Early this month, I caught up with Jaswnder Ahuja, corporate VP and MD, Cadence Desiign Systems India. With the global semiconductor industry having entered the sub-20nm era, there are a lot of things happening, and Cadence is sure to be present.
Performance in sub-2onm era
First, let’s see how’s the global semiconductor industry performing after entering the sub-20nm era.
Ahuja replied: “Increased demand for faster, smaller, low-power chips continues to drive the geometry shrink as one of the ways to manage the low-power, higher performance goals in smaller form factors—in other words, PPA is driving the move to advanced node design.
“At Cadence, we are seeing a lot of interest in the wireless space, which includes smartphones, tablets, and consumer devices. In this market, you must support different standards, the device must be really fast, it must have Internet access, and all this must be done at lower power so the that it does not drain the battery. We’re also seeing interest for advanced nodes in other segments such as computing and graphics processors.”
When speaking of advanced nodes, let’s also try and find out what Cadence is doing in helping achieve 10X faster power integrity analysis and signoff.
Cadence Voltus IC power integrity Solution is a full-chip, cell-level power signoff tool that provides accurate, fast, and high-capacity analysis and optimization technologies to designers for debugging, verifying, and fixing IC chip power consumption, IR drop, and electromigration (EM) constraints and violations.
The Voltus solution includes innovative technologies such as massively parallel execution, hierarchical architecture, and physically aware power grid analysis and optimization. Beneficial as a standalone power signoff tool, Voltus IC Power Integrity Solution delivers even more significant productivity gains when used in a highly integrated flow with other key Cadence products, providing the industry’s fastest design closure technology.
Developed with advanced algorithms and a new power integrity analysis engine with massively parallel execution, Voltus IC Power Integrity solution:
* Performs 10X faster than other solutions on the market.
* Supports very large designs—up to one billion instances—with its hierarchical architecture.
* Delivers SPICE-level accuracy.
* Enhances physical implementation quality via physically aware power integrity optimization.
Supported by major foundries and intellectual property (IP) providers, Voltus IC Power Integrity Solution has been validated and certified on advanced nodes processes such as 16nm FinFET and included in reference design flows such as for 3D-IC technology. Backed by Cadence’s rigorous quality control and product release procedures, the Voltus solution delivers best-in-class signoff quality on accuracy and stability for all process nodes and design technologies.
FinFETs to 20nm – are folks benefiting?
It is common news that FinFETs have gone to 20nm and perhaps, lower. Therefore, are those folks looking for power reduction now benefiting?
Ahuja replied that FinFETs allow semiconductor and systems companies to continue to develop commercially viable chips for the mobile devices that are dominating the consumer market. FinFETs enable new generations of high-density, high-performance, and ultra-low-power systems on chip (SoCs) for future smart phones, tablets, and other advanced mobile devices. Anyone who adopts FinFET technology will reap the benefits.
Foundry support for FinFETs will begin at 16nm and 14nm. In April of this year, Cadence announced a collaboration with ARM to implement the industry’s first ARM Cortex-A57 processor on TSMC’s 16nm FinFET manufacturing process. At ARM TechCon 2012, Cadence announced a 14nm test chip tapeout using an ARM Cortex-M0 processor and IBM’s FinFET process technology.
Some time ago, Cadence Design Systems Inc. had announced the EDA360 vision! As per Jaswinder Ahuja, corporate VP and MD of Cadence Design Systems India, the Cadence vision of EDA360 is said to be well and alive. The organization has been aligned around the EDA360 vision.
The EDA360 is a five-year vision for defining the trends in the EDA industry, based on what Cadence is observing in the industry and the direction in which, it feels, the industry will go.
At Cadence, the Silicon Realization Group is headed by Dr. Chi-ping Hsu. The SoC Realization Group is headed by Martin Lund, and Nimish Modi is looking after the System Realization Group. Cadence’s focus has been on in-house development and innovation. Tempus has been a major announcement from the Silicon Realization Group.
What’s going on with EDA360?
There has been a renewed thrust in the SoC Realization Group at Cadence. Already, there have been three acquisitions this year — Cosmic Circuits, Tensilica and Evatronix. Cadence is buying the IP part of the business from Evatronix. This acquisition is ongoing and will be announced in June 2013.
On the relationship between the electronics and the EDA industries, Ahuja said the electronics industry is going through a transition, and that the EDA industry needs to change. The importance of system-level design has increased. Companies are currently focusing on optimizing the end user experience.
According to Prof. Yi Cui, Dept. of Materials, Science & Engineering, Stanford University, nanometer is an enabling technology. We can do applications such as electronics, energy, environment and health. Some examples are high energy batteries, printed energy storage devices on paper, textile and sponge, etc. He was delivering the inaugural address at the Globalpress Electronics Summit 2013, being held in Santa Cruz, USA.
