The CIS and camera module value chain in 2012 was ~$6.6 billion industry, of which ~$2 billion were from design overhead, selling, general and administrative, ~$3 billion from front-end, ~$0.4 billion from optical layers, ~$1.2 billion from BE/packaging, etc., according to Paul Danini, technology and market analyst, Yole Developpment, France.
There is also the camera module assembly and test segment. This segment has the integrated camera module suppliers, and the module assembly and test houses. The CMOS image sensor (CIS) shipments by market is set for a 11 percent CAGR growth from 2012-2017.
There was a $5.8 billion market in 2011 based on an estimated value of the first level packaged device. Samsung with 19 percent was the leader in 2011 revenue share, followed by Omnivision and Sony at 17 percent each, respectively, and Canon and Aptina Imaging at 10 percent each, respectively.
Samsung saw a 200 percent growth in smartphones. Omnivision had 50 percent growth from Apple iPad and iPhone4. Sony has grown with BSI CMOS in mobile phones. Canon pioneered CMOS in DSLR. Aptina Imaging is in high-performance specialty markets, and SETi and Galaxycore are gaining significant market share in Chinese mobile phone market.
There is a two-pronged approach to revenue growth and business strategy — race to volume and market share with CAGR >15 percent, and profit enhancement strategy with single-digit growth. Low price sensors are being offered by Galaxycore, Omnivision, SETi, and so on, while the likes of Sony, Samsung, etc. are plying innovative high-end sensors (>5MP).
A look at the manufacturing environment in 2012 shows 25 different CIS players and 40 separate CMOS image sensor lines globally. The 2011 CIS wafer production by region for 2.5M 8″ eq. wspy was led by Japan at 31 percent, followed by Korea at 27 percent, Taiwan at 24 percent and Europe at 15 percent. From 2013 onward, Japan will maintain its lead while Taïwan and China will increase their share.
What’s going to happen?
So, what’s happening in the final markets? The keys to success are either Chinese and Taïwanese foundries, and simple designs or leading edge R&D such as 3D stacking, BSI, 3D imaging and high dynamic range. And, what’s the minimum requirement? It is 12-inch wafer production and backside illumination. These could be a necessity in the near future in the consumer market.
In the high-end applications, while emerging applications are boosting growth, the competition keeps getting stronger. So, what happens in the high-end market segments? There is an opportunity for CIS players that struggle in the mass consumer market, as the CCD to CMOS shift is accelerating at -16 percent CAGR of CCD sales.
The global market of medical image sensors will grow from $68 million in 2011 to $112 million in 2017, a growth of 64.7 percent. Whereas the contribution in value of the global endoscopy market represents only a few 10 percent of the medical image sensors market in 2011, 90 percent is related to x-ray applications.
These are among some of the conclusions drawn by Benjamin Roussel, technology and market analyst – MedTech, Yole Développement, France, in a seminar on how CCD, CMOS and a-Si are reshaping the global medical imaging market.
He added that image sensor innovations are reshaping the medical imaging industry as it permit the entry of news market players, the development of news products in line with both patient and physicians requirements. The medical image sensors market is currently evolving. Emerging technologies are expected to go mainstream in the future, fueled by new applications with high growth rates.
X-ray and endoscopy apps
Medical applications are vast and numerous, such as microscopy, endoscopy, x-ray based methods, MRI, ultrasound imaging and nuclear medicine. Medical image sensors are integrated into larger products — medical devices. Depending on the market the medical device aims for, the image sensors functions change. For example, while power consumption is critical for camera pill devices, for reusable endoscopes it’s temperature and humidity resistance.
The objective of the segmentation is to organize the medical image sensors market into well defined segments. Each one of those have their own drivers and set of requirements, and identify which applications present a real opportunity for micro-system technologies. X-ray image sensors price are, on average, 1,000 times larger than endoscopic image sensors.
