The SEMI/Gartner Market Symposium was held Semicon West 2014 at San Francisco, on July 7. Am grateful to Ms. Becky Tonnesen, Gartner, and Ms Agnes Cobar, SEMI, for providing me the presentations. Thanks are also due to Ms Deborah Geiger, SEMI.
Dean Freeman, research VP, Gartner, outlined the speakers:
• Sunit Rikhi, VP, Technology and Manufacturing Group, GM, Intel Custom Foundry Intel, presented on Competing in today’s Fabless Ecosystem.
• Bob Johnson, VP Research, Gartner, presented the Semiconductor Capital Spending Outlook.
• Christian Gregor Dieseldorff, director Market Research, SEMI, presented the SEMI World Fab Forecast: Analysis and Forecast for Fab Spending, Capacity and Technology.
• Sam Wang, VP Research Analyst, Gartner, presented on How Foundries will Compete in a 3D World.
• Jim Walker, VP Research, Gartner, presented on Foundry versus SATS: The Battle for 3D and Wafer Level Supremacy.
• Dr. Dan Tracy, senior director, Industry Research & Statistics, SEMI, presented on Semiconductor Materials Market Outlook.
Let’s start with Sunit Rikhi at Intel.
As a new player in the fabless eco-system, Intel focuses on:
* The value it brings to the table.
* How it delivers on platforms of capability and services.
* How it leverage the advantages of being inside the world’s leading Integrated Device Manufacturer (IDM)
* How it face the challenges of being inside the world’s leading IDM.
Intel has leadership in silicon technologies. Transistor performance per watt is the critical enabler for all. Density improvements offset wafer cost trends. Intel currently has ~3.5-year lead in introducing revolutionary transistor technologies.
In foundry capabilities and services platforms, Intel brings differentiated value on industry standard platforms. 22nm was started in 2011, while 14nm was started in 2013. 10nm will be starting in 2015. To date, 125 prototype designs have been processed.
Intel offers broad capability and services on industry standard platforms. It also has fuller array of co-optimized end-to-end services. As for the packaging technology, Intel has been building better products through
multi-component integration. Intel has also been starting high on the yield learning curve.
Regarding IDM challenges, such as high-mix-low-volume configuration, Intel has been doing configuration optimization in tooling and set-up. It has also been separating priority and planning process for customers. Intel has been providing an effective response for every challenge.
Some of Intel Custom Foundry announced customers include Achronix, Altera, Microsemi, Netronome, Panasonic and Tabula.
I was pointed out to a piece of news on TV, where a ruling chief minister of an Indian state apparently announced that he could make a particular state of India another Silicon Valley! Interesting!!
First, what’s the secret behind Silicon Valley? Well, I am not even qualified enough to state that! However, all I can say is: it is probably a desire to do something very different, and to make the world a better place – that’s possibly the biggest driver in all the entrepreneurs that have come to and out of Silicon Valley in the USA.
If you looked up Wikipedia, it says that the term Silicon Valley originally referred to the region’s large number of silicon chip innovators and manufacturers, but eventually, came to refer to all high-tech businesses in the area, and is now generally used as a metonym for the American high-technology sector.
So, where exactly is India’s high-tech sector? How many Indian state governments have even tried to foster such a sector? Ok, even if the state governments tried to foster, where are the entrepreneurs? Ok, an even easier one: how many school dropouts from India or even smal-time entrepreneurs have even made a foray into high-tech?
Right, so where are the silicon chip innovators from India? Sorry, I dd not even hear a word that you said? Can you speak out a little louder? It seems there are none! Rather, there has been very little to no development in India, barring the work that is done by the MNCs. Correct?
One friend told me that Bangalore is a place that can be Silicon Valley. Really? How?? With the presence of MNCs, he said! Well, Silicon Valley in the US does not have MNCs from other countries, are there? Let’s see! Some companies with bases in Silicon Valley, listed on Wikipedia, include Adobe, AMD, Apple, Applied Materials, Cisco, Facebook, Google, HP, Intel, Juniper, KLA-Tencor, LSI, Marvell, Maxim, Nvidia, SanDisk, Xilinx, etc.
Now, most of these firms have setups in Bangalore, but isn’t that part of the companies’ expansion plans? Also, I have emails and requests from a whole lot of youngsters asking me: ‘Sir, please advice me which company should I join?’ Very, very few have asked me: ‘Sir, I have this idea. Is it worth exploring?’
