Global semicon industry trends in 2014: Analog Devices


Sam Fuller

Sam Fuller

I recently met Sam Fuller, CTO, Analog Devices, and had an interesting conversation. First, I asked him about the state of the global semicon industry in 2013.

Industry in 2013
He said: “Due to the uncertainties in the global economy in the last couple of years, the state of the global semiconductor industry has been quite modest growth. Because of the modest growth, there has been a buildup in demand. As the global economies begin to be more robust going forward, we expect to see more growth.”

Industry in 2014?
How does Analog Devices see the industry going forward in 2014? What are the five key trends?

He added: “I would talk about the trends more from an eco-system and applications perspective. Increased capability on a single chip: Given all the advances to Moore’s law, the capability of a chip has increased considerably in all dimensions and not just performance, be it the horsepower we see in today’s smartphones or the miniaturization and power consumption of wearable gadgets that were on show this year at CES.

“In Analog Devices’ case, as we are focused on high performance signal processing, we can put more of the entire signal chain on a single die. For our customers, the challenge is to provide their customers a more capable product which means a more complex product, but with a simpler interface.

“A classic example is our AD9361 chip, which is a single chip wideband radio transceiver for Software Defined Radio (SDR). It is a very capable ASSP (Application Specific Standard Products) as well as RF front end with a wide operating frequency of 70 MHz to 6 GHz.

“This chip, coupled with an all-purpose FPGA, can build a very flexible SDR operating across different radio protocols, wide frequency range and bandwidth requirements all controlled via software configuration. It finds a number of applications in wireless communication infrastructure, small cell Base stations as well as a whole range of custom radios in the industrial and aerospace businesses.”

Now, let’s see the trends for 2014!

More collaboration with customers: There is a greater emphasis on understanding customers’ end applications to provide a complete signal chain, all in a System on a Chip (SoC) or a System in a package (SiP). The relationship with our customers is changing as we move more towards ASSPs focused with few lead customers for target markets and target applications. While this has already been ongoing in the consumer industry with PCs and laptops, customers in other vertical markets like healthcare, automotive and industrial are and will collaborate more with semiconductor companies like Analog Devices to innovate at a solutions level.

More complete products: We have evolved from delivering just the silicon at a component level to delivering more complete products with more advanced packaging for various 3D chips or multi-die within a package. Our solutions now have typically much more software that makes it easier to configure or program the chips. It is a solution that is a combination of more advanced silicon, advanced packaging and more appropriate software.

With providing the complete solution, the products are more application specific and hence, the need for more collaboration with customers. For example, there may be one focused on Software Defined Radio, one for motor control, and one for vital signs monitoring for consumer health that we have launched recently.

We need it to be generic enough that multiple customers can use it, but it needs to be as tailored as possible to the customers’ needs for specific market segments. While because of the volume and standardization, availability of complete reference designs in the consumer world has been the norm, other market segments are demanding more complete products not-withstanding the huge variation in protocols and applications.

Truly global industry: The semiconductor and electronics industry has become truly global, so multiple design sites around the globe collaborate to create products. For example for Analog Devices, one of our premier design sites is our Bangalore product design center where we quite literally developed our most complex and capable chips. At the same time our customers are also global.

We see large multinational companies like GE, Honeywell, Cisco, Juniper, ABB, Schneider and many of our top strategic customers globally doing substantial system design work in Bangalore along with a multitude of India design houses. Our fastest growing region is in Asia, but we have substantial engagement with customers in North America and Europe. And our competition is also global, which means that the industry is ever moving faster as the competition is global.

Smarter design tools: The final trend worth talking about is the need for smarter design tools.  As our products and our customers’ products become more complex and capable, there have to be rapidly developing design tools, for us to design them.

This cannot be done by brute force but by designing smarter and better tools. There is a lot of innovation that goes on in developing better tool suites. There is also ever more capable software that caters to a market moving from 100s of transistors to literally billions of transistors for an application.

NXP’s LPC1500 MCU series drives multiple motors simultaneously


LPC1500

LPC1500

NXP Semiconductors N.V. recently released the LPC1500 microcontroller series, optimized for fast, easy, and high-precision motor control.