Dynamics of image sensors
The global medical image sensor market will grow from $68 million in 2011 to $112 million in 2017. The global medical image sensors market in volume will grow from 1.4 Munits in 2011 to 4.6 Munits in 2017, fueled by emerging endoscopy products: camera pills and disposable endoscopes.
The CCD medical image sensors market dedicated to endoscopy will grow from $4 million in 2011 to $5 million in 2017. In parallel, the total CMOS medical image sensors market will continue to grow sharply from $1 million in 2011 to $3.5 million in 2017. The medical IS market for x-ray application will grow from $63 million to $103 million in 2017. The CMOS x-ray image sensors revenue will continue to grow at a 12 percent CAGR 2012-2017 and reach $44 million in 2017.
Medical image sensors technology is the gateway for new entrants in endoscopy market. CMOS camera, 3D imaging and multispectral are the three different trends that will shape the future of endoscopes. Likewise, the current move to CMOS, the move from indirect to direct conversion of x-ray (no scintillator, no fiber optic plate), and the move toward single photon detectors are the trends likely to shape the future of x-ray systems.
Yole Developpement of France recently organized a seminar on next generation MEMS. The speakers were Dr. Eric Mounier, project manager, Yole Développement, and Dr. Adrian Devasahayam, senior director, Technology, Veeco Instruments.
As performance requirements for MEMS and other devices become more stringent, the industry is encountering etch challenges that cannot be overcome with existing toolsets. The use of materials that are not readily etched reactively, combined with higher sensitivities to post etch corrosion in smaller devices, is driving a search for a more suitable etch solution for certain applications.
According to Dr. Mounier, Yole, it is estimated that until 2015, the ferroelectric thin film business will grow at rate of +7.5 percent per year with many current or new applications. In the MEMS field, these applications could be wafer level autofocus, IR sensors, RF switches, medical ultrasonic transducers. In other markets, applications would include IPD tunable capacitor, IPD hearing aids, FeRAM, optical switches, etc.
Dr. Mounier added that the ferroelectric thin films global market growth is mainly driven by two high growth rate MEMS applications until 2015, namely, IR sensors and wafer level optic autofocus. He added that many other applications are expected to emerge in 2014-2015. These would include RFMEMS and ultrasonic thin film technologies that are under development by large groups, such as IBM, Philips, Toshiba, etc. IPD high density planar capacitors with thin films are being evaluated all over the world by key companies, such as STMicroelectronics, Ipdia, On Semi, Maxim, etc.
Magnetometers using MEMS technologies are currently under development, such as at Bosch, VTT, etc.. They are likely to be integrated with accelerometers to create inertial sensing modules (combo sensors) for consumer/auto applications. Read more…
In a recent report, iSuppli predicted that driven by new demand from consumer electronics (CE) and wireless applications, the global market for microelectromechanical systems (MEMS) will expand to $8.8 billion in 2012, up from $6.1 billion in 2006.
I caught up with Jérémie Bouchaud, Director and Principal Analyst, MEMS, iSuppli Corp., to find out more about the dip in the fortunes of the mainstay products and the latest trends in the MEMS market, especially, the significance of consumer electronics applications such as motion sensors for gaming, laptops and DSCs, and mobile handsets.
Will the mainstay products for MEMS actuators, inkjet heads and DLP chips, will lose market share? Or, is it a slight dip?
Jérémie Bouchaud says that MEMS actuators, include inkjet and DLP, and also RF MEMS switches. While selling prices stay constant, MEMS inkjet heads are losing shipments at a rate of 6 percent per year over the forecast period, so the market grows only slightly at 0.4 percent CAGR from 2006-2012.
DLP shipments continue to grow, but price erosion is running at 10 percent CAGR, which means that the market is shrinking at close to 5 percent per year to 2012. RF MEMS switches are the one bright spot that helps the market for this type of MEMS device to recover slightly in 2012. RF MEMS switches will grow at 100 percent CAGR over this time to top $260 million in 2012.