Let’s face the truth. We, as a nation, so far, have not been one to take up challenges and do something new. The ones who do, or are inclined to do so, are working in one of the many MNCs – either in India or overseas.
So, how many budding entrepreneurs are there in India, who are willing to take the risk and plunge into serious R&D?
It really takes a lot to even conceive a Silicon Valley. It takes people of great vision to build something of a Silicon Valley, and not the presence of MNCs.
Just look at Hsinchu, in Taiwan, or even Shenzhen, in China. Specifically, look up Shenzhen Hi-Tech Industrial Park and the Hsinchu Science Park to get some ideas.
Future Horizons hosted the 22nd Annual International Electronics Forum, in association with IDA Ireland, on Oct. 2-4, 2013, at Dublin, Blanchardstown, Ireland. The forum was titled ‘New Markets and Opportunities in the Sub-20nm Era: Business as Usual OR It’s Different This Time.” Here are excerpts from some of the sessions. Those desirous of finding out much more should contact Malcolm Penn, CEO, Future Horizons.
The global interest in graphene research has facilitated our understanding of this rather unique material. However, the transition from the laboratory to factory has hit some challenging obstacles. In this talk I will review the current state of graphene research, focusing on the techniques which allow large scale production.
I will then discuss various aspects of our research which is based on more complex structures beyond graphene. Firstly, hexagonal boron nitride can be used as a thin dielectric material where electrons can tunnel through. Secondly, graphene-boron nitride stacks can be used as tunnelling transistor devices with promising characteristics. The same devices show interesting physics, for example, negative differential conductivity can be found at higher biases. Finally, graphene stacked with thin semiconducting layers which show promising results in photodetection.
I will conclude by speculating the fields where graphene may realistically find applications and discuss the role of the National Graphene Institute in commercializing graphene.
The key challenge for future high-end computing chips is energy efficiency in addition to traditional challenges such as yield/cost, static power, data transfer. In 2020, in order to maintain at an acceptable level the overall power consumption of all the computing systems, a gain in term of power efficiency of 1000 will be required.
To reach this objective, we need to work not only at process and technology level, but to propose disruptive multi-processor SoC architecture and to make some major evolutions on software and on the development of
applications. Some key semiconductor technologies will definitely play a key role such as: low power CMOS technologies, 3D stacking, silicon photonics and embedded non-volatile memory.
To reach this goal, the involvement of semiconductor industries will be necessary and a new ecosystem has to be put in place for establishing stronger partnerships between the semiconductor industry (IDM, foundry), IP provider, EDA provider, design house, systems and software industries.
This presentation looks at the development of the semiconductor and electronics industries from an African perspective, both globally and in Africa. Understanding the challenges that are associated with the wide scale adoption of new electronics in the African continent.
Electronics have taken over the world, and it is unthinkable in today’s modern life to operate without utilising some form of electronics on a daily basis. Similarly, in Africa the development and adoption of electronics and utilisation of semiconductors have grown exponentially. This growth on the African continent was due to the rapid uptake of mobile communications. However, this has placed in stark relief the challenges facing increased adoption of electronics in Africa, namely power consumption.
This background is central to the thesis that the industry needs to look at addressing the twin challenges of low powered and low cost devices. In Africa there are limits to the ability to frequently and consistently charge or keep electronics connected to a reliable electricity grid. Therefore, the current advances in electronics has resulted in the power industry being the biggest beneficiary of the growth in the adoption of electronics.
What needs to be done is for the industry to support and foster research on this subject in Africa, working as a global community. The challenge is creating electronics that meet these cost and power challenges. Importantly, the solution needs to be driven by the semiconductor industry not the power industry. Focus is to be placed on operating in an off-grid environment and building sustainable solutions to the continued challenge of the absence of reliable and available power.
It is my contention that Africa, as it has done with the mobile communications industry and adoption of LED lighting, will leapfrog in terms of developing and adopting low powered and cost effective electronics.
Personalized, preventive, predictive and participatory healthcare is on the horizon. Many nano-electronics research groups have entered the quest for more efficient health care in their mission statement. Electronic systems are proposed to assist in ambulatory monitoring of socalled ‘markers’ for wellness and health.