So, what’s unique about the new LPC family? First, the LPC1500 was designed to simplify motor control for the masses. It has the flexibility to drive various types of motors, such as ACIM, PMSM, BLDC, etc. The LPC1500 can also drive multiple motors simultaneously.

These aren’t all! The hardware interconnection between the SCTimer/PWM, ADCs and comparators allow the motor to be driven with little CPU intervention. It has free LPCXpresso IDE and free FOC firmware for sensored and sensorless motors that reduces cost and improves time to market.

Looking at the unique features and benefits, the Switch Matrix allows any function to be routed out to any pin making schematic capture and board layout simpler and faster. The SCTimer/PWM block is unique to NXP.

Benefits are, it can run independently of the CPU and generate extremely precise PWM waveforms for quiet, smooth, efficient motor drive. The 2x 2Msps 12b,12ch ADCs can measure simultaneous phase currents to determine precise motor position and speed. There are four comparators for fast system shutdown upon fault detection.

The LPC1500 is suitable for large appliances, HVAC, building automation, factory automation, industrial pumps and generators, digital power, remote sensing, etc.

How will the LPC1500 aid embedded engineers? According to NXP, it saves time to market using the free FOC firmware and GUI tuning tool. It also saves system cost by using only one system MCU, e.g., HVAC typically has one MCU for fan control and one MCU for the compressor. LPC1500 can control both.

The LPC1500 feature set makes it ideal for sensorless motor control removing the need for sensored motors and allowing customers to switch to cheaper sensorless motors. As the SCTimer/PWM can run independently of the CPU, the freed up CPU bandwidth can be used to control other parts of the system for example the LPC1500 can be used for both the control and motor board in a washing machine.

NXP is currently working with customers to understand their future requirements and developing the roadmap to match their needs.

STMicro intros M24SR dynamic NFC/RFID tag


Amit Sethi

Amit Sethi

STMicroelectronics recently introduced the M24SR dynamic NFC/RFID tag.

Speaking about the USP of the M24SR, Amit Sethi, Product Marketing manager – Memories and RFID, STMicroelectronics India, said: “The unique selling proposition of the M24SR product is its two interfaces, giving users and applications the ability to program or read its memory using either an RF NFC interface or a wired I2C interface, in an affordable and easy-to-use device for a wide range of applications such as consumer/home appliance, OTP card, healthcare/wellness and industrial/smart meter.”

Let us see how the M24SR is beneficial for smartphone or any other audio device.

The M24SR is a dynamic NFC/RFID tag that manages the data exchange between the NFC phone and the microcontroller. The main use cases for data exchange are updating user settings, downloading data logs, and remote programming and servicing. The dynamic tag also enables seamless Bluetooth and Wi-Fi pairing, which is useful in, for example, audio devices.

How is the M24SR different from other products of the same segment?

Sethi said that the key difference is the dual interface: the M24SR memory can be accessed either by a low-power 2C interface or

M24SR

M24SR

by an ISO14443A RF interface operating at 13.56MHz. It also features RF status (MCU wake-up) and RF disable functions to minimize power consumption. In addition, the devices support the NFC data exchange format (NDEF from NFC forum) and 128-bit password protection mechanism.

The M24SR series is available in EEPROM memory densities from 2 Kbit to 64 Kbit and three package types: SO8, TSSOP8, and UFDFPN8.

What are the contributions of M24SR toward the Internet of Things?

Accotding to him, the M24SR dynamic NFC/RFID tag interactive and zero power capability, simplifies complex communications setups and enables data exchange among the home automation, wearable electronics, home appliances, smart meter, wellness, etc.

Especially with the NFC capability, the M24SR is ideal for applications waiting for something, like a ticket or ID to launch an activity.

Relevance for India
Finally, what’s the relevance of the product for the Indian market?

Sethi added: “Mobile and NFC based application are gaining its popularity in India. M24SR is an easy-to-use and an affordable product for the Implementation of NFC-based applications in transportation, entertainment, and lifestyle areas.

As for the go-to-market strategy, the M24SR mass market launch is planned for end of February 2014. Some M24SR samples have been delivered to key customers during Q4 2013 and design/development is ongoing.