High energy battery has portable and stationary applications. In portable, energy density, cost and safety are important. In stationary, cost, power, energy efficiency and ultra-long life are important. The standard is 500 cycles at 80 percent. One of the challenges of silicon anodes is that Si has 4200 mAh/g of silicon, 10 times more than carbon.
Nanowires can offer shorter distance for Li diffusion (high power), good strain release and interface control (for better cycle life), and continuous electron transport pathway (high power). In-situ transmission electron microscopy (TEM). Double walled hollow structure provides stable solid electrolyte interphase (SEI). The outer surface is static. Amprius, where Prof. Cui is CTO, is a $6 million US government funded enterprise. Amprius China started in Nanjing, in April 2012.
Another example is printed energy storage devices on paper, textile and sponge. For low-cost scaffold, paper, textile and sponge, are used. There is cellulose paper and synthetic textile, besides sponge, as well.
There can be transparent batteries. It is actually very hard to develop those. The challenges for making a transparent battery are Al film, cathode, electrolyte, etc. An idea: dimension smaller than eye’s detection limit (50-100 um). Also, grids are well aligned.
Transparent conducting electrodes provide electrical and allow light to pass through. Apps include solar cells, etc. Indium tin oxide (ITO) has a low abundance of indium, brittleness when bent, and sputtering at high cost. Electrospinning of nanofibers is done for transparent electrodes. An example is the trough-shaped nanowires.
Yet another example is the water nanofilters for killing pathogens. The processes available for killing bacteria include chemical disinfection, UV disinfection, boiling, etc.
The first generation product is currently ready at Amprius. Amprius licensed the IP from Stanford. Stanford is also an investor in Amprius.
SiC is implemented in several power systems and is gaining momentum and credibility.
Yole Developpement stays convinced that the most pertinent market for SiC lands in high and very high voltage (more than 1.2kV), where applications are less cost-driven and where few incumbent technologies can’t compete in performance. This transition is on its way as several device/module makers have already planned such products at short term.
Even though EV/HEV skips SiC, the industry could expand among other apps. The only question remains: Is there enough business to make so many contenders live decently? Probably, yes, as green-techs are expanding fast, strongly requesting SiC. Newcomers should carefully manage strategy and properly size capex according to the market size.
Power electronics industry outlook
Electronics systems were worth $122 billion in 2012, and will likely grow to $144 billion by 2020 at a CAGR of 1.9 percent. Power inverters will grow from $41 billion in 2012 to over $70 billion by 2020 at a CAGR of 7.2 percent. Semiconductor power devices (discretes and modules) will grow from $12.5 billion in 2012 to $21.9 billion by 2020 at a CAGR of 7.9 percent. Power wafers will grow $912 million in 2012 to $1.3 billion by 2020 at a CAGR of 5.6 percent.
Looking at the power electronics market in 2012 by application and the main expectations to 2015, computer and office will account for 25 percent, industry and energy 24 percent, consumer electronics 18 percent, automotive and transport 17 percent, telecom 7 percent and others 9 percent.
The main trends expected for 2013-2015 are:
* Significant increase of automotive sector following EV and HEV ramp-up.
* Renewable energies and smart-grid implementation will drive industry sector ramp-up.
* Steady erosion of consumer segment due to pressure on price (however, volumes (units) will keep on increase).
The 2011 power devices sales by region reveals that overall, Asia is still the landing-field for more than 65 percent of power products. Most of the integrators are located in China, Japan or Korea. Europe is very dynamic as well with top players in traction, grid, PV inverter, motor control, etc. Asia leads with 39 percent, followed by Japan with 27 percent, Europe with 21 percent and North America with 13 percent.
The 2011 revenues by company/headquarter locations reveals that the big-names of the power electronics industry are historically from Japan. Nine companies of the top-20 are Japanese. There are very few power manufacturers in Asia except in Japan. Europe and US are sharing four of the top five companies. Japan leads with 42 percent, followed by Europe and North America with 28 percent each, respectively, and Asia with 2 percent.
Looking at the TAM comparison for SiC (and GaN), very high voltage, high voltage of 2kV and medium voltage of 1.2kV appear as a more comfortable area for SiC. The apps are less cost-driven and SiC added value is obvious. Low voltage from 0-900V is providing strong competition with traditional silicon technologies, SJ MOSFET and GaN. There are cost-driven apps.
Here are highlights of the Union budget 2013-14 presented by P. Chidambaram, union Finance minister, Government of India. Also, is there finally, some hope for the Indian semiconductor industry?
* Doing business with India should be easy, friendly and helpful.
* Foreign investments must be encouraged.
* Accelerating growth is the main goal.
* Need to encourage FDI in consonance with economic priorities.
* To target $1 trillion in infrastructure in the 12th plan.
* There are incentives for semiconductor wafer fab manufacturing.
