The SEMI/Gartner Market Symposium was held Semicon West 2014 at San Francisco, on July 7. Am grateful to Ms. Becky Tonnesen, Gartner, and Ms Agnes Cobar, SEMI, for providing me the presentations. Thanks are also due to Ms Deborah Geiger, SEMI.
Dean Freeman, research VP, Gartner, outlined the speakers:
• Sunit Rikhi, VP, Technology and Manufacturing Group, GM, Intel Custom Foundry Intel, presented on Competing in today’s Fabless Ecosystem.
• Bob Johnson, VP Research, Gartner, presented the Semiconductor Capital Spending Outlook.
• Christian Gregor Dieseldorff, director Market Research, SEMI, presented the SEMI World Fab Forecast: Analysis and Forecast for Fab Spending, Capacity and Technology.
• Sam Wang, VP Research Analyst, Gartner, presented on How Foundries will Compete in a 3D World.
• Jim Walker, VP Research, Gartner, presented on Foundry versus SATS: The Battle for 3D and Wafer Level Supremacy.
• Dr. Dan Tracy, senior director, Industry Research & Statistics, SEMI, presented on Semiconductor Materials Market Outlook.
Let’s start with Sunit Rikhi at Intel.
As a new player in the fabless eco-system, Intel focuses on:
* The value it brings to the table.
* How it delivers on platforms of capability and services.
* How it leverage the advantages of being inside the world’s leading Integrated Device Manufacturer (IDM)
* How it face the challenges of being inside the world’s leading IDM.
Intel has leadership in silicon technologies. Transistor performance per watt is the critical enabler for all. Density improvements offset wafer cost trends. Intel currently has ~3.5-year lead in introducing revolutionary transistor technologies.
In foundry capabilities and services platforms, Intel brings differentiated value on industry standard platforms. 22nm was started in 2011, while 14nm was started in 2013. 10nm will be starting in 2015. To date, 125 prototype designs have been processed.
Intel offers broad capability and services on industry standard platforms. It also has fuller array of co-optimized end-to-end services. As for the packaging technology, Intel has been building better products through
multi-component integration. Intel has also been starting high on the yield learning curve.
Regarding IDM challenges, such as high-mix-low-volume configuration, Intel has been doing configuration optimization in tooling and set-up. It has also been separating priority and planning process for customers. Intel has been providing an effective response for every challenge.
Some of Intel Custom Foundry announced customers include Achronix, Altera, Microsemi, Netronome, Panasonic and Tabula.
The year 2014 is expected to be a major year for the global semiconductor industry. The industry will and continue to innovate!
Apparently, there are huge expectations from certain segments such as the so-called Internet of Things (IoT) and wearable electronics. There will likely be focus on the connected car. Executives have been stating there could be third parties writing apps that can help cars. Intel expects that technology will be inspiring optimism for healthcare in future. As per a survey, 57 percent of people believe traditional hospitals will be obsolete in the future.
Some other entries from 2013 include Qualcomm, who introduced the Snapdragon 410 chipset with integrated 4G LTE world mode for high-volume smartphones. STMicroelectronics joined ARM mbed project that will enable developers to create smart products with ARM-based industry-leading STM32 microcontrollers and accelerate the Internet of Things.
A look at the industry itself is interesting! The World Semiconductor Trade Statistics Inc. (WSTS) is forecasting the global semiconductor market to be $304 billion in 2013, up 4.4 percent from 2012. The market is expected to recover throughout 2013, driven mainly by double digit growth of Memory product category. By region, all regions except Japan will grow from 2012. Japan market is forecasted to decline from 2012 in US dollar basis due to steep Japanese Yen depreciation compared to 2012.
WSTS estimates that the worldwide semiconductor market is predicted to grow further in 2014 and 2015. According to WSTS, the global semiconductor market is forecasted to be up 4.1 percent to $317 billion in 2014, surpassing historical high of $300 billion registered in 2011. For 2015, it is forecasted to be $328 billion, up 3.4 percent.
All product categories and regions are forecasted to grow positively in each year, with the assumption of macro economy recovery throughout the forecast period. By end market, wireless and automotive are expected to grow faster than total market, while consumer and computer are assumed to remain stagnant.