3D remains central theme for Applied in 2014!


Om Nalamasu

Om Nalamasu

Following a host of forecasts for 2014, it is now the turn of Applied Materials with its forecast for the year. First, I asked Om Nalamasu, senior VP, CTO, Applied Materials regarding the outlook for the global semicon industry in 2014.

Semicon outlook 2014
He said that Gartner expects the semiconductor industry to grow in mid-single digits to over $330 billion in 2014.

“In our industry – the semiconductor wafer fab equipment sector – we are at the beginning of major technology transitions, driven by FinFET and 3D NAND, and based a wide range of analyst projections, wafer fab equipment investment is expected to be up 10-20 percent in 2014. We expect to see a year-over-year increase in foundry, NAND, and DRAM investment, with logic and other spending flat to down.”

Five trends for 2014
Next, what are the top five trends likely to rule the industry in 2014?

Nalamasu said that the key trends continuing to drive technology in 2014 and beyond include 3D transistors, 3D NAND, and 3D packaging. 3D remains a central theme. In logic, foundries will ramp to 20nm production and begin early transition stages to3D finFET transistors.

With respect to 3D NAND, some products will be commercially available, but most memory manufacturers plan to crossover from planar NAND to vertical NAND starting this year. In wafer level packaging, critical mechanical and electrical characterization work is bringing the manufacturability of 3D-integrated stacked chips closer to reality.

These device architecture inflections require significant advances in precision materials engineering. This spans such critical steps as precision film deposition, precision materials removal, materials modification and interface engineering. Smaller features and atomic-level thin films also make interface engineering and process integration more critical than ever.

Driving technology innovations are mobility applications which need high performance, low power semiconductors. Smartphones, smart watches, tablets and wearable gadgets continue to propel industry growth. Our customers are engaged in a fierce battle for mobility leadership as they race to be the first to market with new products that improve the performance, battery-life, form-factor and user experience of mobile devices.

How is the global semiconductor industry managing the move to the sub 20nm era?

He said that extensive R&D work is underway to move the industry into the sub-20nm realm. For the 1x nodes, more complex architectures and structures as well as new higher performance materials will be required.

Some specific areas where changes and technology innovations are needed include new hard mask and channel materials, selective material deposition and removal, patterning, inspection, and advanced interface engineering. For the memory space, different memory architectures like MRAM are being explored.

FinFETs in 20nm!
By the way, have FinFETs gone to 20nm? Are those looking for power reduction now benefiting?

FinFET transistors are in production in the most advanced 2x designs by a leading IDM, while the foundries are in limited R&D production. In addition to the disruptive 3D architecture, finFET transistors in corporate new materials such as high-k metal gate (HKMG) that help to drastically reduce power leakage.

Based on public statements, HKMG FinFET designs are expected to deliver more than a 20 percent improvement in speed and a 30 percent reduction in power consumption compared to28nm devices. These are significant advantages for mobile applications.

Status of 3D ICs
Finally, what’s the status with 3D ICs? How is Applied helping with true 3D stacking integration?

Nalamasu replied that vertically stacked 3D ICs are expected to enter into production first for niche applications. This is due primarily to the higher cost associated with building 3D wafer-level-packaged (WLP) devices. While such applications are limited today, Applied Materials expects greater utilization and demand to grow in the future.

Applied is an industry leader in WLP, having spear-headed the industry’s development of through silicon via (TSV) technology. Applied offers a suite of systems that enable customers to implement a variety of packaging techniques, from bumping to redistribution layer (RDL) to TSV. Because of work in this area, Applied is strongly positioned to support customers as they begin to adopt this technology.

To manufacture a robust integrated 3D stack, several fundamental innovations are needed. These include improving defect density and developing new materials such as low warpage laminates and less hygroscopic dielectrics.

Another essential requirement is supporting finer copper line/spacing. Important considerations here are maintaining good adhesion while watching out for corrosion. Finally, for creating the necessary smaller vias, the industry needs high quality laser etching to replace mechanical drilling techniques.

