At the recently held Semicon West 2014, Daniel P. Tracy, senior director, Industry Research and Statistics, SEMI, presented on SEMI Materials Outlook. He estimated that semiconductor materials will see unit growth of 6 percent or more. There may be low revenue growth in a large number of segments due to the pricing pressures and change in material.
For semiconductor eequipment, he estimated ~20 percent growth this year, following two years of spending decline. It is currently estimated at ~11 percent spending growth in 2015.
Overall, the year to date estimate is positive growth vs. same period 2013, for units and materials shipments, and for equipment billings.
For equipment outlook, it is pointing to ~18 percent growth in equipment for 2014. Total equipment orders are up ~17 percent year-to-date.
For wafer fab materials outlook, the silicon area monthly shipments are at an all-time high for the moment. Lithography process chemicals saw -7 percent sales decline in 2013. The 2014 outlook is downward pressure on ASPs for some chemicals. 193nm resists are approaching $600 million. ARC has been growing 5-7 percent, respectively.
For packaging materials, the Flip Chip growth drivers are a flip chip growth of ~25 percent from 2012 to 2017 in units. There are trends toward copper pillar and micro bumps for TSV. Future flip chip growth in wireless products are driven by form factor and performance. BB and AP processors are also moving to flip chip.
There has been growth in WLP shipments. Major applications for WLP are driven by mobile products such as smartphones and tablets. It should grow at a CAGR of ~11 percent in units (2012-2017).
Solder balls were $280 million market in 2013. Shipments of lead-free solder balls continues to increase. Underfillls were $208 million in 2013. It includes underfills for flip chip and packages. The increased use of underfills for CSPs and WLPs are likely to pass the drop test in high-end mobile devices.
Wafer-level dielectrics were $94 million market in 2013. Materials and structures are likely to enhance board-level reliability performance.
Die-attach materials has over a dozen suppliers. Hitachi Chemical and Henkel account for major share of total die attach market. New players are continuing to emerge in China and Korea. Stacked-die CSP package applications have been increasing. Industry acceptance of film (flow)-over-wire (FOW) and dicing die attach film (DDF) technologies are also happening.
Christian Gregor Dieseldorff, senior analyst, Industry Research & Statistics Group at SEMI, presented the SEMI World Fab Forecast at the recently held Semicon West 2014, as part of the SEMI/Gartner Market Symposium on July 7.
Scenarios of fab equipment spending over time has been 20-25 percent in 2014, and 10-15 percent in 2015. At this time, worldwide fab equipment spending is about same in 1H14 vs 2H14. As for fab construction projects, 2013 was a record year with over $9 billion.
New fabs: construction spending (front end cleanrooms only!)
2013: record year with over $9 billion.
2014: -22 percent to -27 percent (~$6.6 billion)
2015: -22 percent to -30 percent (~$5 billion +/-).
Fab equipment spending front end (new and used)
2014: 20 percent to 25 percent (~$35 billion to $36 billion) – if $35 billion, then third largest on record.
2015: 10 percent to 15 percent (~$40 billion) – if $40 billion, then largest in record.
Installed capacity for front end fabs (without discretes)
2014: 2 to 3 percent
2015: 3 to 4 percent
Future outlook beyond 2015: less than 4 percent.
SEMI World Fab Forecast report status and activity outlined that there were 1,148 front end facilities (R&D to HVM) active and future. Also,
* There are 507 companies (R&D to HVM).
* Including 249 LEDs and Opto facilities active and future.
* There are 60 future facilities starting HVM in 2014 or later.
* Major investments (construction projects and/or equipping): 202 facilities in 2014, 189 facilities in 2015.
A slow down of fab closures is expected from 2015 to 2018 for 200mm fabs and 150mm fabs.
The SEMI/Gartner Market Symposium was held Semicon West 2014 at San Francisco, on July 7. Am grateful to Ms. Becky Tonnesen, Gartner, and Ms Agnes Cobar, SEMI, for providing me the presentations. Thanks are also due to Ms Deborah Geiger, SEMI.
Dean Freeman, research VP, Gartner, outlined the speakers:
• Sunit Rikhi, VP, Technology and Manufacturing Group, GM, Intel Custom Foundry Intel, presented on Competing in today’s Fabless Ecosystem.
• Bob Johnson, VP Research, Gartner, presented the Semiconductor Capital Spending Outlook.
• Christian Gregor Dieseldorff, director Market Research, SEMI, presented the SEMI World Fab Forecast: Analysis and Forecast for Fab Spending, Capacity and Technology.
