It was a pleasure to catch up with Vivek Sharma, regional VP, Greater China & South Asia region — India Operations and Director, India Design Center, STMicroelectronics, on the sidelines of the 4th Embedded Systems Conference (ESC) 2010 in Bangalore. We had a wonderful discussion on the trends that are reshaping today’s embedded world.
Sharma said: “Moore’s Law has governed many new things. In fact, it has ruled the roost. The industry has been able to push up complexity within a chip and also bring down costs.” As an example, during the last two decades, cost and complexity have combined to create the mobile device — which has turned out to be a disruptive application. The world recently added its 5 billionth mobile subscriber in July 2010. There is likely to be a whopping 50 billion connected devices by 2020!
SiP reshaping embedded world
Borrowing from wikipedia, for those interested, a system-in-a-package or system in package (SiP), also known as a chip stack MCM, is a number of ICs enclosed in a single package or module, and performs all or most of the functions of an electronic system.
3D heterogenous integration and TSV
MEMS key segment
“Accelerometers and gyroscopes are two key segments with substantial growth. MEMS takes advantage of the electrical and mechanical properties of the silicon.’ Sharma added that all MEMS gyroscopes take advantage of Coriolis effect. In 2009, ST introduced over 30 multi-axis gyroscopes.
For the statistically inclined, earlier this year, Dr. Robert Castellano of the Information Network said in their report 3-D TSV: Insight On Critical Issues And Market Analysis, that while the overall equipment market will grow at a CAGR of nearly 60 percent between 2008-2013, the metrology/inspection sector is expected to grow nearly 80 percent. On the device side, TSVs for MEMS is expected to grow nearly 100 percent in this time frame.
According to Sharma, smart sensors will provide the new, high growth opportunity, especially, a combination of MEMS+RF+micro. “The future is with smart systens,” he stressed.
He touched upon ST’s iNEMO family. It represents ST’s first inertial measurement unit devices with 10 degrees of freedom (DOF), offering combinations of 3-axis sensing of linear, angular and magnetic motion with temperature and barometer/altitude readings combined with a 32-bit processing unit and a dedicated software in a single package.
Some applications of smart systems are: