issue.
UltraSCALE apps include:
VIRTEX: 400G OTN switching, 400G transponder, 400G MAC-to-Interlaken bridge, 2x100G Muxponder, ASIC prototyping.
KINTEX: 4×4 mixed mode radio, 100G traffic manager NIC, super high-vision processing, 256-channel ultrasound, 48-channel T/R radar processing.
SEMICON Europa was recently held in Dresden, Germany on Oct. 8-10, 2013. I am extremely grateful to Malcolm Penn, chairman and CEO, Future Horizons for sharing this information with me.
SEMICON Europa included a supplier exhibition where quite a few 450mm wafers were on display. One highlight was a working 450mm FOUP load/unload mechanism, albeit from a Japanese manufacturer. These exhibits did illustrate though that 450mm is for real and no longer a paper exercise. There was also a day-long conference dedicated to 450mm in the largest room. This was crowded throughout the time and a large number of papers were given.
Paul Farrar of G450C began with a presentation about Supply Chain Collaboration for 450mm. His key message was there are 25 different tools delivered to G450C of which 15 are installed in the NFN cleanroom. This number will grow to 42 onsite and 19 offsite by Q1 2015.
He stated that Nikon aims to have a working 193i litho machine in 2H 2014 and install one in Albany in 1H 2015. Farrar also reported a great improvement in wafer quality which now exceed the expected M76 specification, and prime wafers to the M1 spec should be available in Q3 2014. There has also been good progress on wafer reclaim and it is hoped some wafers can be reused up to 10 times, although at least three is the target.
Metrology seems to be one of the most advanced areas with eight different machines already operational. The number of 450mm wafers in their inventory now stands at over 10,000 with these moving between the partners more rapidly. It was immediately noticeable from Farrar’s speech that G450C is now recognising the major contribution Europe is making to 450mm and is looking for more collaborations.
Facilities part of F450C
Peter Csatary of M&W then dealt with the facilities part of G450C, known as F450C. This group consists of:
• M&W (co-ordination)
• Mega Fluid Systems
• Haws Corp.
• Air Liquide
• Ceres Technlogies
• CS Clean Systems
F450C is seen as streamlining communications with the semiconductor companies and their process tool suppliers. The group will focus on four key areas, namely Environmental Footprint, Facility Interface Requirements, Cost and Duration, and Safety and Sustainability.
One interesting point raised was that 450mm equipment is inherently more massive and one suggestion has been that ceiling mounted cranes will be required to install and remove equipment. This of course means that fab roofs would need to be stronger than previously. This topic was discussed at the latest F450C meeting subsequent to this conference.
Another new concept is that of a few standardised 3D templates and adapter plates to allow fab services to be pre-installed before the equipment is placed. An interesting point made elsewhere by M&W is that the current preference is to place a fab where there are already other fabs in existence so that the infrastructure to transport products, materials and services is already in place, as are basic utilities such as power, natural gas and water supply.
However, the scale of the expected utility demand at 450 mm ups the stakes as for example a large 300 mm facility uses about 4 million gallons of water per day, whereas a 450 mm fab will use almost double that, putting immense strain on a location’s infrastructure should there be other fabs in the region. This could affect future site selections.
An outcome of this phenomenon is that the reduction, reclaim and re-use of materials will no longer be driven only by the desire to be a good corporate citizen, but will also be driven by cost control and to ensure availability of required resources such as power, water, specialty gases and chemicals.
Intergence is a consulting organisation specialising in network, application, and process optimisation. It provides consulting services to align IT to your business strategy; resourcing to provide highly skilled expertise and managed services to deliver challenging IT projects on time and to budget.
Utilising a unique combination of world class expertise, industry-leading methodology and unique tools, Intergence has a clear and common purpose – to allow clients to extract more value from their existing assets, whilst delivering a first-class service.
Peter Job, CEO, Intergence, said that Intergence is all about expertise in IT optimization. This is about extracting more value. “One key challenges we found was that we were on the second or third generation structure. It is about of our expertise. We operate on three areas – IT optimization, managed sourcing and managed services around managing applications.
“One of the challenges we are addressing are addressng the end user themselves. They have fast and quicker access to applications. We have launced two new products at Gitex – AppFire – allows you to look at the LAN and WAN and the application itself.
“The AppFlare – gives the ability to monitor applications running across the Internet. We place software agents and they report how apps are running.
“We also do lots of managed sourcing – building infrastructure. We are able to mobilise and get a team of experts to come and build the IT team and build the infrastructure. The third is infrastructure. We are looking at cloud, security, etc.
“We are from the UK, and our business is growing at 35 percent. We moved to Dubai in 2008.This is our fifth Gitex. It can be any medium- or large-enterprise, public sector organization.