• Sam Wang, VP Research Analyst, Gartner, presented on How Foundries will Compete in a 3D World.
• Jim Walker, VP Research, Gartner, presented on Foundry versus SATS: The Battle for 3D and Wafer Level Supremacy.
• Dr. Dan Tracy, senior director, Industry Research & Statistics, SEMI, presented on Semiconductor Materials Market Outlook.
Let’s start with Sunit Rikhi at Intel.
As a new player in the fabless eco-system, Intel focuses on:
* The value it brings to the table.
* How it delivers on platforms of capability and services.
* How it leverage the advantages of being inside the world’s leading Integrated Device Manufacturer (IDM)
* How it face the challenges of being inside the world’s leading IDM.
Intel has leadership in silicon technologies. Transistor performance per watt is the critical enabler for all. Density improvements offset wafer cost trends. Intel currently has ~3.5-year lead in introducing revolutionary transistor technologies.
In foundry capabilities and services platforms, Intel brings differentiated value on industry standard platforms. 22nm was started in 2011, while 14nm was started in 2013. 10nm will be starting in 2015. To date, 125 prototype designs have been processed.
Intel offers broad capability and services on industry standard platforms. It also has fuller array of co-optimized end-to-end services. As for the packaging technology, Intel has been building better products through
multi-component integration. Intel has also been starting high on the yield learning curve.
Regarding IDM challenges, such as high-mix-low-volume configuration, Intel has been doing configuration optimization in tooling and set-up. It has also been separating priority and planning process for customers. Intel has been providing an effective response for every challenge.
Some of Intel Custom Foundry announced customers include Achronix, Altera, Microsemi, Netronome, Panasonic and Tabula.
SEMI, USA recently hosted the seminar on ‘Convergence of PV Materials, Test and Reliability: What Really Matters?
Reliability in growing PV industry
Speaking on the importance of reliability to a growing PV industry, Sarah Kurtz, principal scientist, Reliability group manager, NREL, said that confidence in long-term performance is a necessity in the PV industry. Current failure rates are low. There is need to demonstrate confidence so that failure rates will stay low. There has been exponential growth of the PV industry so far. PV is a significant fraction of new installations. It now represents a significant fraction of new electricity generating installations of all kinds.
How does one predict the lifetime of PV modules? There has been a qualification test evolution for JPL block buys. Most studies of c-Si modules show module failures are small. Internal electrical current issues often dominate.
The vast majority of installations show very low PV module failure rates (often less than 0.1 percent). There has been evidence that PV is low risk compared to other investments. To sustain the current installation rate, we need to demonstrate confidence that justifies the annual investment of $100 million or so.
Critical factors in economic viability of PV
DuPont has broad capabilities under one roof. It offers materials, solar cell design, and processes integrated with panel engineering. Speaking about Critical factors in economic viability of PV – materials matter – Conrad Burke, global marketing director, DuPont PV Solutions, said that material suppliers have a distinct advantage to view trends. The industry can expect consolidation among large PV module producers and large materials suppliers.
There is an increasing dependence on materials suppliers for processes, tech support and roadmap. There is renewed attention to long-term reliability and quality of materials in PV products.
There is a race for survival among panel producers. There are dropping prices for solar panels, and quality is getting compromised. There are reduced incentives in established markets. The market will continue to grow. Key factors that determine investment return for PV include lifetime, efficiency and cost.
When materials fail, the consequences are dire. There are failures such as encapsulant discoloration, backsheet failure, glass delamination, etc. Average defect rates in new-build modules has been increasing. Significant number of PV installations do not deliver the projected RoI. The system lifetime is as important as cost and incentives.
Solar cell power continues to improve. There have been improvements from metal pastes and processes. Performance loss impacts the RoI. The US Department of Energy hired JPL to develop 30-year PV modules. Recent cost pressures have led to the dramatic changes in module materials and a lack of transparency.
Analyzing modules from the recent service environments show performance issues. Certification does not mitigate risk. Tests do not predict the actual field performance. He showed tier-1 solar panel manufacturing problems from China, Japan and the USA. Backsheet is critical to protect solar panels. Few materials have lengthy field experience. We will continue to see drop in prices for solar panels and opening of new markets. Focus for PV module makers will remain efficiency, etc.
Ms. Fatima Toor, analyst, Lux Research, recently presented on opportunities in turbulent PV equipment market, in association with SEMI, USA.
