ST launches STM32 F4 series of MCUs

The STM32 F4 series of MCUs.

STMicroelectronics has launched the STM32 F4 series of microcontrollers (MCUs), based on the latest ARM Cortex-M4 core. This adds to the signal-processing capabilities and faster operations to the portfolio of STM32 MCUs.

The STM32 F4 series brings the world’s highest performance Cortex-M microcontrollers at 168 MHz FCPU/210 DMIPS and 363 Coremark score.

Vinay Thapliyal, technical marketing manager-India, Microcontroller Division, Greater China and South Asia region, STMicroelectronics Marketing Pvt Ltd, said that the series extends the ST’M32 portfolio of 250+ compatible devices already in production, including the F1 series, F2 series and ultra-low-power L1 series, respectively. ST is said to have 45 percent of the market share by units.

The  STM32 F4 series of MCUs are re-inforced on five pillars:
* Real-time performance — 168MHz/210 DMIPS.
* Outstanding power efficiency.
* Superior and innovative peripherals.
* Maximum integration – 1Mbyte Flash, 192 Kbyte SRAM.
* Extensive tools and hardware — CMSIS DSP library, Matlab support, various IDE starter kits, RTOS and stacks.

A Coremark study says that STM32 F4 gives the best acceleration and highest speed. Thapliyal added, “We are ready for the market.” It takes ART to be #1 in performance: It is a combination of core, embedded Flash design, process, acceleration techniques, etc.

ST’s ART Accelerator, an adaptive real-time memory unleashes the Cortex M4 core’s maximum processing performance equal to 0-wait state execution, and Flash upto 168MHz. Real-time performance is the 32-bit multi AHB bus matrix. The layers are independent of each other.

The STM32 F4 series boasts a high-performance digital signal controller. The MCU leads to the ease of use of C programming, interrupt handling and ultra-low power. The FPU facilitates single precision, ease of use, better code efficiency, faster time to market, eliminates scaling and saturation, and easier support for meta-language tools. The DSP is based on Harvard architecture, single-cycle MAC and barrel shifter.

It also boasts of an outstanding power efficiency.  The 230 μA/MHz, 38.6 mA at 168 MHz executing Coremark benchmark from Flash memory (with peripherals off), has been made possible with:
* ST’s 90nm process allowing the CPU core to run at only 1.2 V.
* ART Accelerator reducing the number of accesses to Flash.
* Voltage scaling to optimize performance/power consumption.
* VDD min down to 1.7 V.
* Low-power modes with backup SRAM and RTC support.

The low power in real-life applications is not just low-power mode. There is also a need to consider the percentage of time spend in low-power (LP) mode and in Run mode. If competitors are claiming better low-power modes, these are only an advantage if the overall system is spending more than 90 percent of the time doing nothing in low-power mode.

Superior and innovative peripherals includes, among others, two USB OTGs, two full duplexes PWMs at 168MHz, ADC at 2.4MSPS.

As for maximum integration, the 1-Mbyte Flash and 192-Kbyte SRAM memories available in the product accommodate advanced software stacks and user data, with no need for external memories. The 4-Kbyte SRAM battery back-up is used to save the application state and calibration data (SRAM block used as an EEPROM). In addition, the 528 bytes of OTP memory make it possible to store critical user data, such as the Ethernet MAC addresses or cryptographic keys.

Trends in embedded — smart and green energy: ST

Vivek Sharma, STMicroelectronics.

It is a such a pleasure interacting with Vivek Sharma, VP, Greater China & South Asia-India Operations, and director, India Design Centers, STMicroelectronics. While presenting the latest trends in embedded technologies, he hoped that there could eventually be a fab in India, by 2015. Speaking about ‘More Moore’ and ‘More than Moore’, he talked about 3D heterogeneous integration and smart sensors – that provide new, high-growth opportunities. Sharma largely touched upon smart and green energy.

India’s opportunities to leapfrog are immense, especially with a median age of 25.9 years. As for the Indian consumption context, India’s share is ~3 percent worldwide consumption levels 2009/2010. It is said to be $45 billion or ~3 percent in electronics and $6.7 billion or ~2.5 percent in semiconductor consumption.

Taking a look at leveraging of electronics by nations, (as per 2005 data) Taiwan leads with 15.5 percent of GDP, followed by South Korea at 15.1 percent, China at 12.7 percent, Thailand at 12.4 percent, Germany at 8.3 percent, USA at 5.4 percent, Japan at 4.5 percent, and India at 1.7 percent, respectively.