“The geography is UK and Europe, as well as the GCC countries. We have plans to go to Africa in the future.
The expertise of Intergence is IT optimization. Enterprises can use the AppFlare to make their infrastructure run more efficiently.
This year’s show is the best according to Intergence. You are always going to see security issues. More people are offering cloud services.
Some trends in 2014 include:
* BYoD will become mainstream.
* IT departments will have to become business centers.
* As for the cloud market, by 2016, 60-70 percent of businesses will have hybrid cloud. Lot of companies are looking at software-defined networks.
* Cloud analytics will go up by two to three years. People can actually see their data, and take informed decisions.
Odyssey Consultants is a PCI QSA, ISO 27001 certified infosecurity, infrastructure and risk management solutions integrator, and a managed security and outsourcing services provider. Founded 2002, it has since evolved into a regional leader in managed security and outsourcing services.
Odyssey’s range of solutions and services lie within a four-phase information security continuum, such as test and access, design and implement, monitor and respond, and outsourcing. According to the company, information security management involves the development, deployment, and ongoing monitoring and review of a combination of preventive, detective, and response processes and controls.
Odyssey is offering the ClearSkies security-as-a-service (SaaS) line of cloud-based integrated security services. ClearSkies platform has the necessary tools that enable the organizations reap benefits of the cloud without compromising on infosecurity.
The first of the ClearSkies series of services offered by Odyssey is the security information and event management (SIEM). SIEM provides organizations an adequate infrastructure in-house, with the opportunity to gain such capability in the cloud. ClearSkies is enriched with the vast know-how, expertise and intelligence of the latest threats and vulnerabilities that come right out of Odyssey’s Ithaca Labs. It transforms the service into a powerful information security tool for the client.
Odyssey also offers managed security and outsourcing (MSOS) services. Key benefits include:
* Enhanced 24/7/365 protection and monitoring of network, systems and security components.
* Continuous log analysis and correlation of events with real-time incident escalation.
* Focus internal resources on core organizational competencies.
* Threat analysis and access to security advisories issued by Ithaca Labs team.
* Minimized mean time to restore/recovery (MTTR) capability by proactive indentification of Internet threats.
* Retention of logs collected in a secure environment, helping clients meet regulatory compliance without needing to deploy costly and complex reporting tools and processes.
* Low TCO by eliminating the need to recruit, train and retain an in-house security capability.
* Notification of in-scope devices outage that impacts log collection.
* Access to MSOS secure portal for reviewing real-time alerts, published incidents and generate reports.
Odyssey has offices in Cyprus and Greece, and is exhibiting at the Gitex 2013 show in Dubai.
Future Horizons hosted the 22nd Annual International Electronics Forum, in association with IDA Ireland, on Oct. 2-4, 2013, at Dublin, Blanchardstown, Ireland. The forum was titled ‘New Markets and Opportunities in the Sub-20nm Era: Business as Usual OR It’s Different This Time.” Here are excerpts from some of the sessions. Those desirous of finding out much more should contact Malcolm Penn, CEO, Future Horizons.
The global interest in graphene research has facilitated our understanding of this rather unique material. However, the transition from the laboratory to factory has hit some challenging obstacles. In this talk I will review the current state of graphene research, focusing on the techniques which allow large scale production.
I will then discuss various aspects of our research which is based on more complex structures beyond graphene. Firstly, hexagonal boron nitride can be used as a thin dielectric material where electrons can tunnel through. Secondly, graphene-boron nitride stacks can be used as tunnelling transistor devices with promising characteristics. The same devices show interesting physics, for example, negative differential conductivity can be found at higher biases. Finally, graphene stacked with thin semiconducting layers which show promising results in photodetection.
I will conclude by speculating the fields where graphene may realistically find applications and discuss the role of the National Graphene Institute in commercializing graphene.
The key challenge for future high-end computing chips is energy efficiency in addition to traditional challenges such as yield/cost, static power, data transfer. In 2020, in order to maintain at an acceptable level the overall power consumption of all the computing systems, a gain in term of power efficiency of 1000 will be required.
To reach this objective, we need to work not only at process and technology level, but to propose disruptive multi-processor SoC architecture and to make some major evolutions on software and on the development of
applications. Some key semiconductor technologies will definitely play a key role such as: low power CMOS technologies, 3D stacking, silicon photonics and embedded non-volatile memory.
To reach this goal, the involvement of semiconductor industries will be necessary and a new ecosystem has to be put in place for establishing stronger partnerships between the semiconductor industry (IDM, foundry), IP provider, EDA provider, design house, systems and software industries.
This presentation looks at the development of the semiconductor and electronics industries from an African perspective, both globally and in Africa. Understanding the challenges that are associated with the wide scale adoption of new electronics in the African continent.