Global PV market trends
Bankruptcies are galore. Eg. Solyndra, Abound Solar, Konarka, etc. Global trade wars are also on the rise. There are US tariffs on Chinese solar cells. There is also an EU investigation on Chinese solar panels. Then, there are Chinese investigations on US, EU and Korean polysilicon dumping. Government incentives have been lowered in the EU, but raised in Asia and Americas. Following Barack Obama’s re-election in the US, the environmentalists are again upbeat about green energy.
Global PV demand increase will be driven by Asia and Americas in the coming years. Emerging markets will grow over six times in size from 2011-2017. Crystalline Si will be the dominant installed PV technology, at least till 2017. Gap between demand and supply will close.
The Q3-12 geographical capacity distribution would be across PV value chain. China leads in polysilicon, cells and modules supply. Chinese equipment manufacturers market share has been on the rise, ramping up competition for Western equipment suppliers.
Lux Research sampled 493 PV manufacturers. Of these, 40 percent are based in the EU, 28 percent are based in China, 17 percent are in the US and 15 percent are in the Rest of the World.
Opportunities for equipment manufacturers in current market state
Cost, efficiency and price are fundamental drivers of PV industry. Innovations across the value chain will enable higher margins for PV industry. The desire for cell and module manufacturers to reduce costs and differentiate will drive opportunities for equipment manufacturers.
Crystalline Si technology: Innovations across crystalline Si value chain would enable opportunities for equipment suppliers. Fluidized bed reactor (FBR) process requires 10 lWh/kg and is a continuous process. Why is FBR only 6 percent of total polysilicon capacity today? The reasons are:
* No off-the-shelf FBR reactors are available.
* Process complexity requires that Si granules can be polluted by impurities.
* There is an opportunity for equipment manufacturers to develop off-the-shelf FBR equipment that will enable reduced production costs for polysilicon.
* GCL announced developing its FBR technology.
* Samsung Fine Chemicals and MEMC have partnered to set up FBR polysilicon production due to its lower production costs.
Monocrystalline silicon (c-Si) ingot growth using Czochralski (CZ) method is high cost and results in pseudo-square c-Si wafers. Plate seed for qc-Si ingot growth with mc-Si grains on the edges and c-Si in the middle. ReneSola has technology with wafer capacity of 2GW of which 1.6GW is qc-Si Virtus wafers and 0.4GW are c-Si wafers. ReneSola is likely to be one of the Chinese companies to survive the shakeout due to its strategy and technology.
Opportunities exist to optimize qc-Si ingot growth. Modified directional solidification (DS) furnace makers claim 90 percent c-Si and 10 percent mc-Si yields during qc-Si ingot growth. In reality, 60 percent c-Si and 40 percent mc-Si results in high wafer binning and sorting costs. This provides an opp for equipment manufacturers to improve the c-Si yield to higher than 90 percent. The Qc-Si capacity is likely to increase in the coming years as DS furnace manufacturers innovate.
TSMC unveiled its schedule for 450mm mass production at the recently held SEMICON Taiwan 2012 450mm Supply Chain Forum. Focusing on lithography as the key, Dr. C.S. Yoo, senior director of the 450mm program at TSMC, noted that IC makers and equipment suppliers should fully leverage the G450C. They need to work and innovate to make the 450mm transition a great success.
TSMC has always been in the relentless pursuit of technology innovation. It has been part of all of the computing waves that have driven the market growth. Right now, mobile computing is the leading market driver. TSMC has been helping the industry produce comprehensive, powerful mobile computing devices.
The future growth drivers and trends include mobile computing, cloud computing and smart devices. However, technical and economic challenges also lie ahead. TSMC has been pushing the lithography roadmap. 28nm is said to be the limit of conventional single-patterning lithography. TSMC has innovations to extend immersion to 20nm. The next-generation lithography (NGL) is being preferred beyond 20nm. Also, EUV and multiple-e-beam concept and feasibility has been proven. The more than 10x throughput gap requires collaborative innovation and funding.
TSMC continues to invest in R&D for transistor architecture trends. There is increasing technology complexity, as reflected by mask layers increase. The technology shrink also leads to design complexity.
There are challenges such as intrinsic wafer cost parity and uncertain technology migration ROI. TSMC’s mission is to be the trusted technology and capacity provider for the global logic IC industry for years to come. TSMC already has capacity leadership. TSMC’s total 12″ cleanroom space will equal more than 32 World Cup football fields by the end of this year..
TSMC customers’ expectations include the offer of leading-edge technology, continue to expand capacity, enable faster time to market, faster technology ramp up, faster manufacturing cycle times, and lower cost /die. To bridge the cost and productivity gap, TSMC no longer maintains cost/transistor trend by 2018 due to the slowing pace of technology shrink, and increasing technology complexity.