This is a summary by Malcolm Penn, chairman and CEO, Future Horizons. For those who wish to know more, please get in touch with me or Future Horizons.
It was all going so well at the beginning of March when January’s WSTS results were released. The oil and North African issues were being taken in their stride. Then, less than two weeks later, the earthquake and tsunami disaster struck Japan and by the close of the month, the Gaddafi Libyan regime was under western international airstrike siege.
Given the fragility of industry’s confidence since the Lehman Brothers crisis, the industry has weathered these ‘incidents’ with remarkable sanguinity, with concerns focused purely on supply not demand-side issues. In our view this underlines what we have been saying all along; the 2010 recovery and 2011 outlook were both stronger than most people thought.
The industry’s biggest problems in 2011 were always going to be supply not demand driven; the situation in Japan has simply amplified and accelerated their coming.
The chip industry took March’s one-two-three knocks with remarkable calm, hit first by the spike in oil prices following the politic unrest bordering on civil wars in North Africa, then the dreadful 11 March earthquake and Tsunami in Japan, culminating on 19 March with a multi-state coalition military intervention in Libya to implement United Nations Security Council Resolution 1973.
Last year, any of these events would probably have been enough to deal the industry a knockout blow, as with the September 2008 Lehman Brothers collapse; this time around, despite the still fragile global economic confidence, the industry seems to have taken these events in its stride.
Whilst it is far too early to quantify exactly what the industry impact will be, the oil price and North Africa situation pales into insignificance when compared with the aftermath of the earthquake and tsunami. Japan is too important a cog in the global electronics industry for its impact not to have serious global repercussions. It has also brought to a head the far deeper industry problems that we have long warned of – man-made in the corporate boardrooms – that could (should) have been avoided.
In this aspect, Japan’s disasters do have parallels with the Lehman Brothers collapse and its impact of worldwide finance; we hope that the current disruption to manufacturing worldwide from will force a rethink of how the world manages production. Read more…
One wonders what S.D. Shibulal, COO and member of the board, Infosys Technologies, was doing as the speaker for Market and business dynamics in emerging markets. Nevertheless, he was the speaker after the inauguration of the ISA Vision Summit 2011.
More later 😉
IoT gathering pace as revolution: Guru Ganesan
By 2020, there will be over 8 billion people on our planet. This will also bring tremendous innovations and challenges. ARM has been connecting intelligence at every level, said Guru Ganesan, president and MD, ARM India.
He was delivering the guest keynote at the recently held CDNLive 2014 event in Bangalore, India.
Newer apps are helping connect with the world. As per Gartner, $27 billion worth apps were downloaded in 2013. By 2020, this is estimated to rise to $80 billion.
According to Ganesan, consumer trends are driving innovation in embedded apps, including rich user interface (UI). ARM is also at the heart of wearable technologies, for example, Smart Glasses from Google. Some examples from India include Lechal from Ducere Technologies, GOQ Pi remote fitness companion, Fin+ navigation and device control gesture based device from RHLVision, and Smarty Ring that brings instant smartphone alerts to your fingers from Chennai.
So, what are the key requirements for wearables? These are video/image, audio, display, software, OS, connectivity and battery life! In 2013, over 1 billion smartphones were shipped. Further, mobile data 12 times over between now and 2018.
In medical electronics, besides humans, it has extended to keeping the cattle healthy and have intelligent agriculture with OnFarm, by using sensors. IoT as a revolution is gathering pace. As per a survey conducted by ARM, 95 percent of the users expect to be using IoT over the next three years. Common standards are being developed for interoperability. Similarly, mobility and connectivity are also happening in automotives.
Now, let’s see the development challenges for high-end embedded. Embedded applications today integrate more functions. Consequently, design and verification challenges continue to grow. Further, lot of smart devices are now generating lot of data. The question is: how are we using that data?
Ganesan added that by 2020, there will be new challenges in transportation, healthcare, energy and education. Once devices start communicating with each other, we are likely to see the evolution of a smart infrastructure.