Now, all of this remains to be seen!
Earlier, while speaking with Dr. Wally Rhines of Mentor, and Jaswinder Ahuja of Cadence, both emphasized the industry’s move to 14/16nm. Xilinx estimates that 28nm will have a very long life. It also shipped the 20nm device in early Nov. 2013.
In a 2013 survey, carried out by KPMG, applications markets identified as most important by at least 55 percent of the respondents were: Mobile technology – 69 percent; Consumer – 66 percent; Computing – 63 percent; Alternative/Renewal Energy – 63 percent; Industrial – 62 percent; Automotive – 60 percent; Medical – 55 percent; Wireline Communications – 55 percent.
Do understand that there is always a line between hope and forecasts, and what the end result actually turns out to be! In the meantime, all of us continue to live with the hope that the global semiconductor will carry on flourishing in the years to come. As Brian Fuller, Cadence, says, ‘the future’s in our hands; let’s not blow it!’
ARM calls the spirit of innovation as collective intelligence at every level. It is within devices, between people, through tech and across the world. We are still pushing boundaries of mobile devices.
Speaking at the ARM Summit in Bangalore, Dr Mark Brass, corporate VP, Operations, ARM, said that the first challenge was the number of people on the planet. Technology development and innovation also pose challenges.
According to him, mobile phones are forecast to grow 7.3 percent in 2013 driven by 1 billion smartphones. Mobile data will ramp up 12 times between now and 2018. Mobile and connectivity are creating further innovation.
August, a compamy, has introduced an electronic lock for doors, controlled by the smartphone. Another one is Proteus, which looks at healthcare. The smartphone is becoming the center of our world. All sorts of sensors are also getting into smartphones. Next, mobile and connectivity are growing in automobiles. Companies like TomTom are competing with automobile companies. Connectivity is also transforming infrastructure and data centers. They are now building off the mobile experience.
As per ARM, an IoT survey done has revealed that 76 percent of companies are dealing with IoT. As more things own information, there will be much more data. The IoT runs on ARM.
“There’s more going on than just what you think. IoT is not just about things. Skills development should not be an afterthought. Co-operation is critical. Solutions will emerge. All sorts of things are going to happen. Three years from now, only 4 percent of companies won’t have IoT in the business at all,” Dr. Brass added.
IoT will be present in industrial, especially motors, transportation, energy, and healthcare. Smart meters are coming in to help with energy management. There is a move to Big Data from Little Data.
Challenges in 2020 would be in transportation, energy, healthcare and education. ARM and the ARM partnership is addressing those. “We are delivering an unmatched diversity of solutions. We are scaling from sensors to servers, connecting our world,” Dr. Brass concluded.
Today, at San Francisco, Apple introduced the iPad Air that features a 9.7-inch Retina display in a new thinner and lighter design!
Earlier, yesterday, in India, Samsung announced the GALAXY Note 10.1! However, it isn’t any match for the iPad Air!!
The release says that precision-engineered to weigh just one pound, the iPad Air is now 20 percent thinner and 28 percent lighter than the fourth generation iPad, and with a narrower bezel the borders of iPad Air are dramatically thinner-making content even more immersive.
Apple also introduced the new iPad mini featuring Retina display and 64-bit Apple-designed A7 chip.
The iPads feature two antennae to support Multiple-In-Multiple-Out (MIMO) technology, thus bringing twice the Wi-Fi performance to iPad Air and iPad mini with Retina display at a blazingly fast data rate up to 300 Mbps. The fact that Apple will be offering 128GB for both the models shows that it really means business!
And, what will it do to Apple’s business? Well, there will definitely be many more buyers for sure. Gosh, what will I do? I have a third-gen iPad and this is a fifth-gen model! Never mind! All the best to those who would be buying the iPad Air!
Besides the iPad Air, there were some other announcements made by Apple. First, Apple introduced the next gen iWork and iLife apps for OS X, as well as the OS X Mavericks, which is now available free from Mac App store. Apple also introduced the all new Mac Pro! Brilliant!
