Argon Design, a leading developer of high performance software applications for manycore communications processors, launched Argon Blaster, the industry’s first flow simulation solution for generating realistic, Internet scale traffic loads and applications to test networking and security equipment.
Blaster delivers a line rate, timing accurate, flow simulation application on an affordable PCIe acceleration card for use in standard x86 platforms. This enables OEMs to cost effectively distribute a high performance simulation and traffic generation solution throughout the engineering organization. The approach significantly reduces development time and cost, while simultaneously increasing product quality.
Blaster is designed for enterprise and carrier network operators for performance testing of flow based cyber security and network analytics applications. It enables network managers to verify that these systems are designed and deployed in a manner to match expected network loads.
High performance, accuracy rule!
Elaborating on the features, Daniel Proch, director of product management, Netronome, said: “Argon Blaster is the industry’s highest-performance and most-accurate flow simulation solution, in an affordable package. Developed by Argon Design, Blaster enables a standard x86 PC with a Netronome flow processor PCIe card to generate realistic, Internet-scale traffic loads and application mixes.
“For many networking applications, the ability to classify and manage traffic flows is key to enabling the highest level of performance and scalability. Quality of Service, Load Balancing, Firewall, Intrusion Detection, Content Inspection, Data Loss Prevention and similar applications all typically require flow-aware processing capabilities and this flow-aware traffic generation solution for development and QA. Blaster is the first traffic generation tool designed specifically for flow simulation applications. With Blaster, you can emulate up to a million unique flows with accurate, consistent, per-flow rate control.”
It will be interesting to know how Blaster will help the ISVs and OEMs generate realistic, Internet-scale traffic loads and applications to test networking and security equipment.
Blaster can be installed in any modern PC running Linux. It installs as a KVM virtual machine and can be operated from within the virtual machine or externally. It replays one more multiple .pcap files and can take that traffic and emulate any type of traffic profile from that pcap(s). The user can change the # flows per pcap file, the addressing scheme (# clients and servers based on MAC and or IP address).
From this set of knobs and given a set of pcaps with appropriate application traffic to any traffic load and application mix that is desired. Organizations can then offer:
* Performance benchmarking to isolate bottlenecks.
* Stress testing with real-world loads.
* Security testing with background, application and attack traffic.
* Quality assurance with broad spectrum of application and protocols.
Let’s find out a bit more about the role played by Netronome as well as Argon Design. Proch said: “The product is an Argon branded product that is a joint development with Argon Design. Netronome provides the accelerated flow processing hardware for the solution in the form of a standard PCIe card, and Argon designed and engineered the software. Netronome will be handling sales and marketing of the product. Software and support will be handled by Argon.”
Will there be an upgrade sometime later, next year, perhaps? “Most certainly,” he continued. “Our early access customers and internal use has already developed a robust roadmap and we anticipate these features and others to be rolled out over several subsequent software releases. We also expect to have a new hardware version based on our recently announced NFP-6xxx family of flow processors when available.”
Cadence Design Systems recently introduced the latest release of Cadence Encounter RTL-to-GDSII flow for high-performance and giga-scale designs, including those at the latest technology node, 20 nanometers.
Rahul Deokar, product management director, said: “We are addressing designer challenges in – high performance design, giga-scale design and advanced node design. The first challenge is the PPA – power performance and area. Next challenge is to handle giga-scale designs with efficient turnaround time. The third key challenge is fast time-to-market on advanced 28nm/20nm design.”
With this latest release, Cadence provides the industry’s best PPA. Second, it is providing 1 billion gates on designer desktops. Third, it provides the fastest path to 20nm digital design. In the new announcement, there are three new technologies – GigaOpt + CCOpt, GigaFlex, and 20nm double patterning.
Cadence has introduced “GigaOpt” – a common optimization engine that unifies physical synthesis and optimization. GigaOpt provides designers globally optimal results across the front-end and back-end of the design flow. And that results in the benefit of the industry’s best PPA for high-performance design. GigaOpt has been designed from scratch to be multi-threaded, which makes it ultra fast and ultra scalable.