* There will be appropriate incentives for the semiconductors industry, including zero customs duty on plants and machineries.
* To increase allocation for science and atomic departments.
* Indian Institute of BioTechnology to be set up at Ranchi.
* Non-conventional wind energy sector needs help.
* Will encourage cities to take up waste-energy projects through PPPs.
* Plan being developed for Chennai-Bangalore industrial corridor.
* Preparatory work started for Bengalooru-Mumbai Industrial Corridor.
* To launch two new industrial cities in Gujarat and Maharashtra.
* Propose to continue with the Technology Upgradation funds scheme for the textile sector.
* India’s first women’s public sector bank to be set up.
* Woman’s bank license to be in place by October, 2013.
* All PSU banks branches to have ATMs by March, 2014.
* Zero customs duty for electrical plants and machinery proposed.
* Higher customs duty on set-top boxes.
* To provide more than Rs 4200 crore for medical studies.
* To allocate Rs 1106 crore for alternative medicine industry.
* To allocate 100 crores to AMU, BHU, TISS-Guwahati and INTACH.
* Government to set up National Institute of Sports Coaches in Patiala.
* To expand private FM radio to 294 cities.
* To auction 839 licenses for FM network to cover all India.
* Government to construct power transmission system from Srinagar to Leh at the cost of Rs 1,840 crore, Rs 226 crore provided in current budget.
* Mobile phones priced more than Rs. 2,000 will see duty raised by 6 percent.
* Extend tax benefit to electrical vehicles.
* A company investing Rs 100 crore or more in plant and machinery in April 1, 2013 to March 31, 2015 will be allowed 15 percent investment deduction allowance apart from depreciation.
* SEBI to simplify KYC norms governing foreign investors.
* SEBI will simplify procedures for entry of foreign portfolio investors to invest in India.
* Higher outlay on waste management.
* Government to monitor cost of doing business in India.
* Zero customs duty proposed for electrical plants and machinery.
* Proposal to provide Rs. 800 crore for the Ministry of New & Renewable Energy for generation-based incentive for wind energy projects as the non-conventional wind energy sector deserves incentives.
* Government will provide low interest bearing funds from the National Clean Energy Fund (NCEF) to IREDA to on-lend to viable renewable energy projects. The scheme will have a life span of five years.
* Proposal to set apart Rs. 2,000 crore and asked the National Innovation Council to formulate a scheme for the management and application of the fund.
Coming to semiconductors, the world today is discussing the viability of 450mm fabs. I am well aware that Malcolm Penn has been pushing for 450mm fabs across Europe. I believe that one such fab will cost in the excess of $25 billion, if not more. So, who will invest that kind of money in India? Do we have clean water and 24-hour electricity supply in any state that’s required for such a fab? What will this so-called 450mm fab manufacture? Does the fab have a blueprint in place? Well, have we even addressed any of these questions?
How will 2013 turn out to be for the global semiconductor industry? Will there be growth for the global EDA industry? Importantly, how will the Indian semiconductor industry perform in 2013? I asked Jaswinder Ahuja, corporate VP and MD, Cadence Design Systems India these questions.
Outlook for global semicon industry in 2013
First, how is the outlook for global semiconductor industry in 2013 going to be? Ahuja said: “The long term outlook for the semiconductor industry remains positive, with mobility and cloud computing being the key drivers. The global economy is forecast to grow around 4 percent annually through 2016, according to an April 2012 report from the International Monetary Fund (IMF).
“In its June 2012 report, Gartner predicted growth in electronics and semiconductor industries to outpace that of the world GDP growth, at 5½ percent annually to approach $2 trillion for electronics and 6 percent annually for semiconductors through 2016. So, the semiconductor industry outlook remains very positive overall.
“In the near term, multiple challenges will need to be weathered with respect to the global economic climate, especially in European markets. The JP Morgan/GSA Semiconductor Index of Leading Indicators points to a soft semiconductor industry in 2013. However, there are lot of new products in the mobile and tablet space that are driving demand, such as the iPhone 5, Microsoft Surface, and Samsung Galaxy S III.
“The China semiconductor space is emerging as a key market for semiconductor company revenue, and forecasts predict that it will show rapid annual growth rate. The consolidation and M&A activities that we are seeing in the global semiconductor industry also indicate a positive outlook for the upcoming year.
“In India as well, the semiconductor industry will continue to see growth. The injection of funds and other support outlined in the National Policy on Electronics will provide an impetus to home-grown design and manufacturing, which should start gaining traction in 2013.”
Five trends for 2013
What would be the three or five trends likely to be visible in 2013? Ahuja said Cadence sees five big trends that will drive growth in the near and long term. These are: mobility, application driven design, video, cloud and security.