India’s evolving importance to future of fabless: Dr. Wally Rhines

February 3, 2014 2 comments

Dr. Wally RhinesIf I correctly remember, sometime in Oct. 2008, S. Janakiraman, then chairman of the India Semiconductor Association, had proclaimed that despite not having fabs, the ‘fabless India” had been shining brightly! Later, in August 2011, I had written an article on whether India was keen on going the fabless way! Today, at the IESA Vision Summit in Bangalore, Dr, Wally Rhines repeated nearly the same lines!

While the number of new fabless startups has declined substantially in the West during the past decade, they are growing in India, said Dr. Walden C. Rhines, chairman and CEO, during his presentation “Next Steps for the Indian Semiconductor Industry” at the ongoing IESA Vision Summit 2014.

India has key capabilities to stimulate growth of semiconductor companies, which include design services companies, design engineering expertise and innovation, returning entrepreneurs, and educational system. Direct interaction with equipment/systems companies will complete the product development process.

Off the top 50 semicon companies in 2012, 13 are fabless and four are foundries. The global fabless IC market is likely to grow 29 percent in 2013. The fabless IC revenue also continues to grow, reaching about $78.1 billion in 2013.  The fabless revenue is highly concentrated with the top 10 companies likely to account for 64 percent revenue in 2013. As of 2012, the GSA estimates that there aere 1,011 fabless companies.

The semiconductor IP (SIP) market has also been growing and is likely to reach $4,774 million by 2020, growing at a CAGR of 10 percent. The top 10 SIP companies account for 87 percent of the global revenue. Tape-outs at advanced nodes have been growing. However, there are still large large opportunities in older technologies.

IoT will transform industry
It is expected that the Internet of Things (IoT) will transform the semiconductor industry. It is said that in the next 10 years, as many as 100 billion objects could be tied together to form a “central nervous system” for the planet and support highly intelligent web-based systems. As of 2013, 1 trillion devices are connected to the network.

Product differentiation alone makes switching analog/mixed-signal suppliers difficult. Change in strategy toward differentiation gradually raises GPM percentage.

India’s evolving importance to future of fabless
Now, India ranks among the top five semiconductor design locations worldwide. US leads with 507, China with 472, Taiwan with 256, Israel with 150, and India with 120. Some prominent Indian companies are Ineda, Saankhya Labs, Orca Systems and Signal Chip (all fabless) and DXCorr and SilabTech (all SIP).

India is already a leading source of SIP, accounting for 5.3 percent, globally, after USA 43 percent and China 17.3 percent, respectively. It now seems that India has been evolving from design services to fabless powerhouse. India has built a foundation for a fabless future. It now has worldwide leadership with the most influential design teams in the world.

Presently, there are 1,031 MNC R&D centers in India. Next, 18 of the top 20 US semiconductor companies have design centers in India. And, 20 European corporations set up engineering R&D centers in India last year. India also has the richest pool of creative engineering resources and educational institutions in the world. The experience level of Indian engineers has been increasing, but it is still a young and creative workforce. There is also a growing pool of angel investors in India, and also in the West, with strong connections to India.

So, what are the key ingredients to generate a thriving infrastructure? It is involvement and expertise with end equipment. Superb product definition requires the elimination of functional barriers. He gave some examples of foreign “flagged” Indian companies that produced early successes. When users and tool developers work in close proximity, “out-of-the-Box” architectural innovations revolutionize design verification.

What should India do to boost electronics manufacturing?


The IESA 2014 Vision Summit opened today in Bangalore, with the one key question: what does India need to do to boost electronics manufacturing? Here are some words of wisdom from some industry icons.

SR Patil

SR Patil

SR Patil, Minister for IT-BT, Science and Technology, Karnataka, remarked that at present, we are not able to find any significant place in global hardware arena. We are heavily dependent on other countries to import electronic goods – that may be computers, chips, mobile phones and the list goes on.

“If I am right, our import bill of electronic goods has surpassed $30 billion previous year. It is calculated to be $42 billion by next year if we don’t initiate sincere measures to boost the domestic manufacturing. I don’t have any hesitation to say that we must learn lessons from small countries such as South Korea, Taiwan and Israel on this count.”