Intersolar North America successfully concluded its seventh annual show in the heart of the United States’ largest solar market, California. More than 17,000 visitors from 74 countries visited 530 exhibitors.
The show had the latest innovations in the photovoltaic, energy storage, balance of systems, mounting and tracking systems, and solar heating and cooling market sectors.
It just shows how the USA has evolved as a leading market for solar PV over the years. One could feel USA creeping up on China! Which brings me to the other significant news.
Recently, there was news regarding the USA-China solar dispute. USA has won huge anti-dumping tariffs in the US-China solar panel trade case. A preliminary decision by the US Department of Commerce has imposed significant tariffs on Chinese solar modules in the anti-dumping portion of the case.
The decision has also closed SolarWorld’s “loophole,” which is said to have allowed Chinese module manufacturers to use Taiwanese cells in their modules, circumventing US trade duties.
Will this affect the Chinese PV module suppliers? Perhaps, not that much. Why so? China itself has a very huge domestic market for solar PV. They can continue to do well in China itself. It can also sell solar PV modules in India, as well, besides other regions in the Asia Pacific.
That brings me back to Intersolar North America 2014. Why was there such a low presence of Indian companies? The exhibitor list for the show reads only two — Lanco Solar Pvt Ltd and Vikram Solar Pvt Ltd. Where are the others?
If one looks at the Ministry for New and Renewable Energy (MNRE) website, there is a notification stating that a National Solar Mission (NSM) is being implemented to give a boost to solar power generation in the country. It has a long-term goal of adding 20,000 MWp of grid-connected solar power by 2022, to be achieved in three phases (first phase up to 2012-13, second phase from 2013 to 2017 and the third phase from 2017 to 2022).
Well, the MNRE has also put up a release stating complaints received about the non-function of the systems installed by channel partners. Without getting into details, why can’t Indian suppliers get to the ground and work up solidly? Some of the complaints are actually not even so serious. System not working. Channel partner not attending complaint! And, plant not working due to inverter (PPS) burnt down. These should be attended to quickly, unless, there is some monetary or other issue, which, at least, I am not aware of!
The CNA Corp.s Energy, Water, & Climate division released two studies earlier this week, which found that cost-effective options that power plants can use to cut water use can also help plants reduce CO2 emissions.
The first report, Capturing Synergies Between Water Conservation and Carbon Dioxide Emissions in the Power Sector, focuses on strategy recommendations based on analyses of water use and CO2 emissions in four case studies, which are detailed in the second report, A Clash of Competing Necessities: Water Adequacy and Electric Reliability in China, India, France, and Texas.
CNA’s Energy, Water, & Climate division released two studies, which found that cost-effective options that power plants can use to cut water use can also help plants reduce CO2 emissions.
“It’s a very important issue,” said lead study author Paul Faeth, director of Energy, Water, & Climate at CNA. “Water used to cool power plants is the largest source of water withdrawals in the United States and France, and a large source in China and India.”
“The recommendations in these reports can serve as a starting point for leaders in these countries, and for leaders around the world, to take the steps needed to ensure the reliability of current generating plants and begin planning for how to meet future demands for electric power.”
India needs to learn from the Intersolar North America show. It also needs to look carefully at CNA’s reports. It is always great and good work that attracts global attention. India has all of the requred capabilities to do so!
The mass adoption of GaN on Si technology for LED applications remains uncertain. Opinions regarding the chance of success for LED-On-Si vary widely in the LED industry from unconditional enthusiasm to unjustified skepticism. Although significant improvements have been achieved, there are still some technology hurdles (such as performance, yields, CMOS compatibility, etc.).
The differential in substrate cost itself is not enough to justify the transition to GaN on Si technology. The main driver lies in the ability to manufacture in existing, depreciated CMOS fabs in 6” or 8”. For Yole Développement, if technology hurdles are cleared, GaN-on-Si LEDs will be adopted by some LED makers, but it will not become an industry standard.