Another innovation, CCOpt, is the first and only technology in EDA to unify clock tree synthesis and physical optimization. CCOpt is now an integral part of the Encounter flow accelerating design closure with the best PPA. CCOpt facilitates:
* 10 percent improvement in design performance and total power.
* 30 percent reduction in clock power and area.
* 30 percent reduction in IR drop.
The Encounter flow now allows 1 billion gates to be enabled on the designer’s desktops. This is done with the new GigaFlex abstraction technology. It is the first and only technology in EDA that enables flexible, accurate abstraction adaptable to the flow stage. There is 10X capacity and TAT gains on 100 million+ instance designs. GigaFlex abstraction technology allows accurate, early physical modeling, concurrent top-and-block interface optimization, and concurrent hierarchical closure and late-stage ECO. Read more…
Recently, The Brattle Group came out with its report titled “The Employment Impacts of Proposed Tariffs on Chinese Manufactured Photovoltaic Cells and Modules”. Here are excerpts from the report.
At the request of the Coalition for Affordable Solar Energy (CASE), The Brattle Group has studied the employment impacts of a proposed trade restriction on Chinese-manufactured crystalline photovoltaic cells and modules.
This topic is timely, because the US Department of Commerce (DOC) is currently reviewing a petition that would lead to substantial tariffs on Chinese-produced photovoltaic cells and modules. Petitioners have requested tariffs up to 250 percent on Chinese-manufactured products in response to alleged government subsidies and below cost pricing.
In brief, we estimate that tariffs will slow the growth in domestic demand for photovoltaic systems by homeowners, commercial establishments and utilities, resulting in substantial job losses. We estimate jobs at risk under two tariff levels – 50 percent or 100 percent.
We find that a 50 percent tariff will shut the vast majority of Chinese imports out of the US market, and a 100 percent tariff will effectively block them altogether. We also estimate employment impacts accounting for two scenarios, a low scenario which assumes low demand elasticity and high supply elasticity, and a high scenario which reflects a high demand elasticity and a low supply elasticity. Read more…
As per reports on the Internet, the Government of India has said that it has no objections to companies importing low-priced Chinese solar cells, so long as the cells imported meet the prescribed quality standards!
Oh, well! This is yet another blow to the battling group of the domestic manufacturers. A week before, their plea for seeking imposition of import duty on finished solar equipment was rejected! Is this yet another admission of defeat, this time by the Indian government, at the hands of the hard-working Chinese solar PV manufacturers? Looks like it!
Now, I am not sure what has actually transpired! However, this was very much along the cards and expected! At least, I have seen all of this happen in the Indian telecom and later, electronics industries. Therefore, why should the solar PV industry be any different? Besides, it is a clear indication of the rising might of the Chinese, globally!
Get it clear: as of now, there is no country or manufacturer, that can take the gigantic risks that the Chinese industry is so used to taking, and succeeding, in the long run! Unless the other manufacturers of the world are able to take necessary risks and continue to produce products on par or better than those from China, this story will be repeated, again and again!
Whether the Jawaharlal Nehru-National Solar Mission succeeds in the long run — that remains a major question! However, the fact that remains as of now is: there is no country as strong as China, as far as solar PV is concerned, especially in manufacturing!
The Indian government’s stance is directly opposite to the USA, which has reportedly taken China to the World Trade Organisation over dumping of solar cells and panels.
In fact, today, the Coalition for American Solar Manufacturing (CASM), supported by more than 150 US employers of more than 11,000 workers, applauded an analysis by Hari Chandra Polavarapu, MD of solar and clean-technology research for brokerage firm Auriga USA, that underscores the importance of holding China accountable to international trade law.
Polavarapu’s target is China’s alleged campaign of underwriting development of massive solar manufacturing capacity – without cultivating a significant domestic market – then wielding exports of artificially low-priced product as a “battering ram” to knock down the US solar manufacturing industry.