New life science tools deliver the prospect of personal diagnostics and therapy in e.g., the cardiac, neurological and oncology field. Early diagnose, detailed and fast screening technology and companioning devices to deliver the evidence of therapy effectiveness could indeed stir a – desperately needed – healthcare revolution. This talk addresses the exciting trends in ‘PPPP’ health care and relates them to an innovation roadmap in process technology, electronic circuits and system concepts.
The other day, I was engaged in an interesting discussion regarding the Indian semiconductor industry. The obvious question: can fabless semiconductor take India to the top?
Well, it all depends on the definition of ‘top’! Does it mean the role of India-based semiconductor companies as a percentage of the semiconductor market globally? Or, do we take India as a system/gadget maker and thus, as a percentage of that market??
Fabrication is increasingly expensive, much involved and the actual global fabrication players (i.e. those who (also) own a fabrication plant) are declining and will be about three to four companies, and about 10, if we include all off those Chinese fabs.
And, India continues to slip back in having a ((proper) fab!
Now, India’s contributions to global electronics and semiconductors will continue to increase as the MNC subsidiary companies’ hub, and not quite as India-based companies, who are coming out with something that will shake the world in terms of that chip(s)!
If India has domestically consuming gadgets, that are more India specific, that could need devices available less outside. For that purpose alone, a local fab could be essential. However, such requirements appear less each day!
So, yes! Fabless semiconductor could be the way forward for India, in terms of contribution to its economy. However, in terms of India becoming a global player through such chips conceptualized in India, for India and the world, the chance is lesser, for now!
Well, hasn’t the Indian semiconductor industry been shouting ‘fabless’ from the rooftops for some years now? Let us see how India has progressed so far!
One, in terms of having local fab, the answer is NO! Two, in terms of increasing its percentage of contribution to global semiconductors, electronics from India, YES, an increasing role and value (though these are embedded software too).
In terms of having India-based companies working toward developing chips, YES again, in terms of smaller, analog, components that are crucial (like Cosmic Circuits), and YES, in terms of having IP-based companies (like Innovative Logic India for USB3.0) and, YES in terms of increasing service companies.
Many more companies are coming up, and some started directly here in India, such as Apsconnect, Techvulcan, etc. In terms of the actual solutions, YES again, as we have developed solutions in medical, automation, etc.
However, the answer to the question remains NO in terms of having chips come out of India, as yet!
Now, what happens to the fab-lite strategy? Well, it continues, globally. From an India perspective, it is actually in a way, validation of the earlier belief. There is less direct importance to manufacturing from themselves, but more about the actual value add they do OR can do.
Now, given this situation, let us also look at the key growth drivers in Indian electronics, especially, since we are talking about fabless and fab-lite.
The obvious one is to develop solutions for the India market. It is likely that these can be for outside markets as well. This ability will actually make India develop solutions for global markets. Also, these are not semiconductors per se, but, (embedded) solutions based on them.
The above situation can slowly lead to a fabrication and manufacturing ecosystem in India. India should also try to position itself at the higher end of the solutions, markets, services, etc., so that its value contribution can be much more.
Friends, is there a way out of the current situation that India finds itself?
Actually, this is normal process of growth in the chosen path. India continues to think about low end, less (or no) risk options of services. There is only so much growth, revenue, profit possible in those areas unless one goes up the market.
India has not done that as it could be, as an ecosystem in all. India should focus on its own internal requirements. That could mean growth and an increasing role for India, globally, as well!
Besides manufacturing, the big issue lies in marketing of such products. A senior statesman from a leading Indian electronics firm once asked me, “How will India compete in marketing of these products compared to the Chinese or Taiwanese manufacturers, who have more than 30 years of experience in these industries?”
How one wishes that India had at least two wafer fabs by now, what with the technology nodes constantly upping their ante. Even if someone does decide to put up a fab, it will be extremely expensive and has to be cutting-edge. However, as I said, one should never give up hope!
And then, there is the Modified Special Incentive Package Scheme (M-SIPS).
The newly announced M-SIPS is long awaited and much needed. The key is to now turn this ‘gazette notification’ into implementation, by the regulators, and utilisation by the industry.