The main objective of the Karnataka ESDM policy is to make the state a preferred destination for ESDM investment, and emerge as the ESDM leader in the country.

Patil said: “We aim to generate around 2.4 lakh jobs and 20 percent of the country’s total ESDM export target of $80 billion by the year 2020. We are preparing a ground for setting up of ESDM clusters – both that of Brownfield and Greenfield.”

As many eight ESDM companies have registered with the IT-BT Department recently and obviously they are entitled for various incentives and concessions under the new policy.

Dr. Om Nalamasu, senior VP and CTO, Applied Materials Inc. added that establishing a high-value manufacturing industry as semiconductor chip fabrication will have transformative effect on the overall electronics industry in India.

This will have a very strong multiplier effect that will result in major strides forward in the value generated from all sectors within the semiconductor ecosystem – one of the biggest being the growth of high-tech and high value-add employment opportunities this will generate in the country. The historic significance of this approval will be felt for many years to come. Manufacturing in India will soon witness a new frontier.

A strong manufacturing base is critical for high-growth economies. There are successful examples in South East Asia where advanced manufacturing has resulted in strong GDP multipliers. In India, there’s a strong electronics market opportunity, driven by telecom, IT, consumer and industrial electronics; 65 percent of these electronic products are imported today. The disposable income of the growing middle class in India and China will continue to drive electronics market growth.

The point is: all of these words have been spoken over and over again! The first semicon policy was announced in 2007-08, followed by a revised policy in 2010-11. In between, the first Karnataka semicon policy was announced. However, there have been very, very few, or no takers! Even the first semicon fab policy announcement went unaccounted for! Later, last year, there was another announcement regarding two fabs that are said to be coming up!

When will India deliver? One hopes that happens soon!

FinFETs delivering on promise of power reduction: Synopsys


Here is the concluding part of my conversation with Synopsys’ Rich Goldman on the global semiconductor industry.

Rich Goldman

Rich Goldman

Global semicon in sub 20nm era
How is the global semicon industry performing after entering the sub 20nm era? Rich Goldman, VP, corporate marketing and strategic alliances, Synopsys, said that driving the fastest pace of change in the history of mankind is not for the faint of heart. Keeping up with Moore’s Law has always required significant investment and ingenuity.

“The sub-20nm era brings additional challenges in device structures (namely FinFETs), materials and methodologies. As costs rise, a dwindling number of semiconductor companies can afford to build fabs at the leading edge. Those thriving include foundries, which spread capital expenses over the revenue from many customers, and fabless companies, which leverage foundries’ capital investment rather than risking their own. Thriving, leading-edge IDMs are now the exception.

“Semiconductor companies focused on mobile and the Internet of Things are also thriving as their market quickly expands. Semiconductor companies who dominate their space in such segments as automotive, mil/aero and medical are also doing quite well, while non-leaders find rough waters.”

Performance of FinFETs
Have FinFETs gone to below 20nm? Also, are those looking for power reduction now benefiting?

He added that 20nm was a pivotal point in advanced process development. The 20nm process node’s new set of challenges, including double patterning and very leaky transistors due to short channel effects, negated the benefits of transistor scaling.

To further complicate matters, the migration from 28nm to 20nm lacked the performance and area gains seen with prior generations, making it economically questionable. While planar FET may be nearing the end of its scalable lifespan at 20nm, FinFETs provide a viable alternative for advanced processes at emerging nodes.

The industry’s experience with 20nm paved the way for an easier FinFET transition. FinFET processes are in production today, and many IC design companies are rapidly moving to manufacture their devices on the emerging 16nm and 14nm FinFET-based process geometries due to the compelling power and performance benefits. Numerous test chips have taped out, and results are coming in.

“FinFET is delivering on its promise of power reduction. With 20nm planar FET technologies, leakage current can flow across the channel between the source and the drain, making it very difficult to completely turn the transistor off. FinFETs provide better channel control, allowing very little current to leak when the device is in the “off” state. This enables the use of lower threshold voltages, resulting in better power and performance. FinFET devices also operate at a lower nominal voltage supply, significantly improving dynamic power.”
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