SEMICON Europa was recently held in Dresden, Germany on Oct. 8-10, 2013. I am extremely grateful to Malcolm Penn, chairman and CEO, Future Horizons for sharing this information with me.
SEMICON Europa included a supplier exhibition where quite a few 450mm wafers were on display. One highlight was a working 450mm FOUP load/unload mechanism, albeit from a Japanese manufacturer. These exhibits did illustrate though that 450mm is for real and no longer a paper exercise. There was also a day-long conference dedicated to 450mm in the largest room. This was crowded throughout the time and a large number of papers were given.
Paul Farrar of G450C began with a presentation about Supply Chain Collaboration for 450mm. His key message was there are 25 different tools delivered to G450C of which 15 are installed in the NFN cleanroom. This number will grow to 42 onsite and 19 offsite by Q1 2015.
He stated that Nikon aims to have a working 193i litho machine in 2H 2014 and install one in Albany in 1H 2015. Farrar also reported a great improvement in wafer quality which now exceed the expected M76 specification, and prime wafers to the M1 spec should be available in Q3 2014. There has also been good progress on wafer reclaim and it is hoped some wafers can be reused up to 10 times, although at least three is the target.
Metrology seems to be one of the most advanced areas with eight different machines already operational. The number of 450mm wafers in their inventory now stands at over 10,000 with these moving between the partners more rapidly. It was immediately noticeable from Farrar’s speech that G450C is now recognising the major contribution Europe is making to 450mm and is looking for more collaborations.
Facilities part of F450C
Peter Csatary of M&W then dealt with the facilities part of G450C, known as F450C. This group consists of:
• M&W (co-ordination)
• Mega Fluid Systems
• Haws Corp.
• Air Liquide
• Ceres Technlogies
• CS Clean Systems
F450C is seen as streamlining communications with the semiconductor companies and their process tool suppliers. The group will focus on four key areas, namely Environmental Footprint, Facility Interface Requirements, Cost and Duration, and Safety and Sustainability.
One interesting point raised was that 450mm equipment is inherently more massive and one suggestion has been that ceiling mounted cranes will be required to install and remove equipment. This of course means that fab roofs would need to be stronger than previously. This topic was discussed at the latest F450C meeting subsequent to this conference.
Another new concept is that of a few standardised 3D templates and adapter plates to allow fab services to be pre-installed before the equipment is placed. An interesting point made elsewhere by M&W is that the current preference is to place a fab where there are already other fabs in existence so that the infrastructure to transport products, materials and services is already in place, as are basic utilities such as power, natural gas and water supply.
However, the scale of the expected utility demand at 450 mm ups the stakes as for example a large 300 mm facility uses about 4 million gallons of water per day, whereas a 450 mm fab will use almost double that, putting immense strain on a location’s infrastructure should there be other fabs in the region. This could affect future site selections.
An outcome of this phenomenon is that the reduction, reclaim and re-use of materials will no longer be driven only by the desire to be a good corporate citizen, but will also be driven by cost control and to ensure availability of required resources such as power, water, specialty gases and chemicals.
Future Horizons hosted the 22nd Annual International Electronics Forum, in association with IDA Ireland, on Oct. 2-4, 2013, at Dublin, Blanchardstown, Ireland. The forum was titled ‘New Markets and Opportunities in the Sub-20nm Era: Business as Usual OR It’s Different This Time.” Here are excerpts from some of the sessions. Those desirous of finding out much more should contact Malcolm Penn, CEO, Future Horizons.
The global interest in graphene research has facilitated our understanding of this rather unique material. However, the transition from the laboratory to factory has hit some challenging obstacles. In this talk I will review the current state of graphene research, focusing on the techniques which allow large scale production.
I will then discuss various aspects of our research which is based on more complex structures beyond graphene. Firstly, hexagonal boron nitride can be used as a thin dielectric material where electrons can tunnel through. Secondly, graphene-boron nitride stacks can be used as tunnelling transistor devices with promising characteristics. The same devices show interesting physics, for example, negative differential conductivity can be found at higher biases. Finally, graphene stacked with thin semiconducting layers which show promising results in photodetection.
I will conclude by speculating the fields where graphene may realistically find applications and discuss the role of the National Graphene Institute in commercializing graphene.
The key challenge for future high-end computing chips is energy efficiency in addition to traditional challenges such as yield/cost, static power, data transfer. In 2020, in order to maintain at an acceptable level the overall power consumption of all the computing systems, a gain in term of power efficiency of 1000 will be required.