Polavarapu contends in a series of research and analysis notes that China’s alleged actions against foreign domestic industries not only distort markets but also sap the power of competition to drive efficiency and innovation. Polavarapu characterizes China as a “state sponsor of predatory capitalism and asymmetric warfare” that “does not help in weeding out inefficient players but poisons the profit pool for everyone.”
What a contrast!
Now, I am not the judge, sitting with any decision! We, as a nation decide what is best for us!
In telecom, there are so many overseas makers, when there was room to cultivate local ones, back in the late 1990s. However, that never happened! In components, we tried our best to ‘kill’ the few local manufacturers by reducing import duty to zero. In electronics, we never did try to develop any local industry with earnest. Perhaps, the logic was: the presence of strong global players!
Lattice Semiconductor Corp. has introduced the low-cost and low-power ECP4 FPGAs. These feature 6Gbps SERDES in low cost wire-bond packages, powerful DSP blocks and hard IP-based communication engines for cost- and power-sensitive wireless, wireline, video, and computing markets.
The LatticeECP4 FPGA family features high performance, low power in low cost 65nm process, making a great FPGA family even better. Lower cost, high yield 65nm process is ideal for mid-range FPGAs. There has been an extensive use of wire-bond packaging. The FPGAs have CDR capable I/Os that lower customers’ implementation cost. The POWER sysDSP minimizes multipliers and LUTs, and enables high bandwidth in a small area. There is also a 10X area reduction by use of hardened MACO communication engines.
The ECP4 features lower power architecture. It is optimized for mid-density devices, and not based on high-density high overhead platform. Modified logic/routing power ratio helps achieve higher performance with modest dynamic power increase. It also features higher bandwidth and performance.
As it is, the FPGA boasts 10X more efficient hard MACO engines. Besides, it has 7X more DSP processing capability, 2X faster SERDES (6G), 66 percent more LUTs, 50 percent higher LVDS performance, 42 percent more memory and 33 percent higher DDR3 I/O performance.
Diamond 1.4 beta design software is available for select customers, especially those who jumpstart cost-effective platform designs. The ECP4 device samples will be available in 1H 2012, and the ECP4 production devices will be available in 2H 2012. Read more…
I’ve spent two days at electronica/productronica 2011, going on at Pragati Maidan, New Delhi. I am disappointed by the crowds or lack of crowds! This is said to be the premier show for electronics in India, isn’t it? The venue is as central as one can expect. Even then?
To start off, I missed the opening ceremony. That was followed by a panel discussion on ‘Local Mobile Phone Manufacturing-Opportunity or Challenge.’ With all due respects to the participants, it was one of the worst panel discussions I’ve ever attended! Perhaps, it was of some use to those present in the auditorium.
Later, while going around the various exhibition halls, I was asked by quite a number of friends in the electronics industry whether it was wise for them to have participated, given that the turnout had been so very low! Now, I am no one to answer that question!! However, it seems that there is very little interest left in the Indian electronics industry. It may sound pessimistic, but so it is!
The Indian telecom equipment manufacturing sector is going through a critical phase where the benefits of development of the telecom sector’s growth have not been carried over to the manufacturing domain. There is also a need to encourage indigenous R&D and creation of Indian IPR/patents. Was anything remotely close to this on display? I don’t think so!!
The IHS iSuppli held a seminar to discuss “How Big of a Threat to the Global Recovery and Key Industries Is the Disaster in Japan and the Turmoil in the Middle East and North Africa?”.
One of the participants, Dale Ford, senior VP, IHS iSuppli, presented on the “Disruptions to the electronics supply chain”, following Japan’s quake, where he pointed out that those companies close to the epicenter of the earthquake would need as much as four to six months to return to normalcy!
Ford listed equipment and building damage, infrastructure damage, electricity, water and roads, as well as workforce disruption, and safety, food and gas as the areas mainly impacted.
The time for full shipment restoration ranges from one to two months, on to four to six months for the areas impacted most, especially, equipment and building damage.