“More than Moore” diversification has been taking place, especially, by combining SoC and SIP to produce higher value systems.

3D heterogeneous integration has been taking place by integrating multiple functions via 3D/TSV. This involves the vertical stacking and connection of various materials, technologies and functional components together:
* Bio, MEMS and other sensors.
* Digital processing (MCUs, MPUs).
* RF transceivers for data transmission.
* Micro-battery (i.e., thin film).
* Other analog ICs and mixed technologies.

Advantages include integrated multi-functionality, more interconnections, reduced power consumption, smaller packaging, increased yield and reliability, and reduced overall costs.

Smart system integration is another trend, which enables combining “More than Moore” and “More Moore” technologies in a single smart system — from multi-package on board to multi-chip on package.

ST intros STM32L ultra-low-power Cortex‑M3 devices

STM32L ultra-low-power Cortex‑M3 devices.

STMicroelectronics has introduced the STM32L advanced ultra-low-power Cortex-M3 based MCU platform.

Built on cutting-edge proprietary process – robustness, it is part of a wide 32-bit product portfolio. The MCU platform is based on the just-enough energy concept and has an all inclusive package applications.

STM32L 32- to 128-Kbyte products are entering full production in the second half of March 2011. It is part of the industry’s largest ARM Cortex-M 32-bit microcontroller family with six STM32 families. STMicroelectronics is developing the STM32L portfolio up to 384 Kbytes of embedded memory. The STM32L is also Continua ready for its USB peripheral driver.

STM32L’s robustness has been derived from an automotive qualified process. It is all inclusive for ultra-low-power applications, and comes with hardware integrated features and software library packages. STM32L also has a ‘just-enough energy concept’, which includes undervolting, user controlled and an innovative architecture, all of this for less than 1 µA.

ST’s ultra-low-power EnergyLite platform features ST’s 130nm ultra-low-leakage process technology. It makes use of shared technology, architecture and peripherals. The company’s ultra-low-power portfolio for 2011 will be in production second half of March 2011. Many others will also be in production in the second half of April 2011. In fact, there will be over 100 part numbers from 4- to 384-Kbyte flash, and from 20 to 144 pins.

STM32L is based on ultra-low-power architecture, which is all inclusive for ultra low power applications. It also features ultra-low voltage, with power supply down to 1.8 V with BOR and also down to 1.65 V without BOR.The analog functional can be down to 1.8 V and the reprogramming capability can be down to 1.65 V.

STM32L is also flexible and secure, featuring +/- 0.5 percent internal clock accuracy when trimmed by RTC oscillator. It has up to five clock sources and has the MSI to achieve very low power consumption at seven low frequencies.

It also feattures dynamic voltage scaling in Run mode. The voltage scaling optimizes the product efficiency. User selects a mode (voltage scaling) according to external VDD supply, DMIPS performance required and maximum power consumption. It features the energy saving mode as well, down to 171 µA/DMIPS from Flash in Run mode.

ST focuses on four key growth areas

Carlo Bozotti, president and CEO, STMicroelectronics.

According to Carlo Bozotti, president and CEO of STMicroelectronics, there are four key growth areas for the company:
* Smart meters and energy saving.
* Smart consumer devices.
* Trust and data security.
* Healthcare and well being.

Bozotti was speaking at the STMicroelectronics’ media roundtable held this evening at the Greater Noida, India office.

Year 2010 goes down in ST’s history as a year of records. Both ACCI and IMS surpassed the $1 billion mark in quarterly revenue. Year 2010 was also a year of recovery — with ST achieving $1,3 billion revenue and a net operational cashflow of $961 million. ST also improved its net financial position to $1.7 billion.

In 2011, ST promises to expand and continue to grow its customer base. This year, ST predicts that the global semicon industry will grow 5-8 percent.

ST forsees its second major block of growth in manufacturing. It has aggressive ramp-up planned in application areas, such as:
* MEMS.
* Smart power automotive field.
* New platforms and solutions in smartphones and tablets.

Even ST-Ericsson, which was in restructuring mode, is now secure. This year, said Bozotti, it will be a year of transition from old, legacy products to new.

The last priority is to achieve 3D SoCs, complex MCUs and twin MEMS. Bozotti noted that the company plans to combine accelerometer and gyroscope in a single application. It will also add innovative solutions to smartphones and tablets.

As for R&D, Bozotti claimed that the company will remain committed. “We strongly commit to R&D in both good and bad times,” he noted.