To reach this objective, we need to work not only at process and technology level, but to propose disruptive multi-processor SoC architecture and to make some major evolutions on software and on the development of
applications. Some key semiconductor technologies will definitely play a key role such as: low power CMOS technologies, 3D stacking, silicon photonics and embedded non-volatile memory.
To reach this goal, the involvement of semiconductor industries will be necessary and a new ecosystem has to be put in place for establishing stronger partnerships between the semiconductor industry (IDM, foundry), IP provider, EDA provider, design house, systems and software industries.
This presentation looks at the development of the semiconductor and electronics industries from an African perspective, both globally and in Africa. Understanding the challenges that are associated with the wide scale adoption of new electronics in the African continent.
Electronics have taken over the world, and it is unthinkable in today’s modern life to operate without utilising some form of electronics on a daily basis. Similarly, in Africa the development and adoption of electronics and utilisation of semiconductors have grown exponentially. This growth on the African continent was due to the rapid uptake of mobile communications. However, this has placed in stark relief the challenges facing increased adoption of electronics in Africa, namely power consumption.
This background is central to the thesis that the industry needs to look at addressing the twin challenges of low powered and low cost devices. In Africa there are limits to the ability to frequently and consistently charge or keep electronics connected to a reliable electricity grid. Therefore, the current advances in electronics has resulted in the power industry being the biggest beneficiary of the growth in the adoption of electronics.
What needs to be done is for the industry to support and foster research on this subject in Africa, working as a global community. The challenge is creating electronics that meet these cost and power challenges. Importantly, the solution needs to be driven by the semiconductor industry not the power industry. Focus is to be placed on operating in an off-grid environment and building sustainable solutions to the continued challenge of the absence of reliable and available power.
It is my contention that Africa, as it has done with the mobile communications industry and adoption of LED lighting, will leapfrog in terms of developing and adopting low powered and cost effective electronics.
Personalized, preventive, predictive and participatory healthcare is on the horizon. Many nano-electronics research groups have entered the quest for more efficient health care in their mission statement. Electronic systems are proposed to assist in ambulatory monitoring of socalled ‘markers’ for wellness and health.
New life science tools deliver the prospect of personal diagnostics and therapy in e.g., the cardiac, neurological and oncology field. Early diagnose, detailed and fast screening technology and companioning devices to deliver the evidence of therapy effectiveness could indeed stir a – desperately needed – healthcare revolution. This talk addresses the exciting trends in ‘PPPP’ health care and relates them to an innovation roadmap in process technology, electronic circuits and system concepts.
On the growth drivers for GP MCUs, the market growth is driven by faster migration to 32 bit platform. ST has been the first to bring the ARM Cortex based solution, and now targets leadership position on 32bit MCUs. An overview of the STM32 portfolio indicates high-performance MCUs with DSP and FPU up to 608 CoreMark and up to180 MHz/225 DMIPS.
Features of the STM32F4 product lines, specifically, the STM32F429/439, include 180 MHz, 1 to 2-MB Flash and 256-KB SRAM. The low end STM32F401 has features such as 84 MHz, 128-KB to 256-KB Flash and 64-KB SRAM.
The STM32F401 provides thebest balance in performance, power consumption, integration and cost. The STM32F429/439 is providing more resources, more performance and more features. There is close pin-to-pin and software compatibility within the STM32F4
series and STM32 platform.
The STM32 F429-F439 high-performance MCUs with DSP and FPU are:
• World’s highest performance Cortex-M MCU executing from Embedded Flash, Cortex-M4 core with FPU up to 180 MHz/225 DMIPS.
• High integration thanks to ST 90nm process (same platform as F2 serie): up to 2MB Flash/256kB SRAM.
• Advanced connectivity USB OTG, Ethernet, CAN, SDRAM interface, LCD TFT controller.
• Power efficiency, thanks to ST90nm process and voltage scaling.
In terms of providing more performance, the STM32F4 provides up to 180 MHz/225 DMIPS with ART Accelerator, up to 608 CoreMark result, and ARM Cortex-M4 with floating-point unit (FPU).
The STM32F427/429 highlights include:
• 180 MHz/225 DMIPS.
• Dual bank Flash (in both 1-MB and 2-MB), 256kB SRAM.
• SDRAM Interface (up to 32-bit).
• LCD-TFT controller supporting up to SVGA (800×600).
• Better graphic with ST Chrom-ART Accelerator:
– x2 more performance vs. CPU alone
– Offloads the CPU for graphical data generation
* Raw data copy
* Pixel format conversion
* Image blending (image mixing with some transparency).
• 100 μA typ. in Stop mode.