Now, it is well known that Japan plays a major role in the global electronics supply chain. Japan offers 20.8 percent of global production. It supplies 60 percent of the worldwide silicon wafers. Its TFT LCD panel capacity equals 12 percent of the world supply. It is also said to be a leader in battery technology and production.
The key component and material production facilities currently closed in Japan include:
a) Kamisu, Ibaraki, Shin-Etsu
b) Nishigo, Fukushima, Shin-Etsu
c) Utsunomiya, Tochigi, MEMC
d) Yonezawa, Yamagata, SUMCO
a) Hitachi Displays
b) Panasonic LCD
c) Tohoku Pioneer
a) Aizu Wakamatsu, Fukushima
On Semiconductor (Logic)
Fujitsu (Analog, Discrete, Memory)
Texas Instruments (Analog, Optical)
b) Atsugi, Kanagawa
Mitsumi (Analog, Logic)
c) Goshogawara, Aomori
Renesas Electronics (Logic) Read more…
STMicroelectronics has introduced the STM32L advanced ultra-low-power Cortex-M3 based MCU platform.
Built on cutting-edge proprietary process – robustness, it is part of a wide 32-bit product portfolio. The MCU platform is based on the just-enough energy concept and has an all inclusive package applications.
STM32L 32- to 128-Kbyte products are entering full production in the second half of March 2011. It is part of the industry’s largest ARM Cortex-M 32-bit microcontroller family with six STM32 families. STMicroelectronics is developing the STM32L portfolio up to 384 Kbytes of embedded memory. The STM32L is also Continua ready for its USB peripheral driver.
STM32L’s robustness has been derived from an automotive qualified process. It is all inclusive for ultra-low-power applications, and comes with hardware integrated features and software library packages. STM32L also has a ‘just-enough energy concept’, which includes undervolting, user controlled and an innovative architecture, all of this for less than 1 µA.
ST’s ultra-low-power EnergyLite platform features ST’s 130nm ultra-low-leakage process technology. It makes use of shared technology, architecture and peripherals. The company’s ultra-low-power portfolio for 2011 will be in production second half of March 2011. Many others will also be in production in the second half of April 2011. In fact, there will be over 100 part numbers from 4- to 384-Kbyte flash, and from 20 to 144 pins.
STM32L is based on ultra-low-power architecture, which is all inclusive for ultra low power applications. It also features ultra-low voltage, with power supply down to 1.8 V with BOR and also down to 1.65 V without BOR.The analog functional can be down to 1.8 V and the reprogramming capability can be down to 1.65 V.
STM32L is also flexible and secure, featuring +/- 0.5 percent internal clock accuracy when trimmed by RTC oscillator. It has up to five clock sources and has the MSI to achieve very low power consumption at seven low frequencies.
It also feattures dynamic voltage scaling in Run mode. The voltage scaling optimizes the product efficiency. User selects a mode (voltage scaling) according to external VDD supply, DMIPS performance required and maximum power consumption. It features the energy saving mode as well, down to 171 µA/DMIPS from Flash in Run mode. Read more…
This is a summary by Malcolm Penn, CEO, Future Horizons. For those who wish to know more, please get in touch with me or Future Horizons.
December’s WSTS results were as boring as they were predictable, with no serious data revisions (thankfully) and the results right where we expected. December’s year-on-year IC unit growth was 8.9 percent that, with the 3.5 percent growth (yes GROWTH) in ASPs, yielded a respectable double-digit value growthof 12.8 percent. And this, on the back of a weak Q4 memory market that saw ASPs fall 13.1 percent vs Q3-10!
The yearly growth vs 2009 weighed in at 31.8 percent, hitting $298.3 billion, just shy of the elusive $300 billion threshold. The market is right where we said it would be at our recent 2011 Forecast seminar; we reiterate our position that 2011 will be a good year for the industry. Choppy first-half waters for sure, but watch out for a whopping 2H-11 ricochet.