The new wave is partly founded in the rapid rise of consumer electronics applications such as motion sensors for gaming, laptops and DSCs, and mobile handsets. How much share are these segments likely to garner?
According to the analyst, all types of sensors in wireless communications and consumer electronics (inertial, pressure, microphones, filters, oscillators etc) exceed $1,5 billion: or 17 percent of the total MEMS market.
“Specifically, the motion sensing opportunity, including accelerometers and gyroscopes, for consumer applications like MEMS accelerometers for mobile phones (e.g., image rotation such as in iPhone and Nokia phones), gaming (Nintendo Wii, Playstation 3), etc., and gyros (mostly digital still cameras and camcorders, gaming like Playstation 3) will grow at over 20 percent CAGR from 2006 to 2012 to exceed $680 million, about 8 percent of the total market,” he said.
iSuppli has also mentioned automotive as a key area for MEMS. What kind of growth does it see for automotive?
Bouchaud adds that automotive will grow at 8 percent CAGR to reach $2.1 billion in 2012, up from 1,3 billion in 2006. The market is largely driven by mandates for tire pressure monitoring, electronic stability control systems and reduced emissions, accelerating growth for pressure and inertial sensors.
So, will “new players have a chance to address a relatively open market”, and if yes, what would those markets be?
Bouchaud indicates that the consumer electronics market is more open than the automotive sector, which features established, long-term supply arrangements, and production cycles lasting five or more years.
CE applications are characterized by fast time-to-market and short product lifetimes. For example, mobile phones that change yearly or even more frequently, and supply agreements satisfied by fast manufacturing ramp-up and ability to meet seasonal demand spikes, and often several suppliers in the same product, (e.g. ST and ADI in Wii). As sensor specifications are more relaxed than automotive, price and footprint are most decisive.
Will there be a growth in dedicated mass production facilities then?
According to him, several large MEMS players, e.g., STMicroelectronics, Freescale and Bosch Sensortec, have or are now invested in upgrading to 8″ production facilities to meet the higher demand from the consumer sector. By 2011, at least 12 companies will operate at this larger wafer size.
“Some companies like Analog Devices are at the limit of their current capacity, due to its strong automotive sensor offering, and has recently decided to work with non-MEMS CMOS foundries like TSMC, a first in the industry. UMC will also join the MEMS community, partnering with Asian Pacific Microsystems,” he says.
And, how would the new entrants be investing in R&D? Will they be doing enough?
The analyst says that R&D rates run high in automotive (12-15 percent of MEMS revenues) and even higher in consumer (can be 15-20 percent). The high R&D rate is needed to sustain leading edge products in fast moving markets. Deep R&D pockets are needed, a luxury that is not available to all.
Elaborating a bit more on the market consolidation, he says: ” Today, the share of the MEM revenues in the hands of the top 30 MEMS companies grew at about the same rate as the market. The markets that drive growth in MEMS are consumer electronics and automotive sensors.
“The sensors will be increasingly commoditized due to extreme price pressure in both sectors, and iSuppli expects the production of MEMS devices for these two markets to be concentrated among fewer companies in the future. One facet is manufacturers attempting economies of scale by combining sales in automotive and consumer areas, e.g. at Bosch, and in future with Freescale and ST.
“Other companies are pioneers and hold a strong market position for a relatively long time. Examples are TI with DLP chips and Knowles with MEMS microphones. We also expect more M&As in the near future to exacerbate the consolidation.”
SEMICON Europa 2014 will be held at Grenoble, France, on October 7-9 October, 2014. The event will see over 400 exhibitors, which means, the exhibition area has expanded by over 40 percent vs. 2013. There will be over 70 programs featuring 300+ speakers. SEMI expects 6,000+ visitors.