Some real-life examples of the STM32F4 include the smart watch, where it is the main application controller or sensor hub, the smartphone, tablets and monitors, where it is the sensor hub for MEMS and optical touch, and the industrial/home automation panel, where it is the main application controller. These can also be used in Wi-Fi modules for the Internet of Things (IoT), such as appliances, door cameras, home thermostats, etc.
These offer outstanding dynamic power consumption thanks to ST 90nm process, as well as low leakage current made possible by advanced design technics and architecture (voltage scaling). ST is making a large offering of evaluation boards and Discovery kits. The STM32F4 is also offering new firmware libraries. SEGGER and ST signed an agreement around the emWin graphical stack. The solution is called STemWin.
Skin inspired electronics can be used for mobile health such as wireless sensor bands, cell phone and computer at doctor’s office, according to Prof. Zhenan Bao, Stanford University. She was delivering the inaugural lecture on day two of the ongoing 13th Global Electronics Summit in Santa Cruz, USA.
There are organic field-effect transistors (OTFTs). The current flow is moderated by binding of molecules and pressure. E-skin sensor functions have touch (pressure) sensors, chemical sensors and biological sensors. There are other flexible pressure sensors such as conductive rubber, which is thick and has hysteresis. Another type is poly-vinylidene fluoride (PVDF) thin film. Yet another type is the OTFT touch (pressure) sensor.
There is an example of the heart pulse measurement. Another related device is the full pulse wave for medical diagnostics such as blood pressure monitoring, detecting arrhythmia, heart defects and vascular diseases. In terms of temperature sensing, Stanford has developed a flexible body temperature sensor made of plastic.
There is chemical sensing as well. These are very stable and can be put in sea water. There are also electronics to mimic the body, such as the biodegradable OTFT. Another example is the transparent, stretchable pressure sensor. Finally, the other attribute of the human skin is self healing. Stanford University also developed the all-self-healing e-skin.
The e-skin concept ‘Super Skin’ has touch pressure sensors, chemical or biological sensors in air – electronic nose and liquid environments – electronic tongue, flexible strechable materials, biocompatible or biodegradable, self-powered — strechable solar cells and self healing.
According to Prof. Yi Cui, Dept. of Materials, Science & Engineering, Stanford University, nanometer is an enabling technology. We can do applications such as electronics, energy, environment and health. Some examples are high energy batteries, printed energy storage devices on paper, textile and sponge, etc. He was delivering the inaugural address at the Globalpress Electronics Summit 2013, being held in Santa Cruz, USA.
High energy battery has portable and stationary applications. In portable, energy density, cost and safety are important. In stationary, cost, power, energy efficiency and ultra-long life are important. The standard is 500 cycles at 80 percent. One of the challenges of silicon anodes is that Si has 4200 mAh/g of silicon, 10 times more than carbon.
Nanowires can offer shorter distance for Li diffusion (high power), good strain release and interface control (for better cycle life), and continuous electron transport pathway (high power). In-situ transmission electron microscopy (TEM). Double walled hollow structure provides stable solid electrolyte interphase (SEI). The outer surface is static. Amprius, where Prof. Cui is CTO, is a $6 million US government funded enterprise. Amprius China started in Nanjing, in April 2012.
Another example is printed energy storage devices on paper, textile and sponge. For low-cost scaffold, paper, textile and sponge, are used. There is cellulose paper and synthetic textile, besides sponge, as well.
There can be transparent batteries. It is actually very hard to develop those. The challenges for making a transparent battery are Al film, cathode, electrolyte, etc. An idea: dimension smaller than eye’s detection limit (50-100 um). Also, grids are well aligned.
Transparent conducting electrodes provide electrical and allow light to pass through. Apps include solar cells, etc. Indium tin oxide (ITO) has a low abundance of indium, brittleness when bent, and sputtering at high cost. Electrospinning of nanofibers is done for transparent electrodes. An example is the trough-shaped nanowires.
Yet another example is the water nanofilters for killing pathogens. The processes available for killing bacteria include chemical disinfection, UV disinfection, boiling, etc.
The first generation product is currently ready at Amprius. Amprius licensed the IP from Stanford. Stanford is also an investor in Amprius.
How will the global semiconductor industry perform in 2013? After a contrasting spell of predictions for 2012, I see no change in 2013! So, what’s the answer to the million-dollar question posed as my headline?
After a disappointing and challenging 2012, global semiconductor executives believe that the worst is nearly behind them, and they are making investments to position their companies for a sustained, broad-based, multi-year recovery in 2013, as per a KPMG global semiconductor survey.