Electronics have taken over the world, and it is unthinkable in today’s modern life to operate without utilising some form of electronics on a daily basis. Similarly, in Africa the development and adoption of electronics and utilisation of semiconductors have grown exponentially. This growth on the African continent was due to the rapid uptake of mobile communications. However, this has placed in stark relief the challenges facing increased adoption of electronics in Africa, namely power consumption.
This background is central to the thesis that the industry needs to look at addressing the twin challenges of low powered and low cost devices. In Africa there are limits to the ability to frequently and consistently charge or keep electronics connected to a reliable electricity grid. Therefore, the current advances in electronics has resulted in the power industry being the biggest beneficiary of the growth in the adoption of electronics.
What needs to be done is for the industry to support and foster research on this subject in Africa, working as a global community. The challenge is creating electronics that meet these cost and power challenges. Importantly, the solution needs to be driven by the semiconductor industry not the power industry. Focus is to be placed on operating in an off-grid environment and building sustainable solutions to the continued challenge of the absence of reliable and available power.
It is my contention that Africa, as it has done with the mobile communications industry and adoption of LED lighting, will leapfrog in terms of developing and adopting low powered and cost effective electronics.
Personalized, preventive, predictive and participatory healthcare is on the horizon. Many nano-electronics research groups have entered the quest for more efficient health care in their mission statement. Electronic systems are proposed to assist in ambulatory monitoring of socalled ‘markers’ for wellness and health.
New life science tools deliver the prospect of personal diagnostics and therapy in e.g., the cardiac, neurological and oncology field. Early diagnose, detailed and fast screening technology and companioning devices to deliver the evidence of therapy effectiveness could indeed stir a – desperately needed – healthcare revolution. This talk addresses the exciting trends in ‘PPPP’ health care and relates them to an innovation roadmap in process technology, electronic circuits and system concepts.
San Jose, USA-based Atrenta’s SpyGlass Predictive Analyzer gives engineers a powerful guidance dashboard that enables efficient verification and optimization of SoC designs early, before expensive and time-consuming traditional EDA tools are deployed. I recently met up with Dr. Ajoy Bose, chairman, president and CEO, Atrenta, to find out more.
I started by asking how Atrenta provides early design analysis for logic designers? He said: “The key ingredient is something we call predictive analysis. That is, we need to analyze a design at a high level of abstraction and predict what will happen when it undergoes detailed implementation. We have a rich library of algorithms that provide highly accurate ‘predictions’, without the time and cost required to actually send a design through detailed implementation.”
There’s a saying: electronic system level (ESL) is where the future of EDA lies. Why? Its because the lower level of abstraction (detailed implementation) of the EDA market is undergoing commoditization and consolidation. There are fewer solutions, and less differentiation between them. At the upper levels of abstraction (ESL), this is not the case. There still exists ample opportunity to provide new and innovative solutions.
Now, how will this help EDA to move up the embedded software space? According to Dr. Bose, the ability to do true hardware/software co-design is still not a solved problem. Once viable solutions are developed, then EDA will be able to sell to the embedded software engineer. This will be a new market, and new revenue for EDA.
How are SpyGlass and GenSys platforms helping the industry? What problems are those solving? Dr. Ajoy Bose said: “SpyGlass is Atrenta’s platform for RTL signoff. It is used by virtually all SoC design teams to ensure the power, performance and cost of their SoC is as good as it can be prior to handoff to detailed implementation.SpyGlass is also used to select and qualify semiconductor IP – a major challenge for all SoC design teams.
“GenSys provides a way to easily assemble and modify designs at the RTL level of abstraction. As a lot of each SoC is re-used design data, the need to modify this data to fit the new design is very prevalent. GenSys provides an easy, correct-by-construction way to get this job done.”
How does the SpyGlass solve RTL design issues, ensuring high quality RTL with fewer design bugs? He added that it’s the predictive analysis technology. SpyGlass provides accurate and relevant information about what will happen when a design is implemented and tested. By fixing these problems early, at RTL, a much higher quality design is handed off to detailed implementation with fewer bugs and associated schedule challenges.
On another note, I asked him why Apple’s choice of chips a factor in influencing the global chip industry? The primary reason is their volume and buying power. Apple is something of a “King Maker” when it comes to who manufactures their chips. Apple is also a thought leader and trend setter, so their decisions affect the decisions of others.
Finally, the global semiconductor industry! How is the global semicon industry doing in H1-2013? As per Dr. Bose: “We see strong growth. Our customers are undertaking many new designs at advanced process technology nodes. We think that this speaks well for future growth of the industry. At a macro level, the consumer sector will drive a lot of the growth ahead. For EDA, the higher levels of abstraction is where the growth will be.”