Yole is more optimistic about the adoption of GaN on Si technology for power GaN devices. Contrary to LED industry, where GaN on Sapphire technology is the main stream and presents a challenging target, GaN on Si will dominate the GaN based power electronics applications. Although the GaN based devices remain more expensive than Si based devices, the overall cost of GaN device for some applications are expected to be lower three years from now according to some manufacturers.
In 2020, GaN could reach more than 7 percent of the overall power device market and GaN on Si will capture more than 1.5 percent of the overall power substrate volume, representing more than 50 percent of the overall GaN on Si wafer volume, subjecting to the hypothesis that the 600 V devices would take off in 2014-2015.
GaN targets a $15 billion served available device market. GaN can power 4 families of devices and related applications. These are blue and green laser diodes, LEDs, power electronics and RF (see image).
Regarding GaN-on-Si LED, there will be no more than 5 percent penetration by 2020. As for GaN-on-GaN, it will be less than 2 percent. Yole considers that the leading proponents of LED-On-Si will successful and eventually adopt Si for all their manufacturing. Those include Bridgelux/Toshiba, Lattice Power, TSMC and Samsung. It expects that Silicon will capture 4.4 percent of LED manufacturing by 2020.
GaN wafer could break through the $2000 per 4” wafer barrier by 2017 or 2018, enabling limited adoption in applications that require high lumen output other small surfaces.
Renesas Electronics recently opened its India subsidiary in Bangalore. Elaborating, Sunil Dhar, managing director of Renesas Electronics India said: “We are glad to announce the opening of Renesas Electronics India Pvt Ltd, a wholly-owned subsidiary of Renesas Electronics Singapore Pte Ltd., located in Bangalore.
“Since 2010, Renesas has been providing technical product support to its customers here via branch offices in Bangalore, Delhi and Mumbai. As part of its expansion plan, Renesas will turn our said branches into a full subsidiary.
“The branch office setup served us well when the organization was small and its role was limited. In order to expand further in terms of opening more offices in India for close customer support, and to be able to provide wider services to customers in India like reference software, hardware, reference solutions which would be developed in India, it would require us to have a permanent establishment here.
“Through this new company, we aim to expand business by providing the best solution offerings and technical support as well as a regional systems solution development expertise to the Indian market.”
How does the India R&D team play a role in global innovation and where do you see Renesas Electronics in India five years from now?
He said that over 50 percent of the Renesas India team is application development or field engineers armed with knowledge of embedded hardware and software development and support.
In order to expand the footprint in Indian markets, Renesas plans to build up a strong application engineering team. India Application engineering team will engage with the Renesas headquarters, regional offices to develop new products and solutions dedicated for emerging countries, including India.
The application engineering team and the future solution centre aim to survey the market for solution needs, prepare India designed solutions fitting the price points and specifications points as required in the Indian market. Along with the customers, the team also intends to collaborate with the design houses to create innovative solutions addressing upcoming needs of the market. Our goal is to become the most trusted semiconductor solution provider in India.
What are the India-centric solutions that would be developed from the India Application Engineering team?
Dhar added that the needs of emerging markets are usually different in both specifications as well as price points. By providing dedicated local support via the new company, and with a focus on industrial and automotive applications for two- and four-wheelers, Renesas aims to increase its MCU share in India and expand its solution offerings with rich lineup of kit solutions (MCU + SoC + power devices) and platform reference boards (boards with complete ecosystem including devices and software) to provide customers a shorter time-to-market.
The team will initially focus on automotive and particularly, two-wheeler solutions. The intention is to expand the scope of the application engineering team’s activity to industrial and consumer appliances in near term.
What is the overall India employee strength? How are the investment plans looking up?
Dhar said: “In order to expand our footprint in Indian markets, we will double our headcount in near term. Currently, we are just under 30 staff and over 50 percent of us are application development or field engineers armed with the knowledge of embedded hardware and software development and support. Upon setting up the organization in Sales and Marketing roles in the initial days, we also have plans to announce the setting up of a Solutions Centre in India to develop reference application solutions to enable our customers to use our devices.