On Feb. 3, the Semiconductor Industry Association (SIA) announced that worldwide semiconductor sales for 2012 reached $291.6 billion, the industry’s third-highest yearly total, ever but a decrease of 2.7 percent from the record total of $299.5 billion set in 2011. Total sales for the year narrowly beat expectations from the World Semiconductor Trade Statistics (WSTS) organization’s industry forecast.
The World Semiconductor Trade Statistics (WSTS) estimated that the global semiconductor market in 2012 will be $290 billion, down 3.2 percent from 2011, followed by a recovery of positive 4.5 percent growth to $303 billion in 2013.
The worldwide semiconductor revenue is projected to total $311 billion in 2013, a 4.5 percent increase from 2012 revenue, according to Gartner Inc. The worldwide semiconductor revenue totaled $298 billion in 2012, a 3 percent decline from 2011 revenue of $307 billion, according to preliminary results by Gartner.
The outlook for the global semiconductor industry in 2013 will likely be 7.9 percent, according to Future Horizons. It means, the industry will likely grow to $315.4 billion in 2013. The Cowan LRA foreasting model put out the following sales and year-on-year sales growth numbers for 2012 and 2013: $292.992 billion (-2.2 percent) and $309.244 billion (+5.5 percent), respectively.
Databeans expects 2013 will see a rebound, with the semiconductor industry growing by 7 percent from 2012 totals to reach $313.04 billion. IDC forecasted that the worldwide semiconductor revenues will grow 4.9 percent and reach $319 billion in 2013.
IHS iSuppli claimed that the semiconductor silicon revenue will close 2012 at $303 billion, down 2.3 percent from $310 billion in 2011. The projected decline comes in contrast to the 1.3 percent gain made last year.
IC Insights forecasted 6 percent IC unit growth for 2013 based on expectations of global GDP to rise to 3.2 percent. According to IC
Insights, in 2017, China is expected to represent 38 percent of the worldwide IC market, up from 23 percent, 10 years earlier in 2007. Does this mean the USA and Europe are loosing their sheen?
The global semiconductor industry may record only 1.5 percent growth In 2013, as per The Infornation Network. There is, however, the possibility for a snap-back in revenues for 2013, irrespective of macroeconomic factors, such as what occurred in 2010.
Over the next three years, industry analysts estimate the global industry will grow approximately 6 percent 2013-2016 CAGR, according to Somshubro Pal Choudhury, managing director, Analog Devices India Pvt. Ltd.
Late 2012, I was speaking with Dr. Wally Rhines, chairman and CEO, Mentor Graphics. He said: “After almost no growth in 2012, most of the analysts are expecting improvement in semiconductor market growth in the coming year. Currently, the analyst forecasts for the semiconductor industry in 2013 range from 4.2 percent on the low side to 16.6 percent on the high side, with most firms coming in between 6 percent and 10 percent. The average of forecasts among the major semiconductor analyst firms is approximately 8.2 percent.”
WSTS also anticipates the world market to grow 5.2 percent to $319 billion in 2014, with healthy mid single digit growth across most of geographical regions and semiconductor product categories, supported by the healthier economy of the world.
Lastly, Forbes said that 2013 will be a turning point for the global semiconductor market.
This is a continuation of my coverage of the fortunes of the global semiconductor industry. I would like to acknowledge and thank Mike Cowan, an independent semiconductor analyst and developer of the Cowan LRA model, who has provided me the latest numbers.
According to the WSTS’s August (posted Oct. 9th, 2012 on its website) actual global semiconductor sales of $23.013 billion, the updated monthly forecast expectation for full year 2012′s total global semiconductor sales is expected to be $294.6 billion as calculated by the Cowan LRA forecasting model.
This latest update to the 2012 sales forecast estimate corresponds to a year-over-year sales growth expectation of minus 1.7 percent, which dropped from the previous month’s year-over-year sales growth forecast estimate of minus 0.5 percent.
It is also lower than the joint WSTS/SIA Spring 2012 sales growth forecast (published in June of this year) of plus 0.45 percent which corresponds to a global sales forecast estimate of $300.9 billion. Therefore, the model’s latest monthly sales forecast output (based on the just announced August 2012’s actual sales) continues to project even more negative sales growth for 2012 compared to 2011 and has remained negative for the third month in a row.
The model’s previous month’s forecast expectation for August’s actual sales was $24.8 billion as shown in the first table. This forecasted sales number generated last month was much higher than the just published actual August sales of $23.013 billion (larger by $1.76 billion or down 7.1 percent). This results in an M.I. (Momentum Indicator) of minus 7.1 implying that the sales growth trend will be ‘marginally’ down (that is, more negative) over the near term forecast horizon.