Connectors are up as well
It is not just semiconductors that are off to a good start. The connector industry is tight as a drum too. Orders in December 2010 were up 13.3 percent versus December 2009, with full year orders up 29.3 percent on 2009, down sequentially 11.1 percent from November 2010. The comparable data for sales was plus 18.7percent, plus 28.4 and minus 13.7 percent.
The December connector book-to-bill ratio was 1.01, unchanged from November. This industry still publishes orders and book-to-bill data by the way, unlike the chip industry which very foolishly stopped publishing this several years ago. All this in the seasonally slow first quarter of the month, yet few people believe there is a supply problem in prospect. Just as this time last year, industry denial is rampant, way beyond reasonable caution and ignoring the underlying trends.
Strong demand for mobile, server and graphics DRAM
We estimate that the worldwide growth rate for PCs in 2011 will be a healthy 10 percent, with 3.9GB the average DRAM content per box. New capacity and die shrinks are putting near-term pressure on over-supply and pricing but there are now move afoot from Elpida and others to start raising prices.
Where they can, to gain a price advantage, DRAM vendors are actively adjusting their supply in favour of mobile from commodity DRAM, given the current strong demand in the smartphone and tablet PC markets, with a 1GB per box average DRAM content.
Server demand continues to be the other star segment, not just in unit demand but in content per box as well, estimated to average around 30GB in 2011. This will drive a 50 to 60 percent increase in server DRAM demand. Finally in graphics demand for specialty DRAM is also very strong, driven by the rapid take off of3D-TV and continuing strong growth in Blue-Ray DVD.
The overall DRAM industry is thus gradually diversifying from manufacturing mainly commodity DRAM to diversified products such as mobile DRAM, serverbasis DRAM, specialty DRAM and graphic memory.DRAM vendors however are faring mixed fortunes, with Elpida and Hynix having the worst net cash positions with barely enough cash to cover their short-term debt.
The Taiwanese vendors find themselves stuck in a technology trap, unable to invest in the immersion technology needed to break through the 5*nm node, meaning that in the absence of a good market uptick to improve cash flow and profits, a shake out in the DRAM supply base seems unavoidable.
This is the concluding part of my discussion with Mike Foley, executive director, Bluetooth SIG, which looks at how the market for in-home wireless in smart energy will be developing in the years ahead, as well as the scope in wireless sensor networks (WSN).
Focus of Bluetooth Smart Energy Group
First, a bit about the focus of Bluetooth Smart Energy Group and what it has achieved so far.
The Smart Energy Study Group, includes major players like Emerson, and illustrates the Bluetooth SIG’s commitment to this market. The Study Group is working closely with other standards bodies to help define future global standards for smart energy and the products that form that ecosystem.
Foley said: “Within the next few years, your utility will start to replace your existing meters and you will be able to buy household appliances that can connect to your smart meter. The Bluetooth SIG is working with the industry to ensure that such a connection is cost effective, reliable and secure.
“Currently, Bluetooth is used around the world in smart energy applications — from simple energy monitors to complex mesh networks controlling solar arrays. With a ubiquitous presence in mobile phones, it also provides an ecosystem for controlling smart energy devices that users already own. The group has come together to make a strong case for Bluetooth in the smart energy market, and to push for next steps in this growing industry.”
Market for in-home wireless
Given this scenario, it will be interesting to survey how the market for in-home wireless in smart energy will be developing in the years ahead.
According to Foley, remote control and home automation have a bright future in the smart energy space. If Bluetooth is selected for the connectivity link to appliances, the integration of a smart ecosystem throughout the home will be significantly easier and faster. Once home appliances start to connect, they will likely also require their own wireless connections.
Zpryme Research has predicted that by 2015, 19.2 percent of washing machines, 17.4 percent of refrigerators and 17.3 percent of dryers sold in the US will include smart connections. Also, Whirlpool has publicly announced that by 2015, all of its electronically controlled appliances will be capable of receiving and responding to signals from smart grids. Read more…