It is understandable that the government can only do so much, particularly, under the given circumstances. With that kept in mind, this is a yet another good start! Hopefully, instead of just commenting on this policy, the industry sincerely works to benefit from it by properly utilizing it.
Why just think of digitalization of TV! The number of set-top boxes required across the country will be huge! Or, think of electrification of roads all over India. The number of LEDs required are likely to be massive. These are just two examples of the many possible. The Indian electronics industry needs to move fast, and now!
Hasn’t all of this been very easy to say, difficult to manage! 😉
According to Dr. Walden (Wally) C. Rhines, chairman and CEO, Mentor Graphics Corp., while fabless startups have declined substantially in the West during the past decade, they are growing in India.
Given the time required to grow large fabless companies in the past, India should not be discouraged by current progress. India has key capabilities to stimulate growth of fabless companies, such as:
* Design services companies.
* Design engineering expertise and innovation.
* Returning entrepreneurs.
* Educational system.
Semiconductor frustrations abound! I recall a discussion in mid-2005 where an industry expert mentioned that fabless was the way forward for the Indian industry! Between then and now, fabs were supposed to come up, but they failed. Nevertheless, one must not give up hope!
As of now, there seems to be too much focus on services, multinational company dominance, perceived lack of progress, perceived lag compared to China, lack of foundry infrastructure, and no clear dominant indigenous Indian company.
Of the top 50 semiconductor companies in 2011, 12 are fabless and four are foundries. Fabless IC revenue has been growing at 17 percent CAGR since 1997 and will continue to grow. Even the fabless market has been gaining in the overall market. However, the fabless revenue is said to be highly concentrated. He added that the leading fabless companies specialize and average ~23 years since formation. Also, the VC funding for fabless semiconductor companies has been declining in the West. As for the number of fabless companies, the GSA put it at 1,200 companies, at the end of 2010.
According to Dr. Rhines, the semiconductor IP market would grow to about $3,707 million by 2015, at a CAGR of 14 percent. The leading semicon IP players specialize and average 22 years in business (similar to fabless).
Now, India is said to be among the top five semiconductor design locations worldwide (SIP + fabless + design services). Also, India is a leading source of semicon IP, accounting for 5.3 percent globally. From the looks of it, India seems to have built a foundation for a fabless future. India can well become the next great fabless incubator! Read more…
The last decade heralded a dramatic transformation in supply chain dynamics, driven by the complexity challenge of staying on the More Moore curve. On the demand side, the high cost of fabs persuaded almost all integrated device manufacturers (IDMs) to use foundries for their leading-edge wafer supply.
The ever-increasing process complexity and its negative impact on manufacturing yields forced the adoption of sophisticated foundry-specific design-for manufacturing (DFM) techniques, effectively committing new chip designs to a single foundry and process.
At the same time, the industry adopted a much more cautious lagging rather than leading demand approach to new capacity expansion, resulting in under-supply and shortages in leading-edge wafer fab capacity. To make matters worse, the traditional oxide-based planar transistor started to misbehave at the 130nm node, as manifested by low yields and higher than anticipated power dissipation, especially when the transistors were supposed to be off, with no increase in performance, heralding the introduction of new process techniques (e.g., high-k metal gates).
Even before these structural changes have been fully digested, supply chain dynamics have been further disrupted by the prospective transition to 450mm wafer processing, to extreme ultra violet (EUV) lithography, and from planar to vertical transistor design.
Since the start of the industry, adding more IC functionality while simultaneously decreasing power consumption and increasing switching speed—a technique fundamentally known as Moore’s Law—has been achieved by simply making the transistor structure smaller. This worked virtually faultlessly down to the 130nm node when quite unexpectedly things did not work as planned. Power went up, speed did not improve and process yields collapsed. Simple scaling no longer worked, and new IC design techniques were needed.
While every attempt was made to prolong the life of the classic planar transistor structure, out went the polysilicon/silicon dioxide gate; although this transition was far from plain sailing, in came high-k metal gates spanning 65nm-28nm nodes. Just as the high-k metal gate structure gained industry-wide consensus at 28nm, it too ran out of steam at the 22nm-16nm nodes, forcing the introduction of more complex vertical versus planar transistor design and making the IC design even more process-dependent (i.e., foundry-dependent). Dual foundry sourcing, already impractical for the majority of semiconductor firms, will only get worse as line widths continue to shrink. Read more…