Incorporating August’s just published actual sales number into the Cowan LRA forecasting model also produces the latest updated sales and sales growth forecast expectations for the remaining two quarters of 2012 as well as for the four quarters of 2013.
These results are summarized in the first table. Also provided in the table are the corresponding previous month’s sales and sales growth forecast numbers which were determined last month thereby providing sequential monthly forecast estimate comparisons.
As displayed in the Table 1, the latest projected full year 2012 global semi sales forecast estimate decreased to $294.6 billion from last month’s sales forecast expectation of $298.0 billion, a decrease of $3.5 billion or down sequentially by 1.2 percent. Correspondingly, the updated 2012 sales growth forecast expectation declined to minus 1.7 percent from last month’s sales growth forecast estimate of minus 0.5 percent, a decrease of 1.2 percentage points, still remaining in the negative territory; however, more negative than last month.
Also, next month’s September actual sales forecast estimate is projected to come in at $29.8 billion. Consequently, the resulting September’s actual sales forecast estimate equates to a September 3MMA sales expectation of $25.5 billion which is up from August’s 3MMA sales result of $24.3 billion. It should be emphasized that this forecasted September 3MMA sales number assumes no (or very minimal) sales revisions to either July or August’s actual sales numbers just published by the WSTS.
Additionally, year-to-date cumulative sales for 2012 (total yearly sales through August) came in at $189.5 billion compared to last year’s year-to-date cumulative sales number of $198.5 billion. This equates to a 2012 year-to-date (through August) sales growth result of minus 4.6 percent. This implies that global semiconductor sales for the second half of 2012 must exhibit significant strength to reach last year’s sales number of $299.52 billion in order that the full year’s 2012 sales growth will break even with last year’s sales, let alone show a mildly positive sales growth for the year.
The Semiconductor Industry Association (SIA) announced that the worldwide semiconductor sales for 2011 reached a record $299.5 billion, a year-on-year increase of 0.4 percent from the $298.3 billion recorded in 2010. While this is a very small increase over 2010, the SIA has said this is a record! Perhaps, it is, as the $300 billion mark is about to be breached!!
The SIA, in its release, has talked about the challenges that the global industry has had to face in 2011, notably, the tsunami in Japan, and the floods in Thailand. That the global semiconductor industry has still managed to reach nearly $300 billion is a feat in itself! And, as usual, Asia does continue to play a relatively large role.
According to the SIA, the optoelectronic, sensor and actuator, and microprocessor markets have showed solid year over year growth. In fact, sensors and actuators are said to have showed the highest year over year growth at 15.5 percent to $8 billion in 2011. Likewise, MOS microprocessors have also shown commendable growth.
So, what does 2012 hold for the global semiconductor industry?
Last November, IC Insights had said that although low single-digit growth is forecast for the total semiconductor market in 2011, several companies are likely to register results that are quite different. There have already been some forecasts since then. IHS iSuppli has said that the semiconductor industry revenue is likely to reach $323.2 billion in 2012. As of now, the global semiconductor sales has been forecast at $329.4 billion for 2012 by Mike Cowan, while the Singapore Semiconductor Industry Association (SSIA) has a figure of $313 billion for 2012. Keep your eyes wide open!
It was indeed a pleasant surprise to receive an email from Electronics Weekly, yesterday evening, informing me that my blog was recently shortlisted/nominated in the 2008 ElectronicsWeekly.com Blog Awards by a reader of ElectronicsWeekly.com!
All of the nominated blogs have apparently been considered by the panel of judges at ElectronicsWeekly.com. The email said, “I am delighted to inform you that you have made the shortlist in the Best Electronics Hardware Blog category.”
The list can be seen on Electronics Weekly’s (www.electronicsweekly.com) website!
Wow! I must add that here that there are such great blogs and bloggers in that list that I went dizzy for a few minutes!
I never expected my blog to reach this kind of appeal or level! Nor do I think I have that kind of traffic, as this blog has more to do with serious stuff, rather than talk about gadgets, etc. In fact, somebody once told me last year that no one would bother about a blog on semicon and electronics, nor would I get any traffic!
Well, all of this has never bothered me. I’m here to blog about what I feel is close to my heart! If folks happen to stop by, I am extremely grateful to all of them!
Irrespective of whether I win this award, it is just the right time to thank all of you, dear readers of my blog! Thanks to all of you for choosing to stop by my blog occasionally! I sincerely hope you find the content interesting and appealing enough.
There’s lots happening in the semiconductor, electronics and telecom industries, and hope that I am able to add my views on all of those in the coming months.
Thanks again, my dear readers. Please keep those suggestions coming. I will try to live up to your expectations. Have a great Halloween, everyone!