Round-up 2010: Best of semiconductors

Right then, folks! This is my last post for 2010, on my favorite topic – semiconductors. If 2009 was one of the worst, if not, the worst year ever for semiconductors, 2010 seems to be the best year for this industry, what with the analyst community forecasting that the global semicon industry will surpass the $300 billion mark for the first time in its history!

Well, here’s a look at the good, the bad and the ugly, if available for otherwise what has been an excellent year, which is in its last hours, for semiconductors. Presenting a list of posts on semiconductors that mattered in 2010.

Top semiconductor and EDA trends to watch out for in 2010!

Delivering 10X design improvements: Dr. Walden C. Rhines, Mentor Graphics @ VLSID 2010

Future research directions in EDA: Dr. Prith Banerjee @ VLSID 2010 — This was quite an entertaining presentation!

Global semicon industry on rapid recovery curve: Dr. Wally Rhines

Indian semicon industry: Time for paradigm shift! — When will that shift actually happen?

Qualcomm, AMD head top 25 fabless IC suppliers for 2009; Taiwan firms finish strong!

TSMC leads 2009 foundry rankings; GlobalFoundries top challenger!

ISA Vision Summit 2010: Saankhya Labs, Cosmic Circuits are Indian start-ups to watch at Technovation 2010!

ISA Vision Summit 2010: Karnataka Semicon Policy 2010 unveiled; great opportunity for India to show we mean business! — So far, the Karnataka semicon policy has flattered to deceive! I’m not surprised, though!

Dongbu HiTek comes India calling! Raises hopes for foundry services!!

Indian electronics and semiconductor industries: Time to answer tough questions and find solutions — Reminds me of the popular song from U2 titled — “I still haven’t found what I’m looking for”!

What should the Indian semicon/electronics industry do now? — Seriously, easy to say, difficult to manage (ESDM)!  

STMicroelectronics unveils STM32 F-2 series of MCUs

STM32 F-2 block diagram.

STMicroelectronics has unveiled its roadmap for ARM Cortex-M4 and -M0 with products sampling from mid 2011 onward and production by end of 2011. It has also unleashed the full performance of the Cortex-M3 with its latest STM32 F-2 series.

According to Vinay Thapliyal, technical marketing manager, MCU, STMicroelectronics, India, there are over 30 new part numbers, pin-to-pin and software compatible with existing STM32 devices.

He said: “Today, we already have 110 parts running for the F-1 series, which is currently existing and in full production. Now, we are extending the family. This time, we have launched the F-2 family — the highest performance family — to unleash the ultimate performance of Cortex-M3.” Naturally, the F-2 series is benefiting the existing F-1 devices.

As mentioned, 30 new devices will be launched. They are already ramping now. “All of these belong to the high-performance, low-power family. We will also be revealing our roadmap for M4 and M0 — to be  in production by end of 2011, with sampling by middle of 2011.”

ST’s F-2 series will further enhance real time preformance. Thapliyal added that ST has built in ART accelerator into these devices. This will deliver 150 DMIPS (Dhrystone MIPS) at 120MHz.

The adaptive real-time memory accelerator unleashes the Cortex-M3 core’s maximum processing performance equivalent to 0-wait state execution Flash up to 120 MHz.

The ART accelerator is a pre-fetch queue and branch cache mechanism that stores the first instructions and constants of the branches, interrupt and subroutine calls. The penalty occurs the first time those events occur like for any pipelining mechanism.

After that, the instructions stored in cache are pushed immediately in the pref-etch queue upon recognition of a stored branch address. In addition, the embedded Flash is organized in 128-bit rows, allowing up to 8 (16-bit) instructions to be read per access.

Reshaping the embedded world: Vivek Sharma, ST

Vivek Sharma, regional VP, Greater China & South Asia region -- India Operations and Director, India Design Center, STMicroelectronics.

It was a pleasure to catch up with Vivek Sharma, regional VP, Greater China & South Asia region — India Operations and Director, India Design Center, STMicroelectronics, on the sidelines of the 4th Embedded Systems Conference (ESC) 2010 in Bangalore. We had a wonderful discussion on the trends that are reshaping today’s embedded world.

Sharma said: “Moore’s Law has governed many new things. In fact, it has ruled the roost. The industry has been able to push up complexity within a chip and also bring down costs.” As an example, during the last two decades, cost and complexity have combined to create the mobile device — which has turned out to be a disruptive application. The world recently added its 5 billionth mobile subscriber in July 2010. There is likely to be a whopping 50 billion connected devices by 2020!

