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TSMC on 450mm transition: Lithography key!

October 3, 2012 1 comment

Dr. C.S. Yoo, TSMC.

Dr. C.S. Yoo, TSMC.

TSMC unveiled its schedule for 450mm mass production at the recently held SEMICON Taiwan 2012 450mm Supply Chain Forum. Focusing on lithography as the key, Dr. C.S. Yoo, senior director of the 450mm program at TSMC, noted that IC makers and equipment suppliers should fully leverage the G450C. They need to work and innovate to make the 450mm transition a great success.

TSMC has always been in the relentless pursuit of technology innovation. It has been part of all of the computing waves that have driven the market growth. Right now, mobile computing is the leading market driver. TSMC has been helping the industry produce comprehensive, powerful mobile computing devices.

The future growth drivers and trends include mobile computing, cloud computing and smart devices. However, technical and economic challenges also lie ahead. TSMC has been pushing the lithography roadmap. 28nm is said to be the limit of conventional single-patterning lithography. TSMC has innovations to extend immersion to 20nm. The next-generation lithography (NGL) is being preferred beyond 20nm. Also, EUV and multiple-e-beam concept and feasibility has been proven. The more than 10x throughput gap requires collaborative innovation and funding.

TSMC continues to invest in R&D for transistor architecture trends. There is increasing technology complexity, as reflected by mask layers increase. The technology shrink also leads to design complexity.

There are challenges such as intrinsic wafer cost parity and uncertain technology migration ROI. TSMC’s mission is to be the trusted technology and capacity provider for the global logic IC industry for years to come. TSMC already has capacity leadership. TSMC’s total 12″ cleanroom space will equal more than 32 World Cup football fields by the end of this year..

TSMC customers’ expectations include the offer of leading-edge technology, continue to expand capacity, enable faster time to market, faster technology ramp up, faster manufacturing cycle times, and lower cost /die. To bridge the cost and productivity gap, TSMC no longer maintains cost/transistor trend by 2018 due to the slowing pace of technology shrink, and increasing technology complexity.
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