A feature of the event will be the Innovation Village that will feature 35 start-ups. I have been just informed that four start-ups have cancelled. So, that leaves 31 start-ups: ActLight, Aryballe, Avalun, Bluwireless Technology, CALAO Systems, Enerstone, Euresis, Epigan, Evaderis, Exagan, Feeligreen, Genes’Ink, Grapheat, Gridbee, Heyday, Hotblock Onboard, Imagsa Technology, Irlynx, Madci, Metablue Solution, Nessos, Nocilis Materials, Noivion, PETsys Electronics, Pollen Technology, Scint-X, Sepcell, Silicon Line GmbH, Smoltek, Sol Voltaics and Wavelens.
A few start-ups are given below:
ActLight SA: It focuses in the field of CMOS photonics.
AVALUN SAS: It currently develops the LabPad®, a next – generation mobile point-of-care (POC) device.
CALAO Systems: It is the specialist of onboard connected computers.
eVaderis: It offers energy efficient, low power mixed – signal data – centric control processors.
Enerstone: It works with rechargeable battery manufacturers and integrators to improve the charge quality of their batteries.
Exagan: It is a leading supplier of Gallium Nitride based transistor devices.
Feeligreen: It provides micro – current devices for dermo – cosmetics and dermo – therapeutics.
Grapheat: It is a young startup specialized in the production and integration of monolayer high – quality of graphene on wafers and substrates for specific applications.
Gridbee Communications: It is developing Innovative long range Mesh Network solution for connected objects.
Heyday: It develops semiconductor ICs for the power conversion market.
Irlynx: It develops and commercializes infrared sensors.
Nessos Information Technologies SA: Nessos is a highly qualified software development company.
Nocilis Materials: It offers various silicon based semiconductor materials.
Noivion: It developed and patented a new thin film deposition technique named Ionized Jet Deposition (IJD).
PETsys Electronics SA: It developed new PET detectors for next generation of medical PET scanners.
Pollen Technology: It is a software company.
Scint-X: It develops and produces cutting – edge structured scintillators.
Silicon Line: A leading global provider of innovative ultra – low power optical link technology for mobile and consumer electronics markets.
Smoltek AB: It offers a proprietary conductive nano – scale carbon technology.
Wavelens: It is developing disruptive optical MEMS solutions.
On October 7, there will be a five-minute pitch for each start-up participating. It will be followed by a panel discussion: ‘Fundraising for the Future Champions of European Electronics: Strategies, Challenges and Opportunities. Day two will host the Innovation conference.
IoT gathering pace as revolution: Guru Ganesan
By 2020, there will be over 8 billion people on our planet. This will also bring tremendous innovations and challenges. ARM has been connecting intelligence at every level, said Guru Ganesan, president and MD, ARM India.
He was delivering the guest keynote at the recently held CDNLive 2014 event in Bangalore, India.
Newer apps are helping connect with the world. As per Gartner, $27 billion worth apps were downloaded in 2013. By 2020, this is estimated to rise to $80 billion.
According to Ganesan, consumer trends are driving innovation in embedded apps, including rich user interface (UI). ARM is also at the heart of wearable technologies, for example, Smart Glasses from Google. Some examples from India include Lechal from Ducere Technologies, GOQ Pi remote fitness companion, Fin+ navigation and device control gesture based device from RHLVision, and Smarty Ring that brings instant smartphone alerts to your fingers from Chennai.
So, what are the key requirements for wearables? These are video/image, audio, display, software, OS, connectivity and battery life! In 2013, over 1 billion smartphones were shipped. Further, mobile data 12 times over between now and 2018.
In medical electronics, besides humans, it has extended to keeping the cattle healthy and have intelligent agriculture with OnFarm, by using sensors. IoT as a revolution is gathering pace. As per a survey conducted by ARM, 95 percent of the users expect to be using IoT over the next three years. Common standards are being developed for interoperability. Similarly, mobility and connectivity are also happening in automotives.