“We are intending to invest in lab, infrastructure setup and expansion of activities in the next three to five years. Additionally, we are also considering investing towards 3rd party and IDH for enlarged business engagement.”
Trends driving automotive market in India
Regarding trends driving the automotive market in India, Dhar said that Renesas focusses on three business segments – automotive, industrial and home, OA and ICT. Renesas holds more than 40 percent global market share for automotive MCU business. Our target applications for automotive segment are automotive control and automotive infotainment and network.
Renesas has dedication applications solutions for integrated cockpit through system on chip, R-car ecosystem collaboration solution for e-mobility and automotive analog and power devices for driving, steering and braking.
As semiconductor technologies evolved, it has enabled automakers to integrate multiple applications on a single chip significantly reducing the board area; thus optimizing performance and adding new features for comfort, safety and infotainment. Power technologies have brought energy efficiency, limiting power consumption in vehicles. Advancements in process technologies will continue to drive the auto industry in the coming years.
Renesas, for instance, developed the industry’s first 28nm flash memory IP for MCUs and the first semiconductor supplier to move from 40nm to 28nm process technology.
“Trends driving auto industry in India and globally are more of less the same. However, for India market, we see a specific demand for two-wheeler solutions and that is our target in coming years,” he concluded.
Lastly, I must take the opportunity to thank Ms Shweta Dhadiwal-Baid and Ms Sharmita Mandal for making this happen! 😉
STMicroelectronics recently introduced the M24SR dynamic NFC/RFID tag.
Speaking about the USP of the M24SR, Amit Sethi, Product Marketing manager – Memories and RFID, STMicroelectronics India, said: “The unique selling proposition of the M24SR product is its two interfaces, giving users and applications the ability to program or read its memory using either an RF NFC interface or a wired I2C interface, in an affordable and easy-to-use device for a wide range of applications such as consumer/home appliance, OTP card, healthcare/wellness and industrial/smart meter.”
Let us see how the M24SR is beneficial for smartphone or any other audio device.
The M24SR is a dynamic NFC/RFID tag that manages the data exchange between the NFC phone and the microcontroller. The main use cases for data exchange are updating user settings, downloading data logs, and remote programming and servicing. The dynamic tag also enables seamless Bluetooth and Wi-Fi pairing, which is useful in, for example, audio devices.
How is the M24SR different from other products of the same segment?
Sethi said that the key difference is the dual interface: the M24SR memory can be accessed either by a low-power 2C interface or
by an ISO14443A RF interface operating at 13.56MHz. It also features RF status (MCU wake-up) and RF disable functions to minimize power consumption. In addition, the devices support the NFC data exchange format (NDEF from NFC forum) and 128-bit password protection mechanism.
The M24SR series is available in EEPROM memory densities from 2 Kbit to 64 Kbit and three package types: SO8, TSSOP8, and UFDFPN8.
What are the contributions of M24SR toward the Internet of Things?
Accotding to him, the M24SR dynamic NFC/RFID tag interactive and zero power capability, simplifies complex communications setups and enables data exchange among the home automation, wearable electronics, home appliances, smart meter, wellness, etc.
Especially with the NFC capability, the M24SR is ideal for applications waiting for something, like a ticket or ID to launch an activity.
Relevance for India
Finally, what’s the relevance of the product for the Indian market?
Sethi added: “Mobile and NFC based application are gaining its popularity in India. M24SR is an easy-to-use and an affordable product for the Implementation of NFC-based applications in transportation, entertainment, and lifestyle areas.
As for the go-to-market strategy, the M24SR mass market launch is planned for end of February 2014. Some M24SR samples have been delivered to key customers during Q4 2013 and design/development is ongoing.
I had interacted with Dr. Ajoy Bose, CEO of Atrenta, some months ago. It was a pleasure to meet up with Piyush Sancheti, VP of Marketing recently. First, I asked him about the outlook for EDA in 2014.