SiP reshaping embedded world

Touching upon ‘more than Moore”, Sharma added that shrinking will keep on happening. System-in-package is a reality today and is reshaping the embedded world. It can allow more shrinking in size and push down costs.

Borrowing from wikipedia, for those interested, a system-in-a-package or system in package (SiP), also known as a chip stack MCM, is a number of ICs enclosed in a single package or module, and performs all or most of the functions of an electronic system.

3D heterogenous integration and  TSV

3D heterogenous integration and  through-silicon via (TSV) is another trend reshaping the industry. 3D packaging with 3D TSV interconnects provides another path toward “More than Moore”, with relatively smaller capital investments.

3D-ICs stack multiple chips together and interconnect them using through-silicon via (TSV) structures, thereby providing much more functions in a smaller footprint.

MEMS key segment

MEMS is yet another sector which is reshaping the industry. Sensors play a major role in our lives. “If we can develop good sensors, they can change our lives,” said Sharma.

“Accelerometers and gyroscopes are two key segments with substantial growth. MEMS takes advantage of the electrical and mechanical properties of the silicon.’ Sharma added that all MEMS gyroscopes take advantage of Coriolis effect. In 2009, ST introduced over 30 multi-axis gyroscopes.

For the statistically inclined, earlier this year, Dr. Robert Castellano of the Information Network said in their report 3-D TSV: Insight On Critical Issues And Market Analysis, that while the overall equipment market will grow at a CAGR of nearly 60 percent between 2008-2013, the metrology/inspection sector is expected to grow nearly 80 percent. On the device side, TSVs for MEMS is expected to grow nearly 100 percent in this time frame.

New frontiers in MEMS around the human body

At the recently held International Electronics Forum (IEF) 2010, organized by Future Horizons in Dresden, Germany, Benedetto Vigna, Group Vice President and General Manager, MEMS, Sensors and High Performance Analog Division, STMicroelectronics, made a wonderful presentation on how MEMS can be useful for the human body, especially from the medical electronics point of view.

MEMS (microelectromechanical systems) is a three-dimensional device embedded in silicon, and uses silicon’s mechanical (and electrical) properties. It supports multifunctional systems of actuators, electronics and sensors.

Three critical waves of MEMS
Vigna highlighted the three very important waves of MEMS — automotive airbags, consumerization, and MEMS in, on, around the body! The last part especially is the most interesting one!

Automotive airbags formed the 1st wave of MEMS. The application supported big and not-so-precise accelerometers. Additional automotive applications followed, such as tyre pressure sensors and stability control. Vigna heralded consumerization as the 2nd wave of MEMS. There have been high-volume fabrication techniques, leading to higher performance/greater reliability at lower costs. He specifically pointed out the ‘Wii effect’! In this case, the high-volume commitment of vendors + UI benefits led to consumerization of MEMS.

Vigna added that MEMS has seen a speeding spiral of success in recent times. Earlier, it took 25 years from labs to fabs. Now, three product generations are developed and released in 12 months!

Another instance or example of the 2nd MEMS wave include the move from keyboard and mouse to free motion. In this case, the MEMS sensors change interaction with consumer electronics and propel new applications. There are now:
* Motion user interfaces in phones, games and remotes.
* Advanced navigation and location-based services.
* Free-fall protection in portable devices.

MEMS market
Vigna focused a moment on the MEMS motion sensors market 2009-2013 and the MEMS market. As far as the MEMS motion sensors market is concerned, accelerometers are likely to grow at 14.5 percent CAGR for the period 2009-2013. On the other hand, gyroscopes are likely to grow at 17.3 percent CAGR during 2009-2013.

Cell phones and CE is the major market segment in both cases, registering 19.5 percent CAGR and 25.4 percent CAGR, respectively, followed by automotive at 10.7 percent CAGR and 12.3 percent CAGR, respectively.

It is to be noted that in 2009, the overall MEMS market was almost flat compared to 2008, but volumes rose significantly, showing increasing penetration of MEMS in consumer devices.

Current trends in MEMS
Coming on to the current trends, MEMS is now pushing the limits of size and power — motion sensors are squeezing the footprint to 2×2 mm and current consumption well below 10uA in full operating mode. Multiple sensor integration is another trend. The integration of motion, magnetic, pressure and temperature sensors in a single package brings more degrees of freedom.

Embedded intelligence is the third key trend. The on-chip processing capabilities are enabling smart autonomous sensors and decreasing power consumption at the system level. Finally, software, is now the ‘S’ in MEMS! Vigna said that hardware and software integration is a key added value and differentiating factor.