Now, let’s see the development challenges for high-end embedded. Embedded applications today integrate more functions. Consequently, design and verification challenges continue to grow. Further, lot of smart devices are now generating lot of data. The question is: how are we using that data?
Ganesan added that by 2020, there will be new challenges in transportation, healthcare, energy and education. Once devices start communicating with each other, we are likely to see the evolution of a smart infrastructure.
What does the future hold for MEMS? How can the MEMS indistry stay profitable and innovative in the next five years? The MEMS market is still in a dynamic growth with an estimated 12.3 percent CAGR over 2013-2019 in $US value, growing from $11.7 billion in 2013 to $24 billion in 2019.
This growth, principally driven by a huge expansion of consumer products, is mitigated by two main factors. First, due to a fierce competition based on pricing, the ASPs are continuously decreasing.
Second, innovation is slow and incremental, as no new devices have been successfully introduced on the market since 2003. Fierce competition based on pricing in now ongoing putting thus extreme pressure on device manufacturers.
Some trends are still impacting MEMS business. These are:
* Decrease of price in consumer electronics; ASP of MEMS microphones.
* Component size is still decreasing.
However, successful companies are still large leaders in distinct MEMS categories, such as STMicroelectronics, Knowles, etc. But maintaining growth in consumer electronic applications remains a challenge.
The market for motion sensor in cell phones and tablets is large and continuously expanding. Discrete sensors still decline, but will still be used in some platforms (OIS function for gyros). Next, 6- and 9-axis combos should grow rapidly. Because of strong price pressure and high adoption rate, the total market will stabilize from 2015.
STMicroelectronics, InvenSense and Bosch are still leaders in 3-axis gyros and 6-axis IMUs. It seems difficult for new players to compete and be profitable in this market. The automotive, industrial and medical applications of MEMS are driving growth of MEMS business. MEMS for automotive will grow from $2.6 billion in 2012 to $3.6 billion in 2018 with 5 percent CAGR.
MEMS industry is big and growing. Strong market pull observed for sensors and actuators in cell phones, automotive, medical, industrial.
• Not limited to few devices. A new wave of MEMS is coming!
• Component and die size are still being optimized while combo approaches become mainstream. And several disruptive technology approaches are now in development to keep going in term of size and price decrease.
• But the MEMS industry has not solved a critical issue: how to increase the chance of new devices to enter the market?
–RF switch, autofocus, energy harvesting devices, fuel cells… are example of devices still under development after over 10 years of effort.
–How to help companies to go faster and safer on the market with new devices?
Here is the concluding part of my discussion with Sam Fuller, CTO, Analog Devices. We discussed the technology aspects of Moore’s Law and
‘More than Moore’, among other things.
Are we at the end of Moore’s Law?
First, I asked Fuller that as Gordon Moore suggested – are we about to reach the end of Moore’s Law? What will it mean for personal computing?
Fuller replied: “There is definitely still life left in Moore’s law, but we’re leaving the golden age after the wonderful ride that we have had for the last 40 years. We will continue to make chips denser, but it is becoming difficult to continue to improve the performance as well as lower the power and cost.
“Therefore, as Moore’s law goes forward, more innovation is required with each new generation. As we move from Planer CMOS to FinFET (a new technology for multi-gate architecture of transistors); from silicon to more advanced materials Moore’s law will still have life for the next decade, but we are definitely moving into its final stages.
“For personal computing, there is still a lot of innovation left before we begin to run out of ideas. There will continue to be great advances in smart phones, mobile computing and tablets because software applications are really just beginning to take advantage of the phenomenal power and capacity of today’s semiconductors. The whole concept of ‘Internet of things’ will also throw up plenty of new opportunities.
“As we put more and more sensors in our personal gadgets, in factories, in industries, in infrastructures, in hospitals, and in homes and in vehicles, it will open up a completely new set of applications. The huge amount of data generated out of these sensors and wirelessly connected to the Internet will feed into the big data and analytics. This would create a plethora of application innovations.”