Probably, the most pervasive change in electronics recently has been mobility. When we talk about mobility, it’s just not about smart phones or tablets, but any kind of device which is mobile. Within the mobile space, software applications help system manufacturers and vendors differentiate themselves and stand apart from the competition. The need to have apps on all kinds of devices is driving rapid growth, as well as placing new demands on EDA companies.
The entertainment industry will be the key driver for video, and as the year progresses, we will continue to see more and more products and solutions introduced to tap into the demand. For the semiconductor industry, video will drive growth both in the end consumer market (mobile platforms) and the enterprise space (networking industry).
In many ways, the backbone to mobility is the cloud. With its network servers and infrastructure, the cloud is what delivers much of the content and value to all of those mobile devices. Statistics show that we need one server for every 600 smart phones and one for every 120 tablets. So there is a big need for data centers which can provide support for all the computing and back-end operations.
Security of data in mobile devices and the cloud will continue to be a challenge in the near future. There will be renewed calls to develop products that can protect critical infrastructure and sensitive information from security breaches.
Thanks to Riyanka Khanna at Text100, New Delhi, I managed to get into conversation with Bipin Kumar Amin, principle consultant, Borderless Networks – Security, Cisco. I started by asking him about the security challenges currently faced by enterprises.
Security challenges faced by enterprises
He said: “Indian network security market is growing consistently as organizations increasingly realize the importance of securing their data against external and internal threats. The advent of 3G in India has opened up new roads for technologies and applications owing to the greater bandwidth available, as well as faster data transfer. As data becomes more pervasive, privacy and security becomes the important concerns for the enterprises. Consequently, there has been no let-down in IT security spending because CIOs realize that without ensuring the security of their vital data, it’s not possible to expand business.
“The traditional network and physical perimeter is no longer the only border where information must be defended. Collaboration, IT consumerization, mobility, and new computing technologies are increasing productivity while presenting new security requirements.
“BYOD is a new phenomenon, which every enterprise is witnessing and has to deal with the management and security the data on mobile devices, whether they are owned by an enterprise or user. There is greater pressure on IT to meet the demands of a dynamic workforce-both in terms of service delivery and security challenges. New solutions are needed to protect borderless networks and to help further improve business efficiencies in the mean time.”
As for the trends in security, he added: “There are three major trends sweeping through the enterprise: rapid rise of the consumerized endpoint, onset of virtualization and cloud computing, and c) growing use of high-definition video conferencing. Each one of these critical technologies is transforming business—and forcing a fundamental shift in how security is developed and deployed.”
Borderless network architecture
So, the obvious question: what is borderless network architecture? How is Cisco’s borderless networks architecture enabling enterprises to overcome security challenges?
Amin said: “The challenges CIOs face today, from a business or technology perspective, is very different from what their predecessors have faced. Technologies such as collaboration, cloud computing, and web applications promote productivity for an increasingly distributed workforce. These technologies need to be employed within an organization to provide employees with the flexibility that they have come to expect. However they pose new security challenges for CIOs. Cisco Secure Borderless Networks promote workforce-enabling technologies while protecting company data, resources, and staff.” Read more…
This is a continuation of my coverage of the fortunes of the global semiconductor industry. I would like to acknowledge and thank Mike Cowan, an independent semiconductor analyst and developer of the Cowan LRA model, who has provided me the latest numbers.
June 2011’s “actual” global semiconductor sales number is scheduled to be released by the WSTS, via its monthly HBR (Historical Billings Report), on or about Friday, August 5th. The monthly HBR is posted by the WSTS on its website.
In advance of the upcoming June sales release by the WSTS, Mike Cowan will detail an analysis capability using the Cowan LRA forecasting model to project worldwide semiconductor sales for 2011; namely, the ability to provide a “look ahead” scenario for year 2011’s sales forecast range as a function of next month’s (in this case June’s) “actual” global semiconductor sales estimate.
The output of this “look ahead” modeling capability is captured in the scenario analysis matrix displayed in the table below. The details of these forecast results are also summarized in the paragraphs immediately following the table.
In order to facilitate the determination of these “look ahead” forecast numbers, an extended range in possible June 2011’s “actual” sales is selected a-priori; in this particular scenario analysis, a June 2011 sales range from a low of $27.935 billion to a high of $30.935 billion, in increments of $0.250 billion, was chosen as listed in the first column of the table.
This estimated range in possible “actual” sales numbers is “centered around” a projected June sales forecast estimate of $29.435 billion as gleamed from last month’s Cowan LRA Model run (based upon May’s WSTS published “actual” sales number). The corresponding June 3MMA sales forecast estimate is projected to be $25.445 billion. (NOTE – assumes no, or minor. revisions in either April or May’s previously published “actual” sales numbers released last month by the WSTS).
The overall year 2011 sales forecast estimate for each one of the assumed June sales over the pre-selected range of ‘actual’ sales estimates is calculated by the model, and is shown in the second column of the table. Read more…