ST intros STM32L EnergyLite ultra-low-power MCUs for portable and very low power apps

STMicroelectronics' STM32L EnergyLite ultra-low-power MCUs.

STMicroelectronics recently launched the STM32L EnergyLite ultra-low-power MCUs. I caught up with Vinay Thapiyal, technical marketing manager, MCU’s, ST India, to learn more.

The highlights of this series of MCUs include a commitment for ultra-low power — the EnergyLite platform is common for 8-bit (STM8L) and 32-bit (STM32L) MCUs. Also, it is strong on pure energy efficiency, with high performance combined with ultra low power, i.e., high high energy saving.  Finally, the ultra low power member in STM32 portfolio enriches both the STM32 ultra-low-power EnergyLite platform and the STM32 portfolio.

According to Thapliyal, STMicroelectronics has been involved in the MCU market for a long time. Off late, it has started focusing on the STM32 — the ARM Cortex based MCU and the STM8 — for 8-bit family. “We have started converging our old families into these two domains,” he added.

The STM32F is the foundation of the STM32 family. STM32F is a family of low power MCUs based on the 32-bit ARM Cortex M3 architecture.

The STM8 is a family of MCUs based on ST’s propritetary atchitecture. The STM32L is STMicroelectronics’ ultra low power family mainly used for portable and very low power applications.

The ultra-low-power EnergyLite platform, featuring the STM32L and the STM8L is based on STMicroelectronics’ 130 nm ultra-low-leakage process technology. They share common technology, architecture and peripherals. The STM8, which was launched in 2009, has caught on very fast. It is a high performance, low cost MCU.

He added that STMicroelectronics started with 130nm technology, and low pin count and low flash on STM8, while higher memory and high pin count is available on the STM32.

India should focus on developing local electronics industry: ST

(L): Vivek Sharma, regional VP, Greater China & South Asia region -- India Operations and Director, India Desgin Center, STMicroelectronics and (R) Francois Guibert, executive VP and president Greater China & South Asia Region, STMicroelectronics.

I had the pleasure of meeting Francois Guibert, executive VP and president Greater China & South Asia Region, STMicroelectronics, along with Vivek Sharma, regional VP, Greater China & South Asia region — India Operations and Director, India Desgin Center, STMicroelectronics, during the recently held ISA Vision Summit in Bangalore. Naturally, it was great to meet up with them again, at ST’s sprawling facility in Greater Noida last week, where the company outlined its future vision.

On India, Guibert said: “India should focus on developing the local electronics industry. We also help start-ups in India. Further, we speak and discuss with governments on how to go about doing things.” He noted that a very strong percentage of ST’s libraries are developed in India.

Focusing on ST’s performance and vision for the future, Guibert pointed out that ST has been the world’s no. 5 semicon supplier for some time now. Its revenue was $8.51 billion in 2009. The semicon giant currently has key collaborations with Nokia, HP, IBM and Ericsson, respectively. In February 2009, the company had formed a JV with Ericsson Mobile Platforms to establish ST-Ericsson.

In terms of the company’s global set up, ST has 13 main production sites and advanced R&D centers in 10 countries.

Giving a breakup of ST’s FY09 revenue by region, Guibert said Apac accounted for 30 percent, followed by EMEA at 28 percent, Greater China at 25 percent, America at 12 percent and Japan at 5 percent, respectively.

As per its various groups, the ACCI (automotive, consumer, computer and telecom infrastructure) accounted for 38 percent, industrial and multisegment sector (IMS) 31 percent, wireless 30 percent and others 1 percent, respectively. “We have a solid product position via industry verticals,” Guibert added.

ST’s product strategy for the future includes:

* Maintain world leadership — especially in industrial, power conversion and MEMS.

* Consolidate leading position — especially in wireless ICs, digital consumer ICs, automotive ICs and computer peripheral ICs.

* Increase presence in MCUs and advanced analog, with leadership in selected segments.

* Gain market share on selected standard product families.

ST’s new products aim provide a better future for all. The focus is on:

a) Energy savings — New products addressing the issue of volatile and soaring oil prices, and contributing to reduction of global warming.

* Microelectronic devices in home appliances.

* Electric/hybrid cars

* PV technologies, including control and conversion.

b) Healthcare — New solutions improving the quality of life and addressing the problem of skyrocketing healthcare costs.

* Lab-on-chip for diagnosing influenza and other diseases.

* Insulin pumps, other microfluidics, etc.

* Remote monitoring of patients with chronic diseases.