What’s happening in the plane?
The plane opportunity – 90nm – 65nm – 45nm – 22nm – 20nm – 14/18nm – is starting to get difficult and probably won’t work at 12nm, for purely physics reasons. What is Analog Devices’ take on this?
Fuller said: “You are right! We have been going from 45 nm down to lower nodes, it’ll probably go down to 10 nm, but we are beginning to run into some fundamental physics issues here. After all, it’s a relatively finite number of atoms that make up the channels in these transistors. So, you’re going to have to look at innovations beyond simply going down to finer dimensions.
“There are FinFETS and other ways that can help move you into the third dimension. We’re getting to a point where we can put a lot of complexity and a number of functions on a single die. We have moved beyond purely digital design to having more analog and mixed signal components in the same chip. There are also options such as stacked dies and multiple dies.
“Beyond integration on a single chip, Analog Devices leads in advanced packaging technologies for System in a Package (SiP) where sensors, digital and analog/mixed signal components are all in a single package as the individual components would typically use different technology nodes and it might not be practical to do such integration on a single die.
“So, the challenge often gets described as “More than Moore”, which is going beyond Moore’s law, bringing those capabilities to do analog processing as well as digital and then integrating sensors for temperature sensing, pressure sensing, motion sensing and a whole range of sensors integrated for enabling the ‘Internet of Things’.
“At Analog Devices, we have the capability in analog as well as digital, and having worked for over 20 years on MEMS devices, we are particularly well positioned as we get into ‘More than Moore’.”
What are the top five trends likely to rule the semicon industry in 2014 and why? Rich Goldman, VP, corporate marketing and strategic alliances, Synopsys, had this to say.
FinFETs will be a huge trend through 2014 and beyond. Semiconductor companies will certainly keep us well informed as they progress through FinFET tapeouts and ultimately deliver production FinFET processes.
They will tout the power and speed advantages that their FinFET processes deliver for their customers, and those semiconductor companies early to market with FinFETs will press their advantage by driving and announcing aggressive FinFET roadmaps.
IP and subsystems
As devices grow more complex, integrating third-party IP has become mainstream. Designers recognize as a matter of course that today’s complex designs benefit greatly from integrating third-party IP in such areas as microprocessors and specialized I/Os.
The trend for re-use is beginning to expand upwards to systems of integrated, tested IP so that designers no longer need to redesign well-understood systems, such as memory, audio and sensor systems.
Internet of Things/sensors
Everybody is talking about the Internet of Things for good reason. It is happening, and 2014 will be a year of huge growth for connected things. Sensors will emerge as a big enabler of the Internet of Things, as they connect our real world to computation.
Beyond the mobile juggernaut, new devices such as Google’s (formerly Nest’s) thermostat and smoke detector will enter the market, allowing us to observe and control our surrounding environment remotely.
The mobile phone will continue to subsume and disrupt markets, such as cameras, fitness devices, satellite navigation systems and even flashlights, enabled by sensors such as touch, capacitive pattern, gyroscopic, accelerometers, compasses, altimeters, light, CO, ionization etc. Semiconductor companies positioned to serve the Internet of Things with sensor integration will do well.
Systems companies bringing IC design in-house
Large and successful systems companies wanting to differentiate their solutions are bringing IC specification and/or design in house. Previously, these companies were focused primarily on systems and solutions design and development.
Driven by a belief that they can design the best ICs for their specific needs, today’s large and successful companies such as Google, Microsoft and others are leading this trend, aided by IP reuse.
Advanced designs at both emerging and established process nodes
While leading-edge semiconductor companies drive forward on emerging process nodes such as 20nm, others are finding success by focusing on established nodes (28nm and above) that deliver required performance at reduced risk. Thus, challenging designs will emerge at both ends of the spectrum.
Part II of this discussion will look at FinFETs below 20nm and 3D ICs.