Future Horizons hosted the 22nd Annual International Electronics Forum, in association with IDA Ireland, on Oct. 2-4, 2013, at Dublin, Blanchardstown, Ireland. The forum was titled ‘New Markets and Opportunities in the Sub-20nm Era: Business as Usual OR It’s Different This Time.” Here are excerpts from some of the sessions. Those desirous of finding out much more should contact Malcolm Penn, CEO, Future Horizons.
The global interest in graphene research has facilitated our understanding of this rather unique material. However, the transition from the laboratory to factory has hit some challenging obstacles. In this talk I will review the current state of graphene research, focusing on the techniques which allow large scale production.
I will then discuss various aspects of our research which is based on more complex structures beyond graphene. Firstly, hexagonal boron nitride can be used as a thin dielectric material where electrons can tunnel through. Secondly, graphene-boron nitride stacks can be used as tunnelling transistor devices with promising characteristics. The same devices show interesting physics, for example, negative differential conductivity can be found at higher biases. Finally, graphene stacked with thin semiconducting layers which show promising results in photodetection.
I will conclude by speculating the fields where graphene may realistically find applications and discuss the role of the National Graphene Institute in commercializing graphene.
The key challenge for future high-end computing chips is energy efficiency in addition to traditional challenges such as yield/cost, static power, data transfer. In 2020, in order to maintain at an acceptable level the overall power consumption of all the computing systems, a gain in term of power efficiency of 1000 will be required.
To reach this objective, we need to work not only at process and technology level, but to propose disruptive multi-processor SoC architecture and to make some major evolutions on software and on the development of
applications. Some key semiconductor technologies will definitely play a key role such as: low power CMOS technologies, 3D stacking, silicon photonics and embedded non-volatile memory.
To reach this goal, the involvement of semiconductor industries will be necessary and a new ecosystem has to be put in place for establishing stronger partnerships between the semiconductor industry (IDM, foundry), IP provider, EDA provider, design house, systems and software industries.
This presentation looks at the development of the semiconductor and electronics industries from an African perspective, both globally and in Africa. Understanding the challenges that are associated with the wide scale adoption of new electronics in the African continent.
Electronics have taken over the world, and it is unthinkable in today’s modern life to operate without utilising some form of electronics on a daily basis. Similarly, in Africa the development and adoption of electronics and utilisation of semiconductors have grown exponentially. This growth on the African continent was due to the rapid uptake of mobile communications. However, this has placed in stark relief the challenges facing increased adoption of electronics in Africa, namely power consumption.
This background is central to the thesis that the industry needs to look at addressing the twin challenges of low powered and low cost devices. In Africa there are limits to the ability to frequently and consistently charge or keep electronics connected to a reliable electricity grid. Therefore, the current advances in electronics has resulted in the power industry being the biggest beneficiary of the growth in the adoption of electronics.
What needs to be done is for the industry to support and foster research on this subject in Africa, working as a global community. The challenge is creating electronics that meet these cost and power challenges. Importantly, the solution needs to be driven by the semiconductor industry not the power industry. Focus is to be placed on operating in an off-grid environment and building sustainable solutions to the continued challenge of the absence of reliable and available power.
It is my contention that Africa, as it has done with the mobile communications industry and adoption of LED lighting, will leapfrog in terms of developing and adopting low powered and cost effective electronics.
Personalized, preventive, predictive and participatory healthcare is on the horizon. Many nano-electronics research groups have entered the quest for more efficient health care in their mission statement. Electronic systems are proposed to assist in ambulatory monitoring of socalled ‘markers’ for wellness and health.
New life science tools deliver the prospect of personal diagnostics and therapy in e.g., the cardiac, neurological and oncology field. Early diagnose, detailed and fast screening technology and companioning devices to deliver the evidence of therapy effectiveness could indeed stir a – desperately needed – healthcare revolution. This talk addresses the exciting trends in ‘PPPP’ health care and relates them to an innovation roadmap in process technology, electronic circuits and system concepts.
On the growth drivers for GP MCUs, the market growth is driven by faster migration to 32 bit platform. ST has been the first to bring the ARM Cortex based solution, and now targets leadership position on 32bit MCUs. An overview of the STM32 portfolio indicates high-performance MCUs with DSP and FPU up to 608 CoreMark and up to180 MHz/225 DMIPS.