Outlook for EDA
Piyush Sancheti said: “EDA does not look that attractive from growth point. However, you cannot do SoC designs without EDA. Right now, EDA’s focus is on implementation. The re-use of IP has been doing the rounds for many years. Drivers for SoCs are mobile and Internet of Things. The design cycle for those markets are very short – about three months. EDA business is shifting to IP re-use. The focus is now toward design aggregation.
“We will have done roughly 66 percent of business – net new — on existing customers. There is an industry shift toward doing more on the front end. EDA growth will come from IP-SoC involvement.
“Sub-20nm has challenges. ST says FT-SoI is the way to go. Complexity of process plays a big role, and the amount of chips you put in will also increase. In 14/16nm, we have an investment going on in 3D design. We are extending our 2D tool into 3D tool. We are also investing in the IP qualification. We have standardized a set of design rules in RTL. There are about 30 companies in the TSMC ecosystem.
“Our main focus is IP enablement. SoC acceptance is another key aspect. Our company focus is IP-enablement for SoCs. IP qualification ensures that it meets guidelines. Second, acceptance and making sure all IPs fit in the blocks. Third, integration. We already have this technology and it is driving the business.”
What’s Atrenta’s take on 3D design? Sancheti replied: “The industry has been slow as 3D designs are not yet to a point of business success. Focus on monolithic 3D-ICs will be a paradigm shift for the semicon industry. For mainstream commercial design, 20nm is still mainstream, but 14/16nm does not look mainstream, as of now. Process node is not necessarily a driver of innovation. EDA as an industry will remain in single digit growth.”
How will EDA move into the embedded software space?
Sancheti said: “We’ve looked into that market. But, the price point is significantly lower. Over time, it could be a strategic area for us. Over time, embedded software development and chip design will co-mingle.”
ESL is where the future of EDA lies. Still true? He added that the future of EDA is going up. It has to head toward integration of embedded software and chip development. However, ESL is not the only viable option.
Atrenta has 220 people in India, about 10 people in Bangalore and 200 in Noida. Sushil Gupta runs the India operations. It has tie-ups with IIT Delhi and IIT Kharagpur as well. Atrenta sees lot of scope for work with the Indian start-ups.
ARM calls the spirit of innovation as collective intelligence at every level. It is within devices, between people, through tech and across the world. We are still pushing boundaries of mobile devices.
Speaking at the ARM Summit in Bangalore, Dr Mark Brass, corporate VP, Operations, ARM, said that the first challenge was the number of people on the planet. Technology development and innovation also pose challenges.
According to him, mobile phones are forecast to grow 7.3 percent in 2013 driven by 1 billion smartphones. Mobile data will ramp up 12 times between now and 2018. Mobile and connectivity are creating further innovation.
August, a compamy, has introduced an electronic lock for doors, controlled by the smartphone. Another one is Proteus, which looks at healthcare. The smartphone is becoming the center of our world. All sorts of sensors are also getting into smartphones. Next, mobile and connectivity are growing in automobiles. Companies like TomTom are competing with automobile companies. Connectivity is also transforming infrastructure and data centers. They are now building off the mobile experience.
As per ARM, an IoT survey done has revealed that 76 percent of companies are dealing with IoT. As more things own information, there will be much more data. The IoT runs on ARM.
“There’s more going on than just what you think. IoT is not just about things. Skills development should not be an afterthought. Co-operation is critical. Solutions will emerge. All sorts of things are going to happen. Three years from now, only 4 percent of companies won’t have IoT in the business at all,” Dr. Brass added.
IoT will be present in industrial, especially motors, transportation, energy, and healthcare. Smart meters are coming in to help with energy management. There is a move to Big Data from Little Data.
Challenges in 2020 would be in transportation, energy, healthcare and education. ARM and the ARM partnership is addressing those. “We are delivering an unmatched diversity of solutions. We are scaling from sensors to servers, connecting our world,” Dr. Brass concluded.