Features of the STM32F4 product lines, specifically, the STM32F429/439, include 180 MHz, 1 to 2-MB Flash and 256-KB SRAM. The low end STM32F401 has features such as 84 MHz, 128-KB to 256-KB Flash and 64-KB SRAM.
The STM32F401 provides thebest balance in performance, power consumption, integration and cost. The STM32F429/439 is providing more resources, more performance and more features. There is close pin-to-pin and software compatibility within the STM32F4
series and STM32 platform.
The STM32 F429-F439 high-performance MCUs with DSP and FPU are:
• World’s highest performance Cortex-M MCU executing from Embedded Flash, Cortex-M4 core with FPU up to 180 MHz/225 DMIPS.
• High integration thanks to ST 90nm process (same platform as F2 serie): up to 2MB Flash/256kB SRAM.
• Advanced connectivity USB OTG, Ethernet, CAN, SDRAM interface, LCD TFT controller.
• Power efficiency, thanks to ST90nm process and voltage scaling.
In terms of providing more performance, the STM32F4 provides up to 180 MHz/225 DMIPS with ART Accelerator, up to 608 CoreMark result, and ARM Cortex-M4 with floating-point unit (FPU).
The STM32F427/429 highlights include:
• 180 MHz/225 DMIPS.
• Dual bank Flash (in both 1-MB and 2-MB), 256kB SRAM.
• SDRAM Interface (up to 32-bit).
• LCD-TFT controller supporting up to SVGA (800×600).
• Better graphic with ST Chrom-ART Accelerator:
— x2 more performance vs. CPU alone
— Offloads the CPU for graphical data generation
* Raw data copy
* Pixel format conversion
* Image blending (image mixing with some transparency).
• 100 μA typ. in Stop mode.
Some real-life examples of the STM32F4 include the smart watch, where it is the main application controller or sensor hub, the smartphone, tablets and monitors, where it is the sensor hub for MEMS and optical touch, and the industrial/home automation panel, where it is the main application controller. These can also be used in Wi-Fi modules for the Internet of Things (IoT), such as appliances, door cameras, home thermostats, etc.
These offer outstanding dynamic power consumption thanks to ST 90nm process, as well as low leakage current made possible by advanced design technics and architecture (voltage scaling). ST is making a large offering of evaluation boards and Discovery kits. The STM32F4 is also offering new firmware libraries. SEGGER and ST signed an agreement around the emWin graphical stack. The solution is called STemWin.
San Jose, USA-based Atrenta’s SpyGlass Predictive Analyzer gives engineers a powerful guidance dashboard that enables efficient verification and optimization of SoC designs early, before expensive and time-consuming traditional EDA tools are deployed. I recently met up with Dr. Ajoy Bose, chairman, president and CEO, Atrenta, to find out more.
I started by asking how Atrenta provides early design analysis for logic designers? He said: “The key ingredient is something we call predictive analysis. That is, we need to analyze a design at a high level of abstraction and predict what will happen when it undergoes detailed implementation. We have a rich library of algorithms that provide highly accurate ‘predictions’, without the time and cost required to actually send a design through detailed implementation.”
There’s a saying: electronic system level (ESL) is where the future of EDA lies. Why? Its because the lower level of abstraction (detailed implementation) of the EDA market is undergoing commoditization and consolidation. There are fewer solutions, and less differentiation between them. At the upper levels of abstraction (ESL), this is not the case. There still exists ample opportunity to provide new and innovative solutions.
Now, how will this help EDA to move up the embedded software space? According to Dr. Bose, the ability to do true hardware/software co-design is still not a solved problem. Once viable solutions are developed, then EDA will be able to sell to the embedded software engineer. This will be a new market, and new revenue for EDA.
How are SpyGlass and GenSys platforms helping the industry? What problems are those solving? Dr. Ajoy Bose said: “SpyGlass is Atrenta’s platform for RTL signoff. It is used by virtually all SoC design teams to ensure the power, performance and cost of their SoC is as good as it can be prior to handoff to detailed implementation.SpyGlass is also used to select and qualify semiconductor IP – a major challenge for all SoC design teams.
“GenSys provides a way to easily assemble and modify designs at the RTL level of abstraction. As a lot of each SoC is re-used design data, the need to modify this data to fit the new design is very prevalent. GenSys provides an easy, correct-by-construction way to get this job done.”
How does the SpyGlass solve RTL design issues, ensuring high quality RTL with fewer design bugs? He added that it’s the predictive analysis technology. SpyGlass provides accurate and relevant information about what will happen when a design is implemented and tested. By fixing these problems early, at RTL, a much higher quality design is handed off to detailed implementation with fewer bugs and associated schedule challenges.
On another note, I asked him why Apple’s choice of chips a factor in influencing the global chip industry? The primary reason is their volume and buying power. Apple is something of a “King Maker” when it comes to who manufactures their chips. Apple is also a thought leader and trend setter, so their decisions affect the decisions of others.
Finally, the global semiconductor industry! How is the global semicon industry doing in H1-2013? As per Dr. Bose: “We see strong growth. Our customers are undertaking many new designs at advanced process technology nodes. We think that this speaks well for future growth of the industry. At a macro level, the consumer sector will drive a lot of the growth ahead. For EDA, the higher levels of abstraction is where the growth will be.”
Agnisys Inc. was established in 2007 in Massachusetts, USA, with a mission to deliver innovative automation to the semiconductor industry. The company offers affordable VLSI design and verification tools for SoCs, FPGAs and IPs that makes the design verification process extremely efficient.
Agnisys’ IDesignSpec is an award winning engineering tool that allows an IP, chip or system designer to create the register map specification once and automatically generate all possible views from it. Various outputs are possible, such as UVM, OVM, RALF, SystemRDL, IP-XACT etc. User defined outputs can be created using Tcl or XSLT scripts. IDesignSpec’s patented technology improves engineer’s productivity and design quality.
The IDesignSpec automates the creation of registers and sequences guaranteeing higher quality and consistent results across hardware and software teams. As your ASIC or FPGA design specification changes, IDesignSpec automatically adjusts your design and verification code, keeping the critical integration milestones of your design engineering projects synchronized.
Register verification and sequences consume up to 40 percent of project time or more when errors are the source of re-spins of SoC silicon or an increase in the number of FPGA builds. IDesignSpec family of products is available in various flavors such as IDSWord, IDSExcel, IDSOO and IDSBatch.
IDesignSpec more than a tool for creating register models!
Anupam Bakshi, founder, CEO and chairman, Agnisys, said: “IDesignSpec is more than a tool for creating register models. It is now a complete Executable Design Specification tool. The underlying theme is always to capture the specification in an executable form and generate as much code in the output as possible.”
The latest additions in the IDesignSpec are Constraints, Coverage, Interrupts, Sequences, Assertions, Multiple Bus Domains, Special Registers and Parameterization of outputs.
“IDesignSpec offers a simple and intuitive way to specify constraints. These constraints, specified by the user, are used to capture the design intent. This design intent is transformed into code for design, verification and software. Functional Coverage models can be automatically generated from the spec so that once again the intent is captured and converted into appropriate coverage models,” added Bakshi.
Using an add-on function of capturing Sequences, the user is now able to capture various programming sequences in the spec, which are translated into C++ and UVM sequences, respectively. Further, the interrupt registers can now be identified by the user and appropriate RTL can be generated from the spec. Both edge sensitive and level interrupts can be handled and interrupts from various blocks can be stacked.
Assertions can be automatically generated from the high level constraint specification. These assertions can be created with the RTL or in the external files such that they can be optionally bound to the RTL. Unit level assertions are good for SoC level verification and debug, and help the user in identifying issues deep down in the simulation hierarchy.
The user can now identify one or more bus domains associated with Registers and Blocks, and generate appropriate code from it. Special Registers such as shadow registers and register aliasing is also automatically generated.
Finally all of the outputs such as RTL, UVM, etc., can be parameterized now, so that a single master specification can be used to create outputs that can be parameterized at the elaboration time.
How is IDesignSpec working as chip-level assertion-based verification?
Bakshi said: “It really isn’t an assertion tool! The only assertion that we automatically generate is from the constraints that the user specifies. The user does not need to specify the assertions. We transform the